T58
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Vishay
vPolyTanTM Polymer Surface Mount Chip Capacitors,
Compact, Leadframeless Molded Type
FEATURES
• Low ESR
• 100 % surge current tested
• Accelerated voltage conditioning
• High ripple current capability
• High volumetric efficiency
• Stable capacitance over operating temperature,
voltage, and frequency range
• No wear out effect
• Molded case available in 5 case codes including 0603 and
0805 footprint. The molding compound has been selected
to meet the requirements of UL 94 V-0 and outgassing
requirements of ASTM E-595
LINKS TO ADDITIONAL RESOURCES
• Lead (Pb)-free L-shaped face-down terminations
3D 3D
3D Models
Models
• 8 mm tape and reel packaging available per EIA-481
standard
Calculators
• Moisture sensitivity level 3
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Operating Temperature: -55 °C to +105 °C
APPLICATIONS
Capacitance Range: 1 μF to 330 μF
• Decoupling, smoothing, filtering
Capacitance Tolerance: ± 20 %
• Bulk energy storage in wireless cards
Voltage Rating: 6.3 VDC to 35 VDC
• Infrastructure equipment
• Storage and networking
• Computer motherboards
• Smartphones and tablets
ORDERING INFORMATION
T58
MM
106
M
6R3
C
0300
TYPE
CASE
CODE
CAPACITANCE
CAPACITANCE
TOLERANCE
DC VOLTAGE RATING
TERMINATION /
PACKAGING
ESR
See
Ratings
and
Case
Codes
table.
This is expressed in
picofarads. The first
two digits are the
significant figures.
The third is the
number of zeros
to follow.
M = ± 20 %
This is expressed in
volts. To complete the
three-digit block, zeros
precede the voltage
rating. A decimal point
is indicated by an “R”
(6R3 = 6.3 V)
C = lead (Pb)-free
solderable coating,
7" reel
Maximum
100 kHz ESR
in mΩ
Notes
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating
• We reserve the right to supply better series with more extensive screening
Revision: 05-Sep-2023
Document Number: 40189
1
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Anode Termination
W
C
P1
Cathode Termination
P2
H
P1
L
CASE CODE
EIA SIZE
H (MAX.)
L
W
P1
P2 (REF.)
C
MM
1608-09
0.035
[0.9]
0.063 ± 0.008
[1.6 ± 0.2]
0.033 ± 0.008
[0.85 ± 0.2]
0.020 ± 0.004
[0.5 ± 0.1]
0.024
[0.6]
0.024 ± 0.004
[0.6 ± 0.1]
W9
2012-09
0.035
[0.9]
0.079 ± 0.008
[2.0 ± 0.2]
0.049 ± 0.008
[1.25 ± 0.2]
0.020 ± 0.004
[0.5 ± 0.1]
0.039
[1.0]
0.035 ± 0.004
[0.9 ± 0.1]
W0
2012-10
0.039
[1.0]
0.079 ± 0.008
[2.0 ± 0.2]
0.049 ± 0.008
[1.25 ± 0.2]
0.020 ± 0.004
[0.5 ± 0.1]
0.039
[1.0]
0.035 ± 0.004
[0.9 ± 0.1]
A0
3216-10
0.039
[1.0]
0.126 ± 0.008
[3.2 ± 0.2]
0.063 ± 0.008
[1.6 ± 0.2]
0.031 ± 0.004
[0.8 ± 0.1]
0.063
[1.6]
0.047 ± 0.004
[1.2 ± 0.1]
BB
3528-20
0.079
[2.0]
0.138 ± 0.008
[3.5 ± 0.2]
0.110 ± 0.008
[2.8 ± 0.2]
0.031 ± 0.008
[0.8 ± 0.2]
0.077
[1.95]
0.094 ± 0.004
[2.4 ± 0.1]
RATINGS AND CASE CODES (ESR mΩ)
μF
6.3 V
8.2 V
10 V
16 V
25 V
1
35 V
W9 (500)
4.7
W0 (500)
10
MM (300, 500)
22
MM (300, 500) /
W9 (500)
47
W9 (200, 300)
100
A0 (200)
BB (100, 150)
W0 (300, 500)
A0 (175) (1)
BB (90, 200)
Note
(1) Rating in development: preliminary rating and electrical values. Contact factory for availability
Revision: 05-Sep-2023
Document Number: 40189
2
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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MARKING
Wx-Case
Polarity bar
Mx-Case
J
JA
+
Ax-Case
Polarity bar
+
Voltage
code
Voltage code
Polarity bar
Voltage Capacitance
code
code
Bx-Case
EIA capacitance
code (pF)
Capacitance code
Polarity
bar
J107
Voltage code
330 6
+
2
VOLTAGE CODE
Vishay
marking
CAPACITANCE CODE
V
CODE
CAP, μF
CODE
6.3
J
1
A
8.2
k
4.7
S
10
A
10
α
16
C
22
j
25
E
47
s
35
V
100
A
150
E
