VS-8EWF10S-M3, VS-8EWF12S-M3 Soft Recovery Series
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Vishay Semiconductors
Surface Mount Fast Soft Recovery Rectifier Diode, 8 A
FEATURES
Base
cathode
+
2
• Glass passivated pellet chip junction
• Meets MSL level 1, per
LF maximum peak of 260 °C
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
2
3
1
DPAK (TO-252AA)
J-STD-020,
1
Anode -
3
- Anode
APPLICATIONS
• Output rectification and freewheeling diode in inverters,
choppers and converters
PRIMARY CHARACTERISTICS
IF(AV)
8A
VR
1000 V, 1200 V
VF at IF
1.3 V
IFSM
150 A
trr
80 ns
TJ max.
150 °C
• Input rectifications where severe
conducted EMI should be met
restrictions
on
DESCRIPTION
The VS-8EWF..S-M3 fast soft recovery rectifier series has
been optimized for combined short reverse recovery time,
low forward voltage drop and low leakage current.
Snap factor
0.6
Package
DPAK (TO-252AA)
Circuit configuration
Single
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
IF(AV)
CHARACTERISTICS
Sinusoidal waveform
VALUES
UNITS
8
A
VRRM
1000/1200
V
IFSM
150
A
VF
8 A, TJ = 25 °C
1.3
V
trr
1 A, 100 A/μs
80
ns
TJ
Range
-40 to +150
°C
VOLTAGE RATINGS
PART NUMBER
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
IRRM
AT 150 °C
mA
VS-8EWF10S-M3
VS-8EWF12S-M3
1000
1200
1100
1300
4
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average forward current
IF(AV)
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2√t for fusing
I2√t
TEST CONDITIONS
TC = 96 °C, 180° conduction half sine wave
10 ms sine pulse, rated VRRM applied
10 ms sine pulse, no voltage reapplied
10 ms sine pulse, rated VRRM applied
10 ms sine pulse, no voltage reapplied
t = 0.1 ms to 10 ms, no voltage reapplied
VALUES
8
125
150
78
110
1100
UNITS
A
A2s
A2√s
Revision: 09-Aug-2022
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VS-8EWF10S-M3, VS-8EWF12S-M3 Soft Recovery Series
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Vishay Semiconductors
ELECTRICAL SPECIFICATIONS
PARAMETER
Maximum forward voltage drop
Forward slope resistance
Threshold voltage
Maximum reverse leakage current
SYMBOL
VFM
rt
VF(TO)
IRM
TEST CONDITIONS
VALUES
8 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
1.3
V
25.6
mΩ
0.93
V
0.1
VR = Rated VRRM
TJ = 150 °C
UNITS
mA
4
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
Snap factor
TEST CONDITIONS
IF at 8 Apk
25 A/μs
TJ = 25 °C
S
VALUES
UNITS
270
ns
4.2
A
1
μC
IFM
trr
ta
tb
t
di
dt
0.6
Qrr
Irr
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and
storage temperature range
Maximum thermal resistance,
junction to case
Typical thermal resistance,
junction to ambient (PCB mount)
SYMBOL
TEST CONDITIONS
TJ, TStg
RthJC
DC operation
UNITS
-40 to +150
°C
2.5
°C/W
RthJA (1)
50
Approximate weight
Marking device
VALUES
Case style DPAK (TO-252AA)
1
g
0.03
oz.
8EWF10S
8EWF12S
Note
(1) When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 μm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
Revision: 09-Aug-2022
Document Number: 93377
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-8EWF10S-M3, VS-8EWF12S-M3 Soft Recovery Series
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Vishay Semiconductors
18
8EWF.. S Series
RthJC (DC) = 2.5 °C/W
140
Maximum Average Forward
Power Loss (W)
Maximum Allowable Case
Temperature (°C)
150
130
120
Ø
Conduction angle
110
100
90
30°
80
120°
60°
70
90°
12
RMS limit
10
8
6
Ø
Conduction period
4
8EWF..S Series
TJ = 150 °C
2
0
0
1
3
2
4
5
7
6
8
9
2
0
4
6
10
8
12
14
Average Forward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 4 - Forward Power Loss Characteristics
140
150
8EWF..S Series
RthJC (DC) = 2.5 °C/W
140
120
130
120
110
Ø
100
Conduction period
90
30°
60°
80
120°
6
4
80
70
60
10
8
VS-8EWF..S .. Series
12
14
1
10
100
Average Forward Current (A)
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 2 - Current Rating Characteristics
Fig. 5 - Maximum Non-Repetitive Surge Current
170
180°
120°
90°
60°
30°
10
8
150
Peak Half Sine Wave
Forward Current (A)
12
RMS limit
6
Ø
4
Conduction angle
2
8EWF..S Series
TJ = 150 °C
1
2
3
4
5
6
7
8
130
9
Maximum non-repetitive surge current
versus pulse train duration.
Initial Tj = Tj max.
No voltage reapplied
Rated Vrrm reapplied
110
90
70
50
30
0
0
90
30
60
2
100
40
DC
180°
0
110
50
90°
70
At any rated load condition and with
rated Vrrm applied following surge.
