VS-SD603C..C Series
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Vishay Semiconductors
Fast Recovery Diodes
(Hockey PUK Version), 600 A
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
B-43
PRIMARY CHARACTERISTICS
High power fast recovery diode series
1.0 μs to 2.0 μs recovery time
High voltage ratings up to 2200 V
High current capability
Optimized turn-on and turn-off characteristics
Low forward recovery
Fast and soft reverse recovery
Press PUK encapsulation
Case style conform to JEDEC® B-43
Maximum junction temperature 125 °C
Designed and qualified for industrial level
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
IF(AV)
600 A
TYPICAL APPLICATIONS
Package
B-43
Circuit configuration
Single
• Snubber diode for GTO
• High voltage freewheeling diode
• Fast recovery rectifier applications
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
TEST CONDITIONS
IF(AV)
S20
600
600
600
A
55
55
55
°C
942
942
942
A
25
25
25
°C
50 Hz
8320
8320
8320
60 Hz
8715
8715
8715
Ths
IFSM
I2t
VRRM
trr
UNITS
S15
Ths
IF(RMS)
VS-SD603C..C
S10
A
50 Hz
346
346
346
60 Hz
316
316
316
Range
400 to 1000
1200 to 1600
2000 to 2200
V
1.0
1.5
2.0
μs
TJ
TJ
kA2s
25
25
25
-40 to +125
-40 to +125
-40 to +125
°C
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VS-SD603C..S10C
VS-SD603C..S15C
VS-SD603C..S20C
VOLTAGE
CODE
VRRM, MAXIMUM REPETITIVE PEAK
AND OFF-STATE VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK VOLTAGE
V
04
400
500
08
800
900
10
1000
1100
12
1200
1300
14
1400
1500
16
1600
1700
20
2000
2100
22
2200
2300
IRRM MAXIMUM
AT TJ = 125 °C
mA
45
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VS-SD603C..C Series
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FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum average forward current
at heatsink temperature
TEST CONDITIONS
180° conduction, half sine wave
Double side (single side) cooled
IF(AV)
Maximum RMS current
IF(RMS)
t = 8.3 ms
IFSM
t = 10 ms
t = 8.3 ms
t = 10 ms
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
UNITS
A
55 (75)
°C
25 °C heatsink temperature double side cooled
t = 10 ms
Maximum peak, one-cycle
non-repetitive forward current
VALUES
600 (300)
t = 8.3 ms
942
8320
No voltage
reapplied
100 % VRRM
reapplied
7000
Sinusoidal half wave,
initial TJ = TJ
maximum
No voltage
reapplied
7330
346
316
kA2s
100 % VRRM
reapplied
224
t = 0.1 to 10 ms, no voltage reapplied
3460
t = 10 ms
t = 8.3 ms
245
Low level value of threshold voltage
VF(TO)1
(16.7 % x x IF(AV) < I < x IF(AV)), TJ = TJ maximum
1.36
High level value of threshold voltage
VF(TO)2
(I > x IF(AV)), TJ = TJ maximum
1.81
Low level of forward slope resistance
rf1
(16.7 % x x IF(AV) < I < x IF(AV)), TJ = TJ maximum
0.87
High level of forward slope resistance
rf2
(I > x IF(AV)), TJ = TJ maximum
0.67
Ipk = 1885 A, TJ = 25 °C; tp = 10 ms sinusoidal wave
2.97
Maximum forward voltage drop
VFM
A
8715
kA2s
V
mW
V
RECOVERY CHARACTERISTICS
MAXIMUM VALUE
AT TJ = 25 °C
CODE
Ipk
SQUARE
PULSE
(A)
trr AT 25 % IRRM
(μs)
S10
1.0
S15
1.5
S20
2.0
TYPICAL VALUES
AT TJ = 125 °C
TEST CONDITIONS
dI/dt
(A/μs)
1000
Vr
(V)
25
-30
trr AT 25 % IRRM
(μs)
Qrr
(μC)
Irr
(A)
2.0
45
34
3.2
87
51
3.5
97
55
IFM
trr
t
dir
dt
Qrr
IRM(REC)