STANDARD RATINGS
CAPACITANCE CASE
CODE
(μF)
PART NUMBER
MAX. DF MAX. ESR
MAX. RIPPLE,
MAX. DCL
AT +25 °C AT +25 °C
100 kHz IRMS
AT +25 °C
100 kHz
120 Hz
(μA)
(A)
(mΩ)
(%)
HIGH TEMPERATURE LOAD
TEMPERATURE
(°C)
TIME
(h)
6.3 VDC AT +105 °C
10
MM
T58MM106M6R3C0500
6.3
8
500
0.224
105
2000
10
MM
T58MM106M6R3C0300
6.3
8
300
0.289
105
2000
22
MM
T58MM226M6R3C0500
14
10
500
0.224
105
2000
22
MM
T58MM226M6R3C0300
14
10
300
0.289
105
2000
22
W9
T58W9226M6R3C0500
14
10
500
0.283
105
2000
47
W9
T58W9476M6R3C0300
30
10
300
0.365
105
1000
47
W9
T58W9476M6R3C0200
30
10
200
0.447
105
1000
100
A0
T58A0107M6R3C0200
63
10
200
0.524
105
1000
8.2 VDC AT +105 °C
47
W0
T58W0476M8R2C0500
39
10
500
0.283
105
1000
47
W0
T58W0476M8R2C0300
39
10
300
0.365
105
1000
47
A0 (1)
T58A0476M010C0175
47
175
0.561
105
1000
10 VDC AT +105 °C
14
Notes
(1) Rating in development: preliminary rating and electrical values. Contact factory for availability
(2) Can be rated up to 38 V
Revision: 05-Sep-2023
Document Number: 40189
3
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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STANDARD RATINGS
CAPACITANCE CASE
CODE
(μF)
MAX. DF MAX. ESR
MAX. RIPPLE,
MAX. DCL
AT +25 °C AT +25 °C
100 kHz IRMS
AT +25 °C
100 kHz
120 Hz
(μA)
(A)
(mΩ)
(%)
PART NUMBER
HIGH TEMPERATURE LOAD
TEMPERATURE
(°C)
TIME
(h)
16 VDC AT +105 °C
47
BB
T58BB476M016C0200
75
47
BB
T58BB476M016C0090
75
14
200
0.652
105
2000
14
90
0.972
105
2000
25 VDC AT +105 °C
4.7
W0
T58W0475M025C0500
23.5
10
500
0.283
105
1000
22
BB
T58BB226M025C0150
55
14
150
0.753
105
2000
22
BB
T58BB226M025C0100
55
14
100
0.850
105
2000
500
0.283
105
2000
35 VDC AT +105 °C
1.0
W9
3.5 (2)
T58W9105M035C0500
8
Notes
Rating in development: preliminary rating and electrical values. Contact factory for availability
Can be rated up to 38 V
(1)
(2)
RECOMMENDED TEMPERATURE DERATING
Axis Title
100
10000
Rated voltage
95
Recommended maximum
application voltage VR ≤ 10 V
85
1000
80
1st line
2nd line
2nd line
Rated Voltage (%)
90
Recommended maximum
application voltage VR ≥ 16 V
75
70
100
65
60
55
10
50
-55
25
45
85
105
Temperature (°C)
RECOMMENDED VOLTAGE DERATING GUIDELINES
CAPACITOR VOLTAGE RATING
OPERATING VOLTAGE
6.3
5.7
Revision: 05-Sep-2023
8.2
7.4
10
9.0
16
12.8
25
20
35
28
Document Number: 40189
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CAPACITANCE VS. FREQUENCY
Axis Title
10000
220 μF - 10 V BB
1000
100
100 μF - 6 V A0
1st line
2nd line
2nd line
Capacitance (μF)
1000
10
100
22 μF - 6 V MM
1
0.01
0.1
1
10
100
10
10 000
1000
Frequency (kHz)
IMPEDANCE AND ESR VS. FREQUENCY
Axis Title
100
10000
1. 22 μF - 6 V MM
2. 100 μF - 6 V A0
3. 220 μF - 10 V BB
10
1000
1st line
2nd line
2nd line
Impedance / ESR (Ω)
ESR
Impedance
1
1
100
0.1
2
3
0.01
0.01
0.1
1
10
100
1000
10 000
10
100 000
Frequency (kHz)
POWER DISSIPATION
CASE CODE
MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
MM
0.025
W9 / W0
0.040
A0
0.055
BB
0.085
STANDARD PACKAGING QUANTITY
Revision: 05-Sep-2023
CASE CODE
UNITS PER 7" REEL
MM
4000
W0
3000
W9
4000
A0
3000
BB
2000
Document Number: 40189
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PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life test at +105 °C
2000 h application of rated voltage at 105 °C,
MIL-STD-202 method 108
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Within initial limits
Leakage current
Shall not exceed 300 % of initial limit
Capacitance change
-20 % to +40 % of initial value
Dissipation factor
Within initial limit
Leakage current
Shall not exceed 300 % of initial limit
Capacitance change
Within -20 % to 0 % of initial value
