VS-HFA08SD60S-M3
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Vishay Semiconductors
HEXFRED® Ultrafast Soft Recovery Diode, 8 A
FEATURES
2, 4
• Ultrafast recovery time
• Ultrasoft recovery
• Very low IRRM
1
N/C
TO-252AA (D-PAK)
• Very low Qrr
3
Anode
• Guaranteed avalanche
• Specified at operating conditions
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
BENEFITS
Package
TO-252AA (D-PAK)
IF(AV)
8A
VR
600 V
VF at IF
1.4 V
trr typ.
18 ns
TJ max.
150 °C
Diode variation
Single die
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
DESCRIPTION / APPLICATIONS
These diodes are optimized to reduce losses and EMI / RFI
in high frequency power conditioning systems. The softness
of the recovery eliminates the need for a snubber in most
applications. These devices are ideally suited for
freewheeling, flyback, power converters, motor drives, and
other applications where high speed and reduced switching
losses are design requirements.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
TEST CONDITIONS
VALUES
UNITS
600
V
VRRM
Maximum continuous forward current
IF
TC = 100 °C
8
Single pulse forward current
IFSM
60
Peak repetitive forward current
IFRM
24
Maximum power dissipation
PD
Operating junction and storage temperature range
TC = 100 °C
TJ, TStg
A
14
W
-55 to +150
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
SYMBOL
VBR,
VR
TEST CONDITIONS
IR = 100 μA
IF = 8 A
Forward voltage
VF
IF = 16 A
See fig. 1
MIN.
TYP.
MAX.
600
-
-
-
1.4
1.7
-
1.7
2.1
1.7
UNITS
V
IF = 8 A, TJ = 125 °C
-
1.4
VR = VR rated
-
0.3
5.0
TJ = 125 °C, VR = 0.8 x VR rated
-
100
500
-
10
25
pF
-
8.0
-
nH
Maximum reverse
leakage current
IR
Junction capacitance
CT
VR = 200 V
Series inductance
LS
Measured lead to lead 5 mm from package body
See fig. 3
μA
Revision: 24-Nov-16
Document Number: 93474
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
SYMBOL
trr
TEST CONDITIONS
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V
-
18
-
TJ = 25 °C
-
37
55
UNITS
ns
TJ = 125 °C
-
55
90
TJ = 25 °C
-
3.5
5.0
-
4.5
8.0
-
65
138
TJ = 125 °C
-
124
360
TJ = 25 °C
-
240
-
TJ = 125 °C
-
210
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-55
-
150
°C
Thermal resistance,
junction to case
RthJC
-
-
3.5
Thermal resistance,
junction to ambient
RthJA
-
-
80
-
2.0
-
g
-
0.07
-
oz.
Peak recovery current
Reverse recovery charge
Rate of fall of recovery current
IRRM
Qrr
dI(rec)M/dt
IF = 8 A
dIF/dt = 200 A/μs
VR = 200 V
TJ = 125 °C
TJ = 25 °C
A
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction
and storage temperature range
SYMBOL
TEST CONDITIONS
°C/W
Typical socket mount
Weight
Marking device
Case style TO-252AA (D-PAK)
HFA08SD60S
Revision: 24-Nov-16
Document Number: 93474
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA08SD60S-M3
Vishay Semiconductors
1000
100
TJ = 150 °C
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1
0.1
0.4
100
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
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TJ = 125 °C
10
1
0.1
TJ = 25 °C
0.01
0.001
0.8
1.6
3.2
2.4
0
4.0
100
300
200
400
500
600
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
100
TJ = 25 °C
10
1
1
10
100
1000
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Response
10
1
PDM
0.1
Single pulse
(thermal resistance)
0.01
0.00001
t1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.0001
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 24-Nov-16
