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THC63LVDF84B-1SRQ

THC63LVDF84B-1SRQ

  • 厂商:

    THINE(塞恩)

  • 封装:

    TSSOP56

  • 描述:

    THC63LVDF84B-1SRQ

  • 数据手册
  • 价格&库存
THC63LVDF84B-1SRQ 数据手册
THC63LVDF84B_Rev.5.11_E THC63LVDF84B 24bit COLOR LVDS RECEIVER (Falling Edge Clock) General Description Features The THC63LVDF84B receiver supports wide VCC range as 2.5 to 3.6V. At single 2.5V supply, the THC63LVDF84B reduces EMI and power consumption. The THC63LVDF84B converts the four LVDS data streams back into 24bits of LVCMOS data with falling edge clock. At a transmit clock frequency of 85MHz, 24bits of RGB data and 4bits of timing and control data (HSYNC, VSYNC, DE, CNTL1, CNTL2) are transmitted at an effective rate of 2.38Gbps. ・1:7 LVDS to LVCMOS De-Serializer ・Operating Temperature Range : -10 to +70C ・No Special Start-up Sequence Required ・Spread Spectrum Clocking Tolerant up to 100kHz Frequency Modulation and +/-2.5% Deviations. ・Dot Clock Range: 15 to 85MHz Suited for VGA, SVGA, XGA, WXGA, 720p and 1080i. ・56pin TSSOP Package ・PLL requires no external components. ・Power Down Mode. Application ・Falling Edge Clock ・EU RoHS Compliant. ・Medium and Small Size Panel ・Tablet PC / Notebook PC ・Security Camera / Industrial Camera ・Multi Function Printer ・Industrial Equipment ・Medical Equipment Monitor Block Diagram Figure 1. Block Diagram . Copyright©2015 THine Electronics, Inc. 1/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Pin Diagram RC3 RD6 RC4 GND RC5 RC6 RD0 LVDS GND RARA+ RBRB+ LVDS VCC LVDS GND RCRC+ RCLKRCLK+ RDRD+ LVDS GND PLL GND PLL VCC PLL GND /PDWN CLKOUT RA0 GND 1 2 3 56 55 54 ● 53 52 51 50 49 4 5 6 7 8 9 48 47 46 45 10 11 12 13 14 44 43 42 41 40 15 16 17 18 39 38 37 36 35 19 20 21 22 23 34 33 32 31 30 29 24 25 26 27 28 VCC RC2 RC1 RC0 GND RB6 RD5 RD4 VCC RB5 RB4 RB3 GND RB2 RD3 RD2 VCC RB1 RB0 RA6 GND RA5 RD1 RA4 RA3 VCC RA2 RA1 Figure 2. Pin Diagram Pin Description Pin Name RA+, RARB+, RBRC+, RCRD+, RDRCLK+, RCLKRA0 ~ RA6 RB0 ~ RB6 RC0 ~ RC6 RD0 ~ RD6 CLKOUT Pin # 10, 9 12, 11 16, 15 20, 19 18, 17 Direction Type Input LVDS 27, 29, 30, 32, 33, 35, 37 38, 39, 43, 45, 46, 47, 51 53, 54, 55, 1, 3, 5, 6 7, 34, 41, 42, 49, 50, 2 26 Output /PDWN 25 Input VCC 31, 40, 48, 56 GND LVDS VCC LVDS GND 4, 28, 36, 44, 52 13 8, 14, 21 PLL VCC PLL GND 23 22, 24 Description LVDS Data Inputs LVDS Clock Inputs Pixel Data Outputs LVCOMS Power - Pixel Clock Output H : Normal Operation L : Power Down (all outputs are pulled to ground) Power Supply Pins for LVCMOS outputs and digital circuitry Ground Pins for LVCMOS outputs and digital circuitry. Power Supply Pins for LVDS inputs. Ground Pins for LVDS inputs. Power Supply Pins for PLL circuitry. Ground Pins for PLL circuitry. Table 1. Pin Description . Copyright©2015 THine Electronics, Inc. 2/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Absolute Maximum Ratings Parameter Supply Voltage (VCC) LVCMOS Input Voltage LVCMOS Output Voltage LVDS Input Pin Junction Temperature Storage Temperature Reflow Peak Temperature Reflow Peak Temperature Time Maximum Power Dissipation @+25C Min -0.3 -0.3 -0.3 -0.3 -55 - Max +4.0 VCC + 0.3 VCC + 0.3 VCC + 0.3 +125 +150 +260 10 1.9 Unit V V V V C C C sec W Table 2. Absolute Maximum Ratings Recommended Operating Conditions Symbol Ta - Parameter All Supply Voltage Operating Ambient Temperature VCC = 2.5V to 2.7V Clock Frequency VCC = 2.7V to 3.0V VCC = 3.0V to 3.6V Min 2.5 -10 20 15 15 Typ +25 - Max 3.6 +70 70 70 85 Unit V C MHz MHz MHz Table 3. Recommended Operating Conditions “Absolute Maximum Ratings” are those values beyond which the safety of the device can not be guaranteed. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics Table4, 5, 6, 7” specify conditions for device operation. “Absolute Maximum Rating” value also includes behavior of overshooting and undershooting. Equivalent LVDS Input Schematic Diagram LVDS_InP AMP LVDS_InN Figure 3. LVDS Input Schematic Diagram . Copyright©2015 THine Electronics, Inc. 3/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Power Consumption Over recommended operating supply and temperature range unless otherwise specified Symbol IRCCG IRCCW IRCCS Parameter LVDS Receiver Operating Current Gray Scale Pattern 16 (Fig.4) LVDS Receiver Operating Current Worst Case Pattern (Fig.5) LVDS Receiver Power Down Current Typ* Max Unit RL=100, CL=8pF, f=65MHz, VCC=3.3V Conditions 41 53 mA RL=100, CL=8pF, f=85MHz, VCC=3.3V 52 64 mA RL=100, CL=8pF, f=65MHz, VCC=2.5V 30 42 mA RL=100, CL=8pF, f=65MHz, VCC=3.3V 72 94 mA RL=100, CL=8pF, f=85MHz, VCC=3.3V 84 96 mA RL=100, CL=8pF, f=65MHz, VCC=2.5V 42 64 mA - 10 µA /PDWN=L *Typ values are at the conditions of Ta = +25ºC Table 4. Power Consumption 16 Grayscale Pattern CLKIN f TA0, TB1, TC2 f/16 TA1, TB2, TC3 f/8 TA2, TB3, TC4 f/4 TA3, TB4, TC5 f/2 TA4-6, TB0,5,6 TC0,1,6, TD0-2 Steady State Low TD3-6 Steady State High Figure 4. 16 Grayscale Pattern Worst Case Pattern CLKIN Tx0-6 x=A,B,C,D Figure 5. Worst Case Pattern . Copyright©2015 THine Electronics, Inc. 4/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Electrical Characteristics LVCMOS DC Specifications Over recommended operating supply and temperature range unless otherwise specified Symbol VIH VIL VOH1 VOL1 VOH2 VOL2 IIN Parameter High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Voltage High Level Output Voltage Low Level Output Voltage Input Current Conditions VCC = 3.0V to 3.6V IOH = -4mA VCC = 3.0V to 3.6V IOL = 4mA VCC = 2.5V to 3.0V IOH = -2mA VCC = 2.5V to 3.0V IOL = 2mA GND  VIN  VCC Min 2.0 GND Typ* - Max VCC 0.8 Unit V V 2.4 - - V - - 0.4 V 2.1 - - V - - 0.4 V - - 10 A Table 5. LVCMOS DC Specifications LVDS Receiver DC Specifications Over recommended operating supply and temperature range unless otherwise specified Symbol VTH VTL IIN Parameter Differential Input High Threshold Differential Input Low Threshold Input Current Conditions RL=100Ω, VIC=+1.2V VIN = +2.4 / 0V VCC = 3.6V Min -100 Typ* - Max 100 - Unit mV mV - - 10 A Table 6. LVDS Receiver DC Specifications . Copyright©2015 THine Electronics, Inc. 5/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E LVCMOS & LVDS Receiver AC Specifications Over recommended operating supply and temperature range unless otherwise specified Symbol tRCP tRCH tRCL tRCD tRS tRH tTLH tTHL tRIP1 tRIP0 tRIP6 tRIP5 tRIP4 tRIP3 tRIP2 tRPLL Parameter VCC = 2.5V to 2.7V CLKOUT VCC = 2.7V to 3.0V Transition Time VCC = 3.0V to 3.6V CLKOUT High Time CLKOUT Low Time RCLK IN to CLKOUT +/- Delay LVCMOS Data Setup to CLKOUT LVCMOS Data Hold from CLKOUT LVCMOS Low to High Transition Time LVCMOS High to Low Transition Time Input Data Position0 (T=11.76ns) Input Data Position1 (T=11.76ns) Input Data Position2 (T=11.76ns) Input Data Position3 (T=11.76ns) Input Data Position4 (T=11.76ns) Input Data Position5 (T=11.76ns) Input Data Position6 (T=11.76ns) Phase Lock Loop Set Min 14.3 14.3 11.8 0.35T - 0.3 0.45T – 1.6 -0.4 T/7-0.4 2T/7-0.4 3T/7-0.4 4T/7-0.4 5T/7-0.4 6T/7-0.4 - Typ T T T 4T/7 3T/7 5T/7 2.0 1.8 0.0 T/7 2T/7 3T/7 4T/7 5T/7 6T/7 - Max 50.0 66.6 66.6 3.0 3.0 +0.4 T/7+0.4 2T/7+0.4 