Dissipation factor
Shall not exceed 150 % of initial limit
Humidity tests
Stability at low and
high temperatures
At 60 °C / 90 % RH 500 h, no voltage applied
-55 °C
25 °C
105 °C
Surge voltage
Shock
(specified pulse)
85 °C, 1000 successive test cycles at 1.3 of
rated voltage in series with a 1 kΩ resistor at
the rate of 30 s ON, 30 s OFF
MIL-STD-202, method 213, condition I,
100 g peak
Leakage current
n/a
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Within initial limit
Leakage current
Within initial limit
Capacitance change
Within -50 % to +30 % of initial value
Dissipation factor
Within initial limits
Leakage current
Shall not exceed 1000 % of initial limits
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Within initial limit
Leakage current
Shall not exceed 300 % of initial limit
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Within initial limit
Leakage current
Shall not exceed 300 % of initial limit
Vibration
MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz 20 g peak
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shear test
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Within initial limit
Leakage current
Shall not exceed 300 % of initial limit
PRODUCT INFORMATION
Polymer Guide
www.vishay.com/doc?40076
Moisture Sensitivity
www.vishay.com/doc?40135
Infographic
www.vishay.com/doc?48084
Sample Board
www.vishay.com/doc?48073
FAQ
Frequently Asked Questions
Revision: 05-Sep-2023
www.vishay.com/doc?42106
Document Number: 40189
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Polymer Guide
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Vishay
Guide for Tantalum Solid Electrolyte Chip Capacitors
With Polymer Cathode
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum/tantalum oxide/manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve”metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Revision: 22-Nov-2023
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance/volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance/volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC
Air or vacuum
Paper
Plastic
Mineral oil
Silicone oil
Quartz
Glass
Porcelain
Mica
Aluminum oxide
Tantalum pentoxide
Ceramic
e
DIELECTRIC CONSTANT
1.0
2.0 to 6.0
2.1 to 6.0
2.2 to 2.3
2.7 to 2.8
3.8 to 4.4
4.8 to 8.0
5.1 to 5.9
5.4 to 8.7
8.4
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
C = eA
------t
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Document Number: 40076
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Polymer Guide
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Vishay
SOLID ELECTROLYTE POLYMER TANTALUM CAPACITORS
Solid electrolyte polymer capacitors utilize sintered tantalum pellets as anodes. Tantalum pentoxide dielectric layer is formed
on the entire surface of anode, which is further impregnated with highly conductive polymer as cathode system.
The conductive polymer layer is then coated with graphite, followed by a layer of metallic silver, which provides a conductive
surface between the capacitor element and the outer termination (lead frame or other).
Molded chip polymer tantalum capacitor encases the element in plastic resins, such as epoxy materials. The molding
compound has been selected to meet the requirements of UL 94 V-0 and outgassing requirements of ASTM E-595. After
assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability
for variety of applications in electronic devices. Usage of conductive polymer cathode system provides very low equivalent
series resistance (ESR), which makes the capacitors particularly suitable for high frequency applications.
