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SN74BCT2827C - 10-BIT BUS/MOS MEMORY DRIVERS WITH 3-STATE OUTPUTS - Texas Instruments

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SN74BCT2827C
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TI[TexasInstruments]
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SN74BCT2827C - 10-BIT BUS/MOS MEMORY DRIVERS WITH 3-STATE OUTPUTS - Texas Instruments
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SN54BCT2827C, SN74BCT2827C 10-BIT BUS/MOS MEMORY DRIVERS WITH 3-STATE OUTPUTS SCBS007E – APRIL 1987 – REVISED NOVEMBER 1993 • • • • • • • • BiCMOS Design Substantially Reduces ICCZ Output Ports Have Equivalent 25-Ω Resistors; No External Resistors Are Required Specifically Designed to Drive MOS DRAMs 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Power-Up High-Impedance State ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015 Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT) SN54BCT2827C . . . JT OR W PACKAGE SN74BCT2827C . . . DW OR NT PACKAGE (TOP VIEW) OE1 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VCC Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 OE2 SN54BCT2827C . . . FK PACKAGE (TOP VIEW) These 10-bit buffers and bus drivers are specifically designed to drive the capacitive input characteristics of MOS DRAMs. They provide high-performance bus interface for wide data paths or buses carrying parity. The 3-state control gate is a 2-input AND gate with active-low inputs so if either output-enable (OE1 or OE2) input is high, all ten outputs are in the high-impedance state. The outputs are also in the high-impedance state during power-up and power-down conditions. The outputs remain in the high-impedance state while the device is powered down. The SN54BCT2827C is characterized for operation over the full military temperature range of – 55°C to 125°C. The SN74BCT2827C is characterized for operation from 0°C to 70°C. FUNCTION TABLE INPUTS OE1 L L H X OE2 L L X H A L H X X A3 A4 A5 NC A6 A7 A8 5 6 7 8 9 A2 A1 4 description 3 2 1 28 27 26 OE1 NC VCC Y1 Y2 25 24 23 22 21 10 20 11 19 12 13 14 15 16 17 18 Y3 Y4 Y5 NC Y6 Y7 Y8 NC - No internal connection OUTPUT Y L H Z Z PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 A9 A10 GND NC Copyright © 1993, Texas Instruments Incorporated OE2 Y10 Y9 2–1 SN54BCT2827C, SN74BCT2827C 10-BIT BUS/MOS MEMORY DRIVERS WITH 3-STATE OUTPUTS SCBS007E – APRIL 1987 – REVISED NOVEMBER 1993 logic symbol† 1 OE1 OE2 13 & EN logic diagram (positive logic) OE1 OE2 1 13 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 2 3 4 5 6 7 8 9 10 11 1 23 22 21 20 19 18 17 16 15 14 A1 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 2 23 Y1 To Nine Other Channels † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for the DW, JT, NT, and W packages. schematic of each output VCC Output GND 2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54BCT2827C, SN74BCT2827C 10-BIT BUS/MOS MEMORY DRIVERS WITH 3-STATE OUTPUTS SCBS007E – APRIL 1987 – REVISED NOVEMBER 1993 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . – 0.5 V to 5.5 V Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC Input clamp current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mA Operating free-air temperature range: SN54BCT2827C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C SN74BCT2827C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input negative-voltage rating may be exceeded if the input clamp current rating is observed. recommended operating conditions SN54BCT2827C MIN VCC VIH VIL IIK IOH IOL TA Supply voltage High-level