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum operating junction temperature range
Maximum storage temperature range
Maximum thermal resistance,
junction to heatsink
TEST CONDITIONS
VALUES
TJ
-40 to 125
TStg
-40 to 150
RthJ-hs
DC operation single side cooled
0.076
DC operation double side cooled
0.038
Mounting force, ± 10 %
Approximate weight
Case style
UNITS
°C
K/W
9800 (1000)
N (kg)
83
g
See dimensions - link at the end of datasheet
B-43
RthJ-hs CONDUCTION
CONDUCTION ANGLE
SINUSOIDAL CONDUCTION
SINGLE SIDE
DOUBLE SIDE
RECTANGULAR CONDUCTION
SINGLE SIDE
DOUBLE SIDE
180°
0.006
0.007
0.005
0.005
120°
0.008
0.008
0.008
0.008
90°
0.010
0.010
0.011
0.011
60°
0.015
0.015
0.016
0.015
30°
0.026
0.025
0.026
0.025
TEST CONDITIONS
UNITS
TJ = TJ maximum
K/W
Note
• The table above shows the increment of thermal resistance RthJ-hs when devices operate at different conduction angles than DC
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VS-SD603C..C Series
130
Vishay Semiconductors
SD603C..C Series
(Single Side Cooled)
RthJ-hs (DC) = 0.076 K/ W
120
110
Conduction Angle
100
90
80
60°
30°
180°
90°
120°
70
0
50
100
150
200
250
300
350
Maximum Allowable Heatsink Temperature (°C)
Maximum Allowable Heatsink Temperat ure (°C)
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130
SD603C..C Series
(Double Side Cooled)
RthJ-hs (DC) = 0.038 K/ W
120
110
100
Conduction Period
90
80
30°
70
180°
50
DC
40
0
200
110
Conduction Period
90
30°
60°
90°
120°
180°
DC
60
0
100
200
300
400
Maximum Average Forward Power Loss (W)
Maximum Allowable Heatsink Temperature (°C)
SD603C..C Series
(Single Side Cooled)
RthJ-hs (DC) = 0.076 K/ W
70
1400
1200
RMS Limit
1000
800
600
Conduction Angle
400
SD603C..C Series
TJ = 125°C
200
0
0
Conduction Angle
90
80
60° 90°
120°
180°
50
0
100 200
300
400
500
600
Average Forward Current (A)
Fig. 3 - Current Ratings Characteristics
700
Maximum Average Forward Power Loss (W)
Maximum Allowable Heatsink Temperature (°C)
100
30°
200
300
400
500
600
Fig. 5 - Forward Power Loss Characteristics
110
60
100
Average Forward Current (A)
SD603C..C Series
(Double Side Cooled)
R thJ-hs(DC) = 0.038 K/ W
70
1000
180°
120°
90°
60°
30°
1600
500
Fig. 2 - Current Ratings Characteristics
120
800
1800
Average Forward Current (A)
130
600
Fig. 4 - Current Ratings Characteristics
130
80
400
Average Forward Current (A)
Fig. 1 - Current Ratings Characteristics
100
90°
120°
Average Forward Current (A)
120
60°
60
2500
DC
180°
120°
90°
60°
30°
2000
1500
1000
RMS Limit
Conduc tion Period
SD603C..C Series
TJ = 125°C
500
0
0
200
400
600
800
1000
Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
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VS-SD603C..C Series
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Vishay Semiconductors
Peak Half Sine Wave Forward Current (A)
8000
10000
At Any Rated Load Condition and With
Rated VRRM Applied Following Surge.
Initial TJ = 125°C
7000
@60 Hz 0.0083 s
6500
@50 Hz 0.0100 s
6000
Instantaneous Forward Current (A)
7500
5500
5000
4500
4000
3500
SD603C..C Series
3000
1000
TJ = 25 °C
TJ = 125 °C
100
SD603C..C Series
2500
10
1
10
.5
100
1.5
7000
Transient Thermal Impedance Z thJ-hs (K/ W)
Peak Half Sine Wave Forward Current (A)
8000
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration.