Initial Tj = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
130
Peak Half Sine Wave
Forward Current (A)
Maximum Allowable Case
Temperature (°C)
14
180°
60
Maximum Average Forward
Power Loss (W)
DC
180°
120°
90°
60°
30°
16
10
0.01
VS-8EWF..S .. Series
0.1
1
10
Average Forward Current (A)
Pulse Train Duration (s)
Fig. 3 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 09-Aug-2022
Document Number: 93377
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VS-8EWF10S-M3, VS-8EWF12S-M3 Soft Recovery Series
Vishay Semiconductors
2.0
1000
8EWF..S Series
TJ = 25 °C
TJ = 25 °C
TJ = 150 °C
Qrr - Typical Reverse
Recovery Charge (µC)
Instantaneous Forward Current (A)
www.vishay.com
100
10
IFM = 5 A
0.8
IFM = 2 A
0.4
IFM = 1 A
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
40
80
120
160
200
Instantaneous Forward Voltage (V)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 7 - Forward Voltage Drop Characteristics
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
5
8EWF..S Series
TJ = 150 °C
Qrr - Typical Reverse
Recovery Charge (µC)
8EWF..S Series
TJ = 25 °C
0.5
trr - Typical Reverse
Recovery Time (µs)
IFM = 8 A
1.2
8EWF..S Series
1
0.5
0.6
IFM = 10 A
IFM = 8 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
0.4
0.3
0.2
0.1
4
IFM = 10 A
3
IFM = 8 A
IFM = 5 A
2
IFM = 2 A
1
IFM = 1 A
0
0
0
40
80
120
160
0
200
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
20
0.8
8EWF..S Series
TJ = 150 °C
IFM = 10 A
IFM = 8 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
0.6
0.4
Irr - Typical Reverse
Recovery Current (A)
trr - Typical Reverse
Recovery Time (µs)
IFM = 10 A
1.6
0.2
8EWF..S Series
TJ = 25 °C
16
IFM = 10 A
IFM = 8 A
12
IFM = 5 A
IFM = 2 A
8
IFM = 1 A
4
0
0
0
40
80
120
160
200
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Revision: 09-Aug-2022
Document Number: 93377
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-8EWF10S-M3, VS-8EWF12S-M3 Soft Recovery Series
www.vishay.com
Vishay Semiconductors
25
8EWF..S Series
TJ = 150 °C
Irr - Typical Reverse
Recovery Current (A)
20
IFM = 10 A
IFM = 8 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
15
10
5
0
0
40
120
80
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
ZthJC - Transient Thermal Impedance (°C/W)
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
10
Steady state value
(DC operation)
1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Single pulse
8EWF..S Series
0.1
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 09-Aug-2022
Document Number: 93377
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-8EWF10S-M3, VS-8EWF12S-M3 Soft Recovery Series
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
8
E
W
F
12
S
TR
-M3
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Current rating (8 = 8 A)
3
-
Circuit configuration:
E = single diode
4
-
Package:
W = D-PAK
5
-
Type of silicon:
F = fast soft recovery rectifier
6
-
Voltage code x 100 = VRRM
7
-
S = surface mountable
8
-
TR = tape and reel
10 = 1000 V
12 = 1200 V
TRR = tape and reel (right oriented)
TRL = tape and reel (left oriented)
9
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-8EWF10S-M3
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
75
3000
Antistatic plastic tubes
VS-8EWF10STR-M3
2000
2000
13" diameter reel
VS-8EWF10STRL-M3
3000
3000
13" diameter reel
VS-8EWF10STRR-M3
3000
3000
13" diameter reel
75
3000
Antistatic plastic tubes
VS-8EWF12STR-M3
2000
2000
13" diameter reel
VS-8EWF12STRL-M3
3000
3000
13" diameter reel
VS-8EWF12STRR-M3
3000
3000
13" diameter reel
VS-8EWF12S-M3
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95627
Part marking information
www.vishay.com/doc?95176
Packaging information
www.vishay.com/doc?95033
SPICE model
www.vishay.com/doc?97057
Revision: 09-Aug-2022
Document Number: 93377
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
D-PAK (TO-252AA) “M”
DIMENSIONS in millimeters and inches
(5)
A
E
b3
(3)
Pad layout
C
A
0.010 M C A B
c2
A
L3 (3)
Ø1
4
Ø2
4
B
Seating
plane
H
D (5)
1
2
0.245
MIN.
(6.23)
D1
L4
3
0.265
MIN.
(6.74)
E1
3
2
0.488 (12.40)
0.409 (10.40)
1
0.089
MIN.
(2.28)
Detail “C”
(2) L5
b
2x e
A
c
b2
0.06
MIN.
(1.524)
0.010 M C A B
0.093 (2.38)
0.085 (2.18)
(L1)
Detail “C”
Rotated 90 °CW
Scale: 20:1
H (7)
Lead tip
C
Gauge
plane
L2
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
C Seating
plane
C
Ø
L
NOTES
A1
SYMBOL
MILLIMETERS
MIN.
MAX.
MAX.
A
2.18
2.39
0.086
0.094
e
A1
-
0.13
-
0.005
H
9.40
10.41
0.370
0.410
b
0.64
0.89
0.025
0.035
L
1.40
1.78
0.055
0.070
b2
0.76
1.14
0.030
0.045
L1
b3
4.95
5.46
0.195
0.215
c
0.46
0.61
0.018
0.024
L3
0.89
1.27
0.035
0.050
c2
0.46
0.89
0.018
0.035
L4
-
1.02
-
0.040
D
5.97
6.22
0.235
0.245
5
L5
1.14
1.52
0.045
0.060
D1
5.21
-
0.205
-
3
Ø
0°
10°
0°
10°
E
6.35
6.73
0.250
0.265
5
Ø1
0°
15°
0°
15°
E1
4.32
-
0.170
-
3
Ø2
25°
35°
25°
35°
3
2.29 BSC
INCHES
MIN.
2.74 BSC
L2
0.51 BSC
NOTES
0.090 BSC
0.108 REF.
0.020 BSC
3
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension uncontrolled in L5
(3) Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4) Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5) Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6) Dimension b1 and c1 applied to base metal only
(7) Datum A and B to be determined at datum plane H
(8) Outline conforms to JEDEC® outline TO-252AA
Revision: 24-Jun-16
Document Number: 95627
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Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
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Revision: 01-Jan-2023
1
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