V8PAM10HM3/I

V8PAM10 www.vishay.com Vishay General Semiconductor Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier FEATURES ® • Very low profile - typical height of 0.95 mm eSMP Series K Available • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop A Top View Bottom View SMPA (DO-221BC) • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive ordering code: P/NHM3 Anode Cathode LINKS TO ADDITIONAL RESOURCES 3D 3D • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency inverters, freewheeling, DC/DC converters, and polarity protection in commercial and automotive applications. 3D Models MECHANICAL DATA PRIMARY CHARACTERISTICS IF(AV) 8.0 A VRRM 100 V IFSM 100 A VF at IF = 8.0 A (TA = 125 °C) 0.62 V TJ max. 175 °C Package SMPA (DO-221BC) Circuit configuration Single Case: SMPA (DO-221BC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD22-B102 M3 and HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage Maximum DC forward current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Operating junction and storage temperature range V8PAM10 UNIT 8M10 VRRM 100 IF(AV) (1) 8.0 IF(AV) (2) 2.9 IFSM 100 A TJ, TSTG -40 to +175 °C V A Notes (1) Units mounted on 3 cm x 3 cm aluminum PCB (2) Free air, mounted on recommended copper pad area Revision: 16-Jun-2020 Document Number: 87660 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V8PAM10 www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS IF = 4.0 A TA = 25 °C IF = 8.0 A Instantaneous forward voltage VF (1) IF = 4.0 A TA = 125 °C IF = 8.0 A VR = 70 V Reverse current VR = 100 V Typical junction capacitance SYMBOL TYP. MAX. 0.58 - 0.70 0.78 0.50 - 0.62 0.70 TA = 25 °C 0.01 - TA = 125 °C 2 - - 0.2 4 10 810 - TA = 25 °C IR (2) TA = 125 °C 4.0 V, 1 MHz CJ UNIT V mA pF Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width  5 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise specified) PARAMETER Typical thermal resistance SYMBOL V8PAM10 RJA (1)(2) 100 RJM (3) 5 UNIT °C/W Notes (1) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R D J JA (2) Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance R JA - junction to ambient (3) Units mounted on 3 cm x 3 cm aluminum PCB; thermal resistance R JM - junction to mount ORDERING INFORMATION (Example) UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE V8PAM10-M3/I PREFERRED P/N 0.032 I 14 000 13" diameter plastic tape and reel V8PAM10HM3/I (1) 0.032 I 14 000 13" diameter plastic tape and reel Note (1) AEC-Q101 qualified 7.0 9.0 TM =145 ƱC, RthJM =5 ƱC/W 8.0 D = 0.8 D = 0.5 6.0 Average Power Loss (W) Average Forward Rectified Current (A)  RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise specified) 7.0 6.0 5.0 4.0 TA =25 ƱC, RthJA =100 ƱC/W 3.0 2.0 1.0 TM measured at cathode band terminal PCB mount 0 0 25 50 75 100 D = 0.3 D = 0.2 5.0 D = 1.0 D = 0.1 4.0 3.0 T 2.0 1.0 D = tp/T tp 0.0 125 150 175 Mount Temperature (°C) Fig. 1 - Maximum Forward Current Derating Curve 0 1 2 3 4 5 6 7 8 9 10 Average Forward Current (A) Fig. 2 - Forward Power Loss Characteristics Revision: 16-Jun-2020 Document Number: 87660 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V8PAM10 www.vishay.com Vishay General Semiconductor 10000 2nd line Instantaneous Forward Current (A) TJ = 175 °C TJ = 150 °C 10 1st line 2nd line 1000 TJ = 125 °C TJ = 100 °C 1 100 TJ = 25 °C TJ = -40 °C 0.1 10 0 0.2 0.4 0.6 0.8 1.0 Transient Thermal Impedance (°C/W) Axis Title 100 1.2 1000 Junction to ambient 100 10 1 0.01 0.1 1 10 100 t - Pulse Duration (s) Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 6 - Typical Transient Thermal Impedance Axis Title Epoxy printed circuit board FR4 copper thickness = 70 μm 100 10 1 1000 TJ = 150 °C TJ = 100 °C 0.1 TJ = 175 °C TJ = 125 °C 0.01 100 0.001 TJ = 25 °C 0.0001 TJ = -40 °C 0.00001 10 10 20 30 40 50 60 70 80 90 100 Thermal Resistance (°C/W) 2nd line Instantaneous Reverse Current (mA) 110 10000 100 90 80 70 60 50 40 30 S (cm2) 20 0 1 2 3 4 5 6 7 8 9 Copper Pad Areas (cm2) Percent of Rated Peak Reverse Voltage (%) Fig. 4 - Typical Reverse Leakage Characteristics Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas Junction Capacitance (pF) 10 000 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 1000 100 10 1 0.1 1 10 100 Reverse Voltage (V) Fig. 5 - Typical Junction Capacitance Revision: 16-Jun-2020 Document Number: 87660 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V8PAM10 www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) SMPA (DO-221BC) 0.059 (1.50) 0.030 (0.75) 0.122 (3.10) 0.098 (2.50) Cathode Band 0.057 (1.45) 0.049 (1.25) 0.106 (2.70) 0.098 (2.50) 0.171 (4.35) 0.163 (4.15) 0.211 (5.35) 0.199 (5.05) 0.087 (2.20) 0.063 (1.6) 0.059 (1.50) 0.030 (0.75) Typ.: 0.019 (0.48) Mounting Pad Layout MAX. 0.037 (0.92) 0.039 (1.00) 0.035 (0.90) 0.012 (0.30) 0.006 (0.15) 0.087 (2.20) MIN. 0.060 (1.52) MIN. MIN. 0.122 (3.10) MIN. 0.059 (1.50) 0.217 (5.52) Revision: 16-Jun-2020 Document Number: 87660 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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