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T50 / T51 / T55 / T56 / 04051
Epoxy encapsulation
Silver adhesive
Anode polarity bar
Solderable cathode termination
Polymer / carbon / silver coating
Solderable anode termination
Sintered tantalum pellet
Lead frame welded to Ta wire
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T58
Rating / marking
Encapsulation
Side cathode termination (-)
Anode polarity bar
Silver adhesive epoxy
Bottom cathode termination (-)
Copper pad
Side anode termination (+)
Glass reinforced epoxy resin substrate
Polymer / carbon / silver coating
Conductive strip
Sintered tantalum pellet
Anode wire
Revision: 22-Nov-2023
Bottom anode termination (+)
Document Number: 40076
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Polymer Guide
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Vishay
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T52
T52 E5 case
Encapsulation
Side cathode termination (-)
Polarity bar
marking
Silver adhesive epoxy
Bottom cathode
termination (-)
Silver plated copper substrate
Side anode termination (+)
Sintered
tantalum pellet
Conductive strip
Polymer / carbon / silver coating
Bottom anode
termination (+)
T52 M1 case
Encapsulation
Polarity bar marking
Side cathode termination (-)
Silver adhesive epoxy
Bottom cathode termination (-)
Silver plated
copper substrate
Side anode termination (+)
Sintered
tantalum pellet
Polymer / carbon / silver coating
Revision: 22-Nov-2023
Bottom anode termination (+)
Document Number: 40076
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TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T54 / T59 / 20021
Top / bottom cathode termination (-)
Encapsulation
Anode polarity marking
Side cathode termination (-)
Silver plated copper substrate
Top / bottom anode termination (+)
Silver adhesive epoxy
Conductive strip
Sintered tantalum pellet
Side anode termination (+)
Top / bottom cathode termination (-)
Polymer / carbon / silver coating
Top / bottom anode termination (+)
T54 EL case
Encapsulation
Side cathode termination (-)
Anode polarity marking
Silver adhesive epoxy
Silver plated copper substrate
Conductive strip
Top / bottom cathode termination (-)
Sintered tantalum pellet
Polymer / carbon / silver coating
Top / bottom anode termination (+)
Revision: 22-Nov-2023
Side anode termination (+)
Document Number: 40076
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HERMETICALLY SEALED TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T27
Kapton sleeve
Metal case
Anode polarity marking
Metal cover
Cathode termination (-)
Insulator
Sintered tantalum pellet
Polymer / carbon coating
Silver coating
Silver epoxy adhesive
Anode wire
Anode termination (+)
Bushing [optional]
Glass insulator
POLYMER CAPACITORS - METAL CASE, HERMETICALLY SEALED
SERIES
T27
PRODUCT IMAGE
TYPE
FEATURES
VPolyTanTM hermetically sealed polymer surface-mount
chip capacitors, low ESR
Hermetically sealed in metal case, low ESR / low DCL,
hi-rel. processing
TEMPERATURE RANGE
-55 °C to +125 °C
CAPACITANCE RANGE
15 μF to 470 μF
VOLTAGE RANGE
16 V to 75 V
CAPACITANCE TOLERANCE
± 20 %
LEAKAGE CURRENT
0.05 CV
DISSIPATION FACTOR
ESR
CASE SIZES
TERMINATION FINISH
Revision: 22-Nov-2023
12 %
25 mΩ to 100 mΩ
D
100 % tin; tin / lead
Document Number: 40076
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Vishay
POLYMER CAPACITORS - MOLDED CASE
SERIES
T50, T51, T55, T56
04051
VPolyTanTM, molded case,
high performance polymer
High performance
VPolyTanTM, molded case,
high performance polymer
High performance
-55 °C to +125 °C
(above +105 °C, voltage derating is required)
4.7 μF to 680 μF
2.5 V to 63 V
± 10 %, ± 20 %
0.1 CV
8 % to 10 %
25 mΩ to 125 mΩ
B, D
PRODUCT IMAGE
TYPE
FEATURES
TEMPERATURE RANGE
-55 °C to +105 °C / +125 °C
CAPACITANCE RANGE
VOLTAGE RANGE
CAPACITANCE TOLERANCE
LEAKAGE CURRENT
DISSIPATION FACTOR
ESR
CASE SIZES
3.3 μF to 1000 μF
2.5 V to 63 V
± 20 %
0.1 CV
8 % to 10 %
6 mΩ to 500 mΩ
J, P, A, T, B, Z, V, D, C
Cases J, P, C: 100 % tin
Case A, T, B, Z, V, D: Ni / Pd / Au
TERMINATION FINISH
All cases: tin / lead (SnPb)
POLYMER CAPACITORS - LEADFRAMELESS MOLDED CASE
SERIES
T52
T58
T59
T54
20021
vPolyTanTM polymer
surface mount
chip capacitors,
low profile,
leadframeless
molded type
vPolyTanTM polymer
surface mount chip
capacitors, compact,