input voltage Low-level input voltage Input clamp current High-level output current Low-level output current Operating free-air temperature – 55 4.5 2 0.8 – 18 –1 12 125 0 NOM 5 MAX 5.5 SN74BCT2827C MIN 4.5 2 0.8 – 18 –1 12 70 NOM 5 MAX 5.5 UNIT V V V mA mA mA °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL IOZH IOZL IOL(sink) II IIH IIL IO§ ICCL ICCZ Ci TEST CONDITIONS CONDITIONS VCC = 4.5 V, VCC = 4.5 V to 5.5 V, VCC = 4.5 V VCC = 5.5 V, VCC = 5.5 V, VCC = 4.5 V, VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 V, VCC = 5 V, II = – 18 mA IOH = – 1 mA IOL = 1 mA IOL = 12 mA VO = 2.7 V VO = 0.5 V VO = 2 V VI = 7 V VI = 2.7 V VI = 0.5 V VO = 2.25 V Outputs open Outputs open VI = 2.5 V or 0.5 V VI = 2.5 V or 0.5 V – 30 28 3.8 5 50 0.1 20 – 0.2 – 112 40 6 – 30 28 3.8 5 MIN SN54BCT2827C TYP‡ MAX – 1.2 VCC –2 0.15 0.35 0.5 0.8 20 – 20 50 0.1 20 – 0.2 – 112 40 6 VCC –2 0.15 0.35 0.5 0.8 20 – 20 MIN SN74BCT2827C TYP‡ MAX – 1.2 UNIT V V V µA µA mA mA µA mA mA mA mA pF Co VCC = 5 V, 8 8 pF ‡ All typical values are at VCC = 5 V, TA = 25°C. § The output conditions have been chosen to produce a current that closely approximates one half of the true short circuit output current, IOS. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–3 SN54BCT2827C, SN74BCT2827C 10-BIT BUS/MOS MEMORY DRIVERS WITH 3-STATE OUTPUTS SCBS007E – APRIL 1987 – REVISED NOVEMBER 1993 switching characteristics (see Note 2) VCC = 5 V, CL = 50 pF, R1 = 500 Ω, R2 = 500 Ω, TA = 25°C ′BCT2827C MIN tPLH tPHL tPZH tPZL tPHZ tPLZ A Y Y Y 0.9 2 2.8 5 3.2 2.7 TYP 3.6 5.1 5.6 8.9 6.7 5.3 MAX 5.2 7.2 8 11 8.5 10.5 VCC = 4.5 V to 5.5 V, CL = 50 pF, R1 = 500 Ω, R2 = 500 Ω, TA = MIN to MAX† SN54BCT2827C MIN 0.9 2 2.8 5 3.2 2.7 MAX 6.6 8.2 10.7 13.7 14 11 SN74BCT2827C MIN 0.9 2 2.8 5 3.2 2.7 MAX 6 7.8 10.7 12.9 13 10 ns ns ns PARAMETER FROM (INPUT) TO (OUTPUT) UNIT OE OE † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and voltage waveforms are shown in Section 1. 2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device SN74BCT2827CDW SN74BCT2827CDWE4 SN74BCT2827CDWG4 SN74BCT2827CDWR SN74BCT2827CDWRE4 SN74BCT2827CDWRG4 SN74BCT2827CNSR SN74BCT2827CNSRE4 SN74BCT2827CNSRG4 SN74BCT2827CNT SN74BCT2827CNTE4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SOIC SOIC SOIC SOIC SOIC SO SO SO PDIP PDIP Package Drawing DW DW DW DW DW DW NS NS NS NT NT Pins Package Eco Plan (2) Qty 24 24 24 24 24 24 24 24 24 24 24 25 25 25 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 15 15 Pb-Free (RoHS) Pb-Free (RoHS) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) 330 330 Reel Width (mm) 24 24 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 12 12 W Pin1 (mm) Quadrant 24 24 Q1 Q1 SN74BCT2827CDWR SN74BCT2827CNSR DW NS 24 24 SITE 60 SITE 41 10.75 8.2 15.7 15.4 2.7 2.5 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device SN74BCT2827CDWR SN74BCT2827CNSR Package DW NS Pins 24 24 Site SITE 60 SITE 41 Length (mm) 346.0 346.0 Width (mm) 346.0 346.0 Height (mm) 41.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MPDI004 – OCTOBER 1994 NT (R-PDIP-T**) 24 PINS SHOWN PLASTIC DUAL-IN-LINE PACKAGE A DIM 24 13 PINS ** 24 1.260 (32,04) 1.230 (31,24) 0.310 (7,87) 0.290 (7,37) 28 1.425 (36,20) 1.385 (35,18) 0.315 (8,00) 0.295 (7,49) A MAX 0.280 (7,11) 0.250 (6,35) A MIN B MAX 1 0.070 (1,78) MAX 12 B MIN 0.020 (0,51) MIN B 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0.010 (0,25) NOM 0°– 15° 4040050 / B 04/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers RFID Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated

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