Initial TJ = 125 °C
No Voltage Reapplied
Rated VRRMReapplied
6000
5000
4000
3000
SD603C..C Series
2000
0.01
0.1
3.5
4.5
5.5
6.5
7.5
8.5
Fig. 9 - Forward Voltage Drop Characteristics
Fig. 7 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
9000
2.5
Instantaneous Forward Voltage (V)
Number of Equa l Amplitude Ha lf Cyc le Current Pulses (N)
1
0.1
SD603C..C Series
0.01
Stead y State Va lue :
RthJ-hs= 0.076 K/ W
(Single Side Cooled)
RthJ-hs= 0.038 K/ W
(Double Side Cooled)
(DC Operation)
0.001
0.001
Pulse Train Duration (s)
0.01
0.1
1
10
100
Square Wave Pulse Duration (s)
Fig. 10 - Thermal Impedance ZthJ-hs Characteristics
Fig. 8 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
100
V
FP
I
Forward Rec overy (V)
80
TJ = 125°C
60
TJ = 25°C
40
20
SD603C..S20C Series
0
0
200
400
600
800
1000
1200
1400
1600
1800
2000
Rate Off Rise Of Forward Current di/ d t (A/ usec)
Fig. 11 - Typical Forward Recovery Characteristics
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VS-SD603C..C Series
2.2
2.1
Vishay Semiconductors
Maximum Reverse Recovery Time - Trr (µs)
Maximum Reverse Recovery Time - Trr (µs)
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SD603C..S10C Series
TJ = 125 °C; V r = 30V
I FM = 1000 A
Square Pulse
2
1.9
500 A
1.8
250 A
1.7
1.6
10
100
4
SD603C..S15C Series
TJ= 125 °C; V r = 30V
3.5
I FM = 1000 A
Square Pulse
3
500 A
2.5
250 A
2
10
100
Fig. 12 - Recovery Time Characteristics
Fig. 15 - Recovery Time Characteristics
130
I FM = 1000 A
120
Square Pulse
110
100
500 A
90
80
250 A
70
60
50
40
30
SD603C..S10C Series
TJ = 125 °C; V r = 30V
20
10 20 30 40 50 60 70 80 90 100
Maximum Reverse Recovery Charge - Qrr (µC)
Rate Of Fall Of Forward Current - di/d t (A/ µs)
Maximum Reverse Rec overy Charge - Qrr (µC)
Rate Of Fall Of Forward Current - di/ dt (A/ µs)
200
180
I FM = 1000 A
Square Pulse
160
140
500 A
120
100
250 A
80
60
SD603C..S15C Series
TJ= 125 °C; V r = 30V
40
10 20 30 40 50 60 70 80 90 100
Fig. 13 - Recovery Charge Characteristics
Fig. 16 - Recovery Charge Characteristics
120
110
100
90
80
I FM = 1000 A
Square Pulse
500 A
250 A
70
60
50
40
30
20
SD603C..S10C Series
TJ = 125 °C; V r = 30V
10
10 20 30 40 50 60 70 80 90 100
Maximum Reverse Recovery Current - Irr (A)
Rate Of Fall Of Forward Current - di/ dt (A/ µs)
Maximum Reverse Rec overy Current - Irr (A)
Rate Of Fall Of Forward Current - di/ dt (A/ µs)
140
130
120
I FM = 1000 A
Square Pulse
110
100
500 A
90
80
250 A
70
60
50
40
30
SD603C..S15C Series
TJ= 125 °C; V r = 30V
20
10 20 30 40 50 60 70 80 90 100
Rate Of Fall Of Forward Current - di/ dt (A/ µs)
Rate Of Fall Of Forward Current - di/ dt (A/µs)
Fig. 14 - Recovery Current Characteristics
Fig. 17 - Recovery Current Characteristics
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VS-SD603C..C Series
Vishay Semiconductors
Maximum Reverse Recovery Charge - Qrr (µC)
Maximum Reverse Rec overy Time - Trr (µs)
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4.5
SD603C..S20C Series
TJ= 125 °C; V r = 30V
4
I FM = 1000 A
3.5
Sq uare Pulse
3
500 A
2.5
250 A
2
10
100
200
I FM = 1000 A
180