leadframeless
molded type
vPolyTanTM polymer
surface mount
chip capacitors,
low ESR,
leadframeless
molded type
Low profile
Small case size
Multianode
vPolyTanTM polymer
surface mount chip
capacitors, low ESR,
leadframeless
molded type,
hi-rel commercial
off-the-shelf (COTS)
Hi-rel COTS,
multianode
TEMPERATURE
RANGE
-55 °C to +105 °C
-55 °C to +105 °C
-55 °C to +125 °C
-55 °C to +125 °C
-55 °C to +125 °C
CAPACITANCE
RANGE
47 μF to 470 μF
1 μF to 100 μF
15 μF to 470 μF
15 μF to 470 μF
(discrete capacitors)
30 μF to 2800 μF
(stacked capacitors)
15 μF to 470 μF
(discrete capacitors)
30 μF to 2800 μF
(stacked capacitors)
10 V to 35 V
6.3 V to 35 V
16 V to 75 V
16 V to 75 V
16 V to 75 V
± 20 %
± 20 %
± 10 %, ± 20 %
± 20 %
± 20 %
10 % to 12 %
10 % to 12 %
PRODUCT
IMAGE
TYPE
FEATURES
VOLTAGE
RANGE
CAPACITANCE
TOLERANCE
LEAKAGE
CURRENT
DISSIPATION
FACTOR
ESR
CASE SIZES
TERMINATION
Revision: 22-Nov-2023
vPolyTanTM polymer
surface mount chip
capacitors, low ESR,
leadframeless
molded type,
DLA approved
Multianode
0.1 CV
10 %
8 % to 14 %
10 % to 12 %
40 mΩ to 200 mΩ
90 mΩ to 500 mΩ
20 mΩ to 150 mΩ
E5, M1, M9, B2
MM, W0, W9, A0, BB
100 % tin
5 mΩ to 150 mΩ
EE, EL, E2, E3,
EE, EL
E4, E6, 3E, 6E
100 % tin; tin / lead
5 mΩ to 150 mΩ
EE, E2, E3, E4,
E6, 3E, 6E
Tin / lead
Document Number: 40076
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Polymer Guide
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Vishay
MOLDED CAPACITORS, T50 / T51 / T55 / T56 / 04051 TYPES
PLASTIC TAPE AND REEL PACKAGING DIMENSIONS in millimeters
E
A
B
C
Label
D
W
TAPE WIDTH
A+0/-3
B+1/0
C ± 0.2
D ± 0.5
E ± 0.5
W ± 0.3
8
12
Ø 180
Ø 60
Ø 13
Ø 21
2.0
9.0
13.0
Note
• A reel diameter of 330 mm is also applicable
PLASTIC TAPE SIZE DIMENSIONS in millimeters
Pocket
Perforation
E
Ø 1.5 + 0.10
W
B
F
A
P1
t
Direction of tape flow
4.0 ± 0.1
2.0 ± 0.1
Inserting direction
Perforation
Marking side (upper)
Mounting terminal side (lower)
Symbol: R
CASE CODE
J
P
A
T
B
C
Z
V
D
A ± 0.2
1.0
1.4
1.9
3.1
3.1
3.7
4.8
4.8
4.8
B ± 0.2
1.8
2.2
3.5
3.8
3.8
6.3
7.7
7.7
7.7
W ± 0.3
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
F ± 0.1
3.5
3.5
3.5
3.5
3.5
5.5
5.5
5.5
5.5
E ± 0.1
1.75
1.75
1.75
1.75
1.75
1.75
1.75
1.75
1.75
P1 ± 0.1
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
tmax.
1.3
1.6
2.5
1.7
2.5
3.1
2.6
2.6
3.4
Note
• A reel diameter of 330 mm is also applicable
Revision: 22-Nov-2023
Document Number: 40076
7
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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LEADFRAMELESS MOLDED CAPACITORS, ALL TYPES
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 ± 0.004
[4.0 ± 0.10]
Tape thickness
Deformation
between
embossments
0.014
[0.35]
max.
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Top
cover
tape
A0
K0
B1 (max.) (6)
10 pitches cumulative
tolerance on tape
± 0.008 [0.200]
Embossment
0.079 ± 0.002
0.069 ± 0.004
[2.0 ± 0.05]
[1.75 ± 0.10]
0.030 [0.75]
min. (3)
B0
0.030 [0.75]
min. (4)
Top cover
tape
For tape feeder 0.004 [0.10]
max.
reference only
including draft.
Concentric around B0 (5)
F
W
20°
Maximum
component
rotation
(Side or front sectional view)
Center lines
of cavity
P1
D1 (min.) for components
(5)
.
0.079 x 0.047 [2.0 x 1.2] and larger
USER DIRECTION
OF FEED
Maximum
cavity size (1)
Cathode (-)
Anode (+)
DIRECTION OF FEED
20° maximum
component rotation
Typical
component
cavity
center line
B0
A0
(Top view)
Typical
component
center line
3.937 [100.0]
0.039 [1.0]
max.
Tape
0.039 [1.0]
max.
0.9843 [250.0]
Camber
(Top view)
Allowable camber to be 0.039/3.937 [1/100]
Non-cumulative over 9.843 [250.0]
Tape and Reel Specifications: all case sizes are
available on plastic embossed tape per EIA-481.
Standard reel diameter is 7" [178 mm].
Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only
(1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
0
0
0
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location shall be applied independent of each other
(6) B dimension is a reference dimension tape feeder clearance only
1
Revision: 22-Nov-2023
Document Number: 40076
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Polymer Guide
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CARRIER TAPE DIMENSIONS in inches [millimeters]
CASE CODE TAPE SIZE B1 (MAX.) (1)
D1 (MIN.)
F
K0 (MAX.)