3T/7+0.4 4T/7+0.4 5T/7+0.4 6T/7+0.4 10.0 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms *Typ values are at the conditions of VCC=3.3V and Ta = +25ºC Table 7. LVCMOS & LVDS Receiver AC Specifications LVCMOS Output Figure 6. CLKOUT Transmission Time . Copyright©2015 THine Electronics, Inc. 6/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E AC Timing Diagrams LVDS Input Data Position /- Figure 7. LVDS Input Data Position . Copyright©2015 THine Electronics, Inc. 7/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Phase Lock Loop Set Time /PDWN Figure 8. PLL Lock Loop Set Time . Copyright©2015 THine Electronics, Inc. 8/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E LVDS Data Timing Diagram Figure 9. LVDS Data Timing Diagram Pixel Data Mapping for JEIDA Format (6bit, 8bit Application) TX Pin TA0 TA1 TA2 TA3 TA4 TA5 TA6 TB0 TB1 TB2 TB3 TB4 TB5 TB6 TC0 TC1 TC2 TC3 TC4 TC5 TC6 TD0 TD1 TD2 TD3 TD4 TD5 TD6 6bit R2 R3 R4 R5 R6 R7 G2 G3 G4 G5 G6 G7 B2 B3 B4 B5 B6 B7 Hsync Vsync DE - 8bit R2 R3 R4 R5 R6 R7 G2 G3 G4 G5 G6 G7 B2 B3 B4 B5 B6 B7 Hsync Vsync DE R0 R1 G0 G1 B0 B1 N/A RX Pin RA0 RA1 RA2 RA3 RA4 RA5 RA6 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RD0 RD1 RD2 RD3 RD4 RD5 RD6 Note : Use TA to TC channels and open TD channel for 6bit application. Table 8. Data Mapping for JEIDA Format . Copyright©2015 THine Electronics, Inc. 9/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Pixel Data Mapping for VESA Format (6bit, 8bit Application) TX Pin TA0 TA1 TA2 TA3 TA4 TA5 TA6 TB0 TB1 TB2 TB3 TB4 TB5 TB6 TC0 TC1 TC2 TC3 TC4 TC5 TC6 TD0 TD1 TD2 TD3 TD4 TD5 TD6 6bit R0 R1 R2 R3 R4 R5 G0 G1 G2 G3 G4 G5 B0 B1 B2 B3 B4 B5 Hsync Vsync DE - 8bit R0 R1 R2 R3 R4 R5 G0 G1 G2 G3 G4 G5 B0 B1 B2 B3 B4 B5 Hsync Vsync DE R6 R7 G6 G7 B6 B7 N/A RX Pin RA0 RA1 RA2 RA3 RA4 RA5 RA6 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RD0 RD1 RD2 RD3 RD4 RD5 RD6 Note : Use TA to TC channels and open TD channel for 6bit application. Table 9. Data Mapping for VESA Format . Copyright©2015 THine Electronics, Inc. 10/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Normal Connection with JEIDA Format Figure 10. Typical Connection Diagram . Copyright©2015 THine Electronics, Inc. 11/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Notes 1) Cable Connection and Disconnection Do not connect and disconnect the LVDS cable, when the power is supplied to the system. 2) GND Connection Connect each GND of the PCB which THC63LVDM83D and LVDS-Rx on it. reduction to place GND cable as close to LVDS cable as possible. It is better for EMI 3) Multi Drop Connection Multi drop connection is not recommended. Figure 11. Multi Drop Connection 4) Asynchronous use Asynchronous using such as following systems is not recommended. Figure 12. Asynchronous Use . Copyright©2015 THine Electronics, Inc. 12/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Package Figure 13. Package Diagram . Copyright©2015 THine Electronics, Inc. 13/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Reference Land Pattern CY1= 10.34 HE= e= 8.100 0.500 E= 6.10 Package Land Pattern Ttyp.