Sq uare Pulse
160
140
500 A
120
100
250 A
80
SD603C..S20C Series
TJ = 125 °C; V r = 30V
60
40
10 20 30 40 50 60 70 80 90 100
Rate Of Fall Of Forward Current - di/dt (A/ µs)
Fig. 18 - Recovery Time Characteristics
Fig. 19 - Recovery Charge Characteristics
Maximum Reverse Recovery Current - Irr (A)
Rate Of Fa ll Of Forward Current - di/ dt (A/ µs)
150
140
IFM = 1000 A
130
Square Pulse
120
110
100
500 A
90
80
250 A
70
60
50
SD603C..S20C Series
TJ= 125 °C; V r = 30V
40
30
20
10 20 30 40 50 60 70 80 90 100
Rate Of Fall Of Forward Current - di/ dt (A/ µs)
Fig. 20 - Recovery Current Characteristics
1E4
10
20 joules per pulse
20 joules per pulse
10
Peak Forward Current (A)
4
1
4
2
2
1
0.4
1E3
0.4
0.2
0.1
0.2
0.04
0.1
0.02
1E2
0.01
tp
1E1
1E1
SD603C..S10C Series
Sinusoidal Pulse
TJ = 125°C, VRRM = 1120V
dv/ dt = 1000V/ µs
1E2
tp
1E3
Pulse Basewidth (µs)
1E4
1E1
SD603C..S10C Series
Trapezoidal Pulse
TJ = 125°C, VRRM = 1120V
d v/ dt = 1000V/ µs; di/ dt=50A/ µs
1E2
1E3
1E4
Pulse Basewidth (µs)
Fig. 21 - Maximum Total Energy Loss Per Pulse Characteristics
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VS-SD603C..C Series
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1E4
20 joules per pulse
20 joules p er p ulse
Peak Forward Current (A)
10
10
4
2
4
1
1E3
2
0.4
1
0.2
0.4
0.1
0.04
0.2
0.02
1E2
tp
1E1
1E1
SD603C..S15C Series
Sinusoid al Pulse
TJ= 125°C, VRRM = 1760V
d v/ dt = 1000V/ µs
1E2
SD603C..S15C Series
Trapezoidal Pulse
TJ = 125°C, VRRM = 1760V
d v/ dt = 1000V/ µs; di/ dt=50A/ µs
tp
1E3
1E1
1E4
1E2
1E3
1E4
Pulse Basewid th (µs)
Pulse Basewidth (µs)
Fig. 22 - Maximum Total Energy Loss Per Pulse Characteristics
1E4
20 joules per pulse
20 joules per pulse
Peak Forward Current (A)
10
10
4
4
2
2
1E3
1
1
0.4
0.4
0.2
0.1
1E2
0.04
tp
1E1
1E1
SD603C..S20C Series
Sinusoidal Pulse
TJ = 125°C, VRRM = 1760V
dv/ dt = 1000V/ µs
1E2
tp
1E3
SD603C..S20C Series
Trapezoidal Pulse
TJ = 125°C, VRRM = 1760V
dv/ dt = 1000V/ µs; di/ d t=50A/ µs
1E1
1E4
1E2
1E3
1E4
Pulse Basewidth (µs)
Pulse Basewidth (µs)
Fig. 23 - Maximum Total Energy Loss Per Pulse Characteristics
ORDERING INFORMATION TABLE
Device code
VS-
SD
60
3
C
22
S20
C
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Diode
3
-
Essential part number
4
-
3 = fast recovery
5
-
C = ceramic PUK
6
-
Voltage code x 100 = VRRM (see Voltage Ratings table)
7
-
trr code (see Recovery Characteristics table)
8
-
C = PUK case B-43
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95249
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Outline Dimensions
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Vishay Semiconductors
B-43
DIMENSIONS in millimeters (inches)
42 (1.65) DIA. MAX.
3.5 (0.14) DIA. NOM. x
1.8 (0.07) deep MIN. both ends
0.8 (0.03) MIN.
both ends
25.3 (1) DIA. MAX.
2 places
15.4 (0.61)
14.4 (0.57)
C
A
40.5 (1.59) DIA. MAX.
Note:
A = Anode
C = Cathode
Quote between upper and lower pole pieces has to be considered after
application of mounting force (see Thermal and Mechanical Specifications)
Revision: 12-Jul-17
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