P1
P2
0.315 ± 0.004 0.079 ± 0.002
[8.0 ± 0.10]
[2.00 ± 0.05]
W
E5
12 mm
0.329 [8.35]
0.059 [1.5]
0.217 ± 0.002
[5.50 ± 0.05]
0.071 [1.8]
MM (2)
8 mm
0.075 [1.91]
0.02 [0.5]
0.138 [3.5]
0.043 [1.10]
M1, M9
12 mm
0.32 [8.2]
0.059 [1.5]
W9
8 mm
0.126 [3.20] 0.030 [0.75]
0.138 [3.5]
0.045 [1.15]
0.157 [4.0]
0.079 ± 0.002
[2.00 ± 0.05]
0.315 [8.0]
W0
8 mm
0.126 [3.20] 0.030 [0.75]
0.138 [3.5]
0.045 [1.15]
0.157 [4.0]
0.079 ± 0.002
[2.00 ± 0.05]
0.315 [8.0]
A0
8 mm
-
0.02 [0.5]
0.138 [3.5]
0.049 [1.25]
0.157 [4.0]
0.079 ± 0.002
[2.00 ± 0.05]
0.315 [8.0]
BB
8 mm
0.157 [4.0]
0.039 [1.0]
0.138 [3.5]
0.087 [2.22]
0.157 [4.0]
0.079 ± 0.002
[2.00 ± 0.05]
0.315 [8.0]
EE, EL
12 mm
0.32 [8.2]
0.059 [1.5]
B2
8 mm
0.157 [4.0]
0.039 [1.0]
D (3)
16 mm
0.321 [8.16]
0.059 [1.5]
0.157 [4.0]
0.315 ± 0.04
[8.0 ± 1.0]
0.217 ± 0.002
0.094 [2.39]
[5.5 ± 0.05]
0.217 ± 0.002
0.175 [4.44]
[5.5 ± 0.05]
0.138 [3.5]
0.315 ± 0.04
[8.0 ±1.0]
0.057 [1.45]
0.157 [4.0]
0.476 ± 0.008
[12.1 ± 0.20]
0.079 ± 0.002
[2.00 ± 0.05]
0.315 [8.0]
0.079 ± 0.002 0.472 + 0.012 / - 0.004
[2.00 ± 0.05]
[12.0 + 0.3 / - 0.10]
0.079 ± 0.002 0.472 + 0.012 / - 0.004
[2.00 ± 0.05]
[12.0 + 0.3 / - 0.10]
0.079 ± 0.002
[2.00 ± 0.05]
0.295 ± 0.004
0.472 ± 0.004 0.079 ± 0.004
0.308 [7.83]
[12.00 ± 0.1]
[2.00 ± 0.1]
[7.50 ± 0.1]
0.315 [8.0]
0.630 ± 0.012
[16.00 ± 0.3]
Notes
(1) For reference only
(2) Standard packaging of MM case is with paper tape. Plastic tape is available per request
(3) Tape thickness 0.018 [0.45] max.
PAPER TAPE AND REEL PACKAGING DIMENSIONS in inches [millimeters]
T
Ø D0
P2
P0
[10 pitches cumulative tolerance on tape ± 0.2 mm]
E1
A0
Bottom cover
tape
F
W
B0
E2
Top
cover tape
P1
Cavity center lines
Anode
Cavity size (1)
Bottom cover tape
G
USER FEED DIRECTION
CASE TAPE
SIZE SIZE
A0
B0
D0
P0
P1
P2
E
F
W
T
MM
8 mm
0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002
[1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1]
[4.0 ± 0.1]
[4.0 ± 0.1]
[2.0 ± 0.05] [1.75 ± 0.1]
[3.5 ± 0.05]
[8.0 ± 0.2] [0.95 ± 0.05]
M0
8 mm
0.049 ± 0.002 0.081 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.041 ± 0.002
[1.25 ± 0.05] [2.05 ± 0.05] [1.5 ± 0.1]
[4.0 ± 0.1]
[4.0 ± 0.1]
[2.0 ± 0.05] [1.75 ± 0.1]
[3.5 ± 0.05]
[8.0 ± 0.2] [1.05 ± 0.05]
Note
(1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
0
0
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation
of the component within the cavity of not more than 20°
Revision: 22-Nov-2023
Document Number: 40076
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Polymer Guide
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Vishay
PACKING AND STORAGE
Polymer capacitors meet moisture sensitivity level rating (MSL) of 3 or 4 as specified in IPC/JEDEC® J-STD-020 and are dry
packaged in moisture barrier bags (MBB) per J-STD-033. MSL for each particular family is defined in the datasheet - either in
“Features” section or “Standard Ratings” table. Level 3 specifies a floor life (out of bag) of 168 hours and level 4 specifies a floor
life of 72 hours at 30 °C maximum and 60 % relative humidity (RH). Unused capacitors should be re-sealed in the MBB with
fresh desiccant. A moisture strip (humidity indicator card) is included in the bag to assure dryness. To remove excess moisture,
capacitors can be dried at 40 °C (standard “dry box” conditions).