= 0.60 Gmin= 5.50 1.90 b= 0.200 Zmax= Xmax= 0.470 9.30 Zmax/2 Unit mm Figure 14. Reference of Land Pattern The recommendation mounting method of THine device is reflow soldering. The reference pattern is using the calculation result on condition of reflow soldering. Notes This land pattern design is a calculated value based on JEITA ET-7501. Please take into consideration in an actual substrate design about enough the ease of mounting, the intensity of connection, the density of mounting, and the solder paste used, etc… The optimal land pattern size changes with these parameters. Please use the value shown by the land pattern as reference data. . Copyright©2015 THine Electronics, Inc. 14/15 THine Electronics, Inc. Security E THC63LVDF84B_Rev.5.11_E Notices and Requests 1. The product specifications described in this material are subject to change without prior notice. 2. The circuit diagrams described in this material are examples of the application which may not always apply to the customer's design. We are not responsible for possible errors and omissions in this material. Please note if errors or omissions should be found in this material, we may not be able to correct them immediately. 3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties the contents of this material without our prior permission is prohibited. 4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will be exempted from the responsibility unless it directly relates to the production process or functions of the product. 5. Product Application 5.1 Application of this product is intended for and limited to the following applications: audio-video device, office automation device, communication device, consumer electronics, smartphone, feature phone, and amusement machine device. This product must not be used for applications that require extremely high-reliability/safety such as aerospace device, traffic device, transportation device, nuclear power control device, combustion chamber device, medical device related to critical care, or any kind of safety device. 5.2 This product is not intended to be used as an automotive part, unless the product is specified as a product conforming to the demands and specifications of ISO/TS16949 ("the Specified Product") in this data sheet. THine Electronics, Inc. (“THine”) accepts no liability whatsoever for any product other than the Specified Product for it not conforming to the aforementioned demands and specifications. 5.3 THine accepts liability for demands and specifications of the Specified Product only to the extent that the user and THine have been previously and explicitly agreed to each other. 6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently redundant or error preventive design applied to the use of the product so as not to have our product cause any social or public damage. 7. Please note that this product is not designed to be radiation-proof. 8. Testing and other quality control techniques are used to this product to the extent THine deems necessary to support warranty for performance of this product. Except where mandated by applicable law or deemed necessary by THine based on the user’s request, testing of all functions and performance of the product is not necessarily performed. 9. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under the Foreign Exchange and Foreign Trade Control Law. 10. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or malfunction, if pins of the product are shorted by such as foreign substance. The damages may cause a smoking and ignition. Therefore, you are encouraged to implement safety measures by adding protection devices, such as fuses. THine Electronics, Inc. sales@thine.co.jp . Copyright©2015 THine Electronics, Inc. 15/15 THine Electronics, Inc. Security E
THC63LVDF84B-1SRQ 价格&库存

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THC63LVDF84B-1SRQ
    •  国内价格
    • 1+10.14120
    • 10+8.79120
    • 30+7.93800
    • 100+6.65280

    库存:0