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80
500
IF = 16 A
IF = 8 A
IF = 4 A
70
400
Qrr (nC)
trr (ns)
60
VR = 200 V
TJ = 125 °C
TJ = 25 °C
50
40
IF = 16 A
IF = 8 A
IF = 4 A
300
200
30
20
100
VR = 200 V
TJ = 125 °C
TJ = 25 °C
10
100
0
100
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 7 - Typical Stored Charge vs. dIF/dt
10 000
20
VR = 200 V
TJ = 125 °C
TJ = 25 °C
IF = 16 A
IF = 8 A
IF = 4 A
dI(rec)M/dt (A/µs)
15
IRR (A)
1000
10
1000
IF = 16 A
IF = 8 A
IF = 4 A
5
VR = 200 V
TJ = 125 °C
TJ = 25 °C
0
100
1000
100
100
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 6 - Typical Recovery Current vs. dIF/dt
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
Revision: 24-Nov-16
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VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Revision: 24-Nov-16
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VS-HFA08SD60S-M3
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ORDERING INFORMATION TABLE
Device code
VS-
HF
A
08
SD
60
S
TR
-M3
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
HEXFRED® family
3
-
Electron irradiated
4
-
Current rating (08 = 8 A)
5
-
D-PAK
6
-
Voltage rating (60 = 600 V)
7
-
S = D-PAK
8
-
TR = tape and reel
R = tape and reel (right oriented)
L = tape and reel (left oriented)
9
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-HFA08SD60S-M3
VS-HFA08SD60STR-M3
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
75
3000
Antistatic plastic tube
2000
2000
13" diameter reel
VS-HFA08SD60SL-M3
3000
3000
13" diameter reel
VS-HFA08SD60SR-M3
3000
3000
13" diameter reel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95627
Part marking information
www.vishay.com/doc?95176
Packaging information
www.vishay.com/doc?95033
Revision: 24-Nov-16
Document Number: 93474
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
D-PAK (TO-252AA) “M”
DIMENSIONS in millimeters and inches
(5)
A
E
b3
(3)
Pad layout
C
A
0.010 M C A B
c2
A
L3 (3)
Ø1
4
Ø2
4
B
Seating
plane
H
D (5)
1
2
0.245
MIN.
(6.23)
D1
L4
3
0.265
MIN.
(6.74)
E1
3
2
0.488 (12.40)
0.409 (10.40)
1
0.089
MIN.
(2.28)
Detail “C”
(2) L5
b
2x e
A
c
b2
0.06
MIN.
(1.524)
0.010 M C A B
0.093 (2.38)
0.085 (2.18)
(L1)
Detail “C”
Rotated 90 °CW
Scale: 20:1
H (7)
Lead tip
C
Gauge
plane
L2
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
C Seating
plane
C
Ø
L
NOTES
A1
SYMBOL
MILLIMETERS
MIN.
MAX.
MAX.
A
2.18
2.39
0.086
0.094
e
A1
-
0.13
-
0.005
H
9.40
10.41
0.370
0.410
b
0.64
0.89
0.025
0.035
L
1.40
1.78
0.055
0.070
b2
0.76
1.14
0.030
0.045
L1
b3
4.95
5.46
0.195
0.215
c
0.46
0.61
0.018
0.024
L3
0.89
1.27
0.035
0.050
c2
0.46
0.89
0.018
0.035
L4
-
1.02
-
0.040
D
5.97
6.22
0.235
0.245
5
L5
1.14
1.52
0.045
0.060
D1
5.21
-
0.205
-
3
Ø
0°
10°
0°
10°
E
6.35
6.73
0.250
0.265
5
Ø1
0°
15°
0°
15°
E1
4.32
-
0.170
-
3
Ø2
25°
35°
25°
35°
3
2.29 BSC
INCHES
MIN.
2.74 BSC
L2
0.51 BSC
NOTES
0.090 BSC
0.108 REF.
0.020 BSC
3
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension uncontrolled in L5
(3) Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4) Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5) Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6) Dimension b1 and c1 applied to base metal only
(7) Datum A and B to be determined at datum plane H
(8) Outline conforms to JEDEC® outline TO-252AA
Revision: 24-Jun-16
Document Number: 95627
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