For detailed recommendations please refer to J-STD-033.
RECOMMENDED REFLOW PROFILES
Vishay recommends no more than 3 cycles of reflow in accordance with J-STD-020.
TP
tp
Max. ramp up rate = 3 °C/s
Max. ramp down rate = 6 °C/s
TL
Temperature
TSmax.
tL
Preheat area
TSmin.
tS
25
Time 25 °C to peak
Time
PROFILE FEATURE
PREHEAT AND SOAK
Temperature min. (TSmin.)
Temperature max. (TSmax.)
Time (tS) from (TSmin. to TSmax.)
RAMP UP
Ramp-up rate (TL to Tp)
Liquidus temperature (TL)
Time (tL) maintained above TL
Peak package body temperature (Tp) max.
Time (tp) within 5 °C of the peak max. temperature
RAMP DOWN
Ramp-down rate (Tp to TL)
Time from 25 °C to peak temperature
Note
(1) For T27, lead (Pb)-free capacitors t = 30 s
p
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
100 °C
150 °C
60 s to 120 s
150 °C
200 °C
60 s to 120 s
3 °C/s maximum
183 °C
217 °C
60 s to 150 s
Depends on type and case - see table below
20 s
5 s (1)
6 °C/s maximum
6 min maximum
8 min maximum
PEAK PACKAGE BODY TEMPERATURE (Tp) MAXIMUM
TYPE
CASE CODE
PEAK PACKAGE BODY TEMPERATURE (TP) MAX.
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
220 °C
245 °C
260 °C
260 °C
260 °C
n/a
260 °C
260 °C
250 °C
220 °C
250 °C
220 °C
250 °C
220 °C
n/a
220 °C
n/a
T27
D
T55
J, P, A, T, B, C, Z, V, D
T52
E5, M1, M9, B2
T58
MM, W9, W0, A0, BB
T50
D
T51
D, V
T56
B, D, V
T59
EE, EL
T54
EL, 3E, 6E, EE, E2, E3, E4, E6
20021
3E, 6E, EE, E2, E3, E4, E6
04051
B, D
Notes
• T50, T51, T52, T55, T56, and T58 capacitors are process sensitive.
PSL classification to JEDEC J-STD-075: R4G
• T54 and T59 capacitors with 100 % tin termination are process sensitive.
PSL classification to JEDEC J-STD-075: R6G
Revision: 22-Nov-2023
Document Number: 40076
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MOLDED CAPACITORS, T50 / T51 / T55 / T56 / 04051 TYPES
PAD DIMENSIONS in millimeters
L
Capacitor
Pattern
Y
CASE /
DIMENSIONS
J
P
A
T/B
C
Z/V/D
CAPACITOR SIZE
L
W
1.6
0.8
2.0
1.25
3.2
1.6
3.5
2.8
5.8
3.2
7.3
4.3
X
W
G
Z
G (max.)
0.7
0.5
1.1
1.4
2.9
4.1
PAD DIMENSIONS
Z (min.)
X (min.)
2.5
1.0
2.6
1.2
3.8
1.5
4.1
2.7
6.9
2.7
8.2
2.9
Y (Ref.)
0.9
1.05
1.35
1.35
2.0
2.05
LEADFRAMELESS MOLDED CAPACITORS T52 / T58
PAD DIMENSIONS in inches [millimeters]
D
B
C
Pads
A
Capacitor body
FAMILY
T52
T58
CASE CODE
E5
M1, M9
B2
MM
W0, W9
A0
BB
A (NOM.)
0.094 [2.40]
0.178 [4.52]
0.081 [2.06]
0.024 [0.61]
0.035 [0.89]
0.047 [1.19]
0.094 [2.39]
B (MIN.)
0.077 [1.95]
0.098 [2.48]
0.057 [1.44]
0.027 [0.70]
0.029 [0.74]
0.042 [1.06]
0.044 [1.11]
C (NOM.)
0.180 [4.57]
0.138 [3.50]
0.070 [1.77]
0.025 [0.64]
0.041 [1.05]
0.065 [1.65]
0.072 [1.82]
D (MIN.)
0.333 [8.46]
0.333 [8.46]
0.183 [4.64]
0.080 [2.03]
0.099 [2.52]
0.148 [3.76]
0.159 [4.03]
LEADFRAMELESS MOLDED CAPACITORS T59 / T54 / 20021
PAD DIMENSIONS in inches [millimeters]
B
D
C
Pads
A
Capacitor body
FAMILY
T59 / T54
T54
20021
Revision: 22-Nov-2023
CASE CODE
EE
EL
E2 / E3
E4 / E6
3E
6E
EE
A (NOM.)
0.209 [5.30]
0.098 [2.50]
0.128 [3.24]
0.301 [7.64]
0.482 [12.24]
0.482 [12.24]
0.209 [5.30]
B (MIN.)
0.098 [2.50]
0.098 [2.50]
0.120 [3.04]
0.120 [3.04]
0.120 [3.04]
0.120 [3.04]
0.098 [2.50]
C (NOM.)
0.169 [4.30]
0.169 [4.30]
0.154 [3.92]
0.154 [3.92]
0.154 [3.92]
0.154 [3.92]
0.169 [4.30]
D (MIN.)
0.366 [9.30]
0.366 [9.30]
0.394 [10.0]
0.394 [10.0]
0.394 [10.0]
0.394 [10.0]
0.366 [9.30]
Document Number: 40076
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HERMETICALLY SEALED CAPACITOR T27 TYPE
PAD DIMENSIONS in inches [millimeters]
D
C
B
A
CASE CODE
A (MIN.)
B (NOM.)
C (NOM.)
D (NOM.)
D
0.295 [7.50]
0.138 [3.50]
0.100 [2.50]
0.374 [9.50]
GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
I R MS =
3.
P
-----------R ESR
where,
P=
power dissipation in W at +45 °C as given in
the tables in the product datasheets.
2.
MAXIMUM RIPPLE CURRENT TEMPERATURE
DERATING FACTOR
RESR = the capacitor equivalent series resistance at
the specified frequency.
≤ 45 °C
1.0
55 °C
0.8
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
85 °C
0.6
P
V R MS = Z -----------R ESR
or, from the formula:
Mounting Precautions:
5.1
Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 3 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
For details see www.vishay.com/doc?40214.
The capacitor impedance at the specified
frequency.
Voltage
Ripple voltage
Rated voltage
Operating
voltage
Working voltage
0.25
5.
RESR = The capacitor equivalent series resistance at
the specified frequency.
The tantalum capacitors must be used in such a
condition that the sum of the working voltage and
ripple voltage peak values does not exceed the rated
voltage as shown in figure below.
0.4
125 °C
Reverse Voltage: the capacitors are not intended for
use with reverse voltage applied. However, they are
capable of withstanding momentary reverse voltage
peaks, which must not exceed the following values:
At 25 °C: 10 % of the rated voltage or 1 V, whichever
is smaller.
At 85 °C: 5 % of the rated voltage or 0.5 V, whichever
is smaller.
At 105 °C: 3 % of the rated voltage or 0.3 V,
whichever is smaller.
where,
P=
power dissipation in W at +45 °C as given in
the tables in the product datasheets.
Z=
105 °C
4.
V RMS = I RM S x Z
2.1
Temperature Derating: power dissipation is
affected by the heat sinking capability of the
mounting surface. If these capacitors are to
be operated at temperatures above +45 °C, the
permissible ripple current (or voltage) shall be
calculated using the derating coefficient as shown in
the table below:
Time (s)
Revision: 22-Nov-2023
Document Number: 40076
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5.2
Vishay
Limit Pressure on Capacitor Installation with
Mounter: pressure must not exceed 4.9 N with a tool
end diameter of 1.5 mm when applied to the
capacitors using an absorber, centering tweezers, or
similar (maximum permitted pressurization time: 5 s).
An excessively low absorber setting position would
result in not only the application of undue force to the
capacitors but capacitor and other component
scattering, circuit board wiring breakage, and / or
cracking as well, particularly when the capacitors are
mounted together with other chips having a height of
1 mm or less.
5.3
Flux Selection
5.3.1 Select a flux that contains a minimum of chlorine and
amine.
5.3.2 After flux use, the chlorine and amine in the flux
remain must be removed.
5.4
Cleaning After Mounting: the following solvents are
usable when cleaning the capacitors after mounting.
Never use a highly active solvent.
• Halogen organic solvent (HCFC225, etc.)
• Alcoholic solvent (IPA, ethanol, etc.)
• Petroleum solvent, alkali saponifying agent, water,
etc.
Circuit board cleaning must be conducted at a
temperature of not higher than 50 °C and for an
immersion time of not longer than 30 minutes. When
an ultrasonic cleaning method is used, cleaning must
be conducted at a frequency of 48 kHz or lower, at
an vibrator output of 0.02 W/cm3, at a temperature of
not higher than 40 °C, and for a time of 5 minutes or
shorter.
Notes
• Care must be exercised in cleaning process so that the
mounted capacitor will not come into contact with any
cleaned object or the like or will not get rubbed by a stiff
brush or similar. If such precautions are not taken
particularly when the ultrasonic cleaning method is
employed, terminal breakage may occur
• When performing ultrasonic cleaning under conditions
other than stated above, conduct adequate advance
checkout
Revision: 22-Nov-2023
Document Number: 40076
13
For technical questions, contact: polytech@vishay.com
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