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TRS3237E - 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER - Texas Instruments

型  号:
TRS3237E
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TI[TexasInstruments]
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TRS3237E - 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER - Texas Instruments
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TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER www.ti.com SLLS796 – JUNE 2007 FEATURES • • • • • • • • Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates From 250 kbits/s to 1 Mbit/s Low Standby Current . . . 1 μA Typical External Capacitors . . . 4 × 0.1 μF Accepts 5-V Logic Input With 3.3-V Supply Designed to Be Interchangeable With Industry Standard '3237E Devices Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection for RS-232 I/O Pins and Logic Input pins – ±15 kV – Human-Body Model (HBM) – ±8 kV – IEC61000-4-2, Contact Discharge – ±15 kV – IEC61000-4-2, Air-Gap Discharge APPLICATIONS • • • • • Battery-Powered, Hand-Held, and Portable Equipment PDAs and Palmtop PCs Notebooks, Sub-Notebooks, and Laptops Digital Cameras Mobile Phones and Wireless Devices RHB PACKAGE (TOP VIEW) DB, DW, OR PW PACKAGE (TOP VIEW) 14 15 N.C.– Not internally connected DESCRIPTION/ORDERING INFORMATION The TRS3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode (MBAUD = GND) and 1Mbit/s when MBAUD = VCC. The driver output slew rate is a maximum of 30 V/μs. The TRS3237E transmitters are disabled and the outputs are forced into high-impedance state when the device is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 μA. Also, during shutdown, the onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting enable (EN) high. ROUT1B remains active all the time, regardless of the EN and SHDN condition. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. DOUT5 EN SHDN MBAUD N.C. ROUT1B DIN5 N.C. C2 + GND C2− V− DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 DOUT5 EN SHDN 1 2 3 4 5 6 7 8 9 10 11 12 13 28 27 26 25 24 23 22 21 20 19 18 17 16 C1+ V+ VCC C1− DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B MBAUD 32 31 30 29 28 27 26 25 DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 N.C. V− C2– GND C2+ C1+ V+ VCC N.C. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 24 23 22 21 20 19 18 17 C1– DIN1 IN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 Copyright © 2007, Texas Instruments Incorporated TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) The TRS3237EC is characterized for operation from 0°C to 70°C. The TRS3237EI is characterized for operation from –40°C to 85°C. ORDERING INFORMATION TA SSOP – DB 0°C to 70°C SOIC – DW TSSOP – PW QFN – RHB SSOP – DB –40°C to 85°C SOIC – DW TSSOP – PW QFN – RHB (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TRS3237ECDBR TRS3237ECDWR TRS3237ECPWR TRS3237ECRHBR TRS3237EIDBR TRS3237EIDWR TRS3237EIPWR TRS3237EIRHBR TOP-SIDE MARKING TRS3237EC TRS3237EC RS37EC PREVIEW TRS3237EI TRS3237EI RS37EI PREVIEW Reel of 2000 Reel of 2000 Reel of 2000 Reel of 2000 Reel of 2000 Reel of 2000 Reel of 2000 Reel of 2000 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE INPUTS SHDN 0 0 1 1 (1) EN 0 1 0 1 DOUT Z (1) OUTPUTS ROUT Active Z (1) Active Z (1) ROUT1B Active Active Active Active Z (1) Active Active Z = high impedance (off) 2 Submit Documentation Feedback www.ti.com TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 24 5 DOUT1 DIN2 23 6 DOUT2 DIN3 22 7 DOUT3 DIN4 19 10 DOUT4 DIN5 17 12 DOUT5 SHDN 14 MBAUD 15 ROUT1B 16 ROUT1 21 8 RIN1 ROUT2 20 9 RIN2 ROUT3 18 11 RIN3 EN 13 Submit Documentation Feedback 3 TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC V+ V– V+ – V– VI VO Supply voltage range (2) Positive-output supply voltage range (2) Negative-output supply voltage range Supply voltage difference (2) Input voltage range Output voltage range Short-circuit duration θJA Tstg (1) (2) (3) Package thermal impedance (3) Lead temperature 1,6 mm (1/16 in) from case for 10 s Storage temperature range –65 Driver (SHDN, MBAUD, EN) Receiver Driver Receiver DOUT to GND –0.3 –25 –13.2 –0.3 (2) MAX 6 7 –7 13 6 25 13.2 VCC + 0.3 Unlimited 62 260 150 UNIT V V V V V V –0.3 –0.3 0.3 °C/W °C °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 5 MIN Supply voltage VIH VIL VI TA (1) Driver and control high-level input voltage Driver and control low-level input voltage Receiver input voltage Operating free-air temperature Test conditions are C1–C4 = 0.1 μF at VCC = 3 V to 5 V. TRS3237EC TRS3237EI DIN, SHDN, MBAUD, EN DIN, SHDN, MBAUD, EN VCC = 3.3 V VCC = 5 V VCC = 3.3 V VCC = 5 V 3 4.5 2 2.4 0 –25 0 –40 NOM 3.3 5 MAX 3.6 5.5 5.5 5.5 0.8 25 70 85 UNIT V V V V °C Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER II Input leakage current Supply current (TA = 25°C) DIN, SHDN, MBAUD, EN No load, SHDN = VCC ICC SHDN = GND Shutdown supply current SHDN = RIN = GND, DIN = GND or VCC TEST CONDITIONS MIN TYP (2) 9 0.5 1 10 MAX 18 2 10 300 UNIT μA mA μA nA (1) (2) Test conditions are C1–C4 = 0.1 μF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 4 Submit Documentation Feedback www.ti.com TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 DRIVER SECTION xxx Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER VOH VOL IIH IIL IOS ro (1) (2) (3) High-level output voltage Low-level output voltage High-level input current Low-level input current Short-circuit output current (3) Output resistance TEST CONDITIONS DOUT at RL = 3 kΩ to GND, DOUT at RL = 3 kΩ to GND, VI = VCC VI at GND VCC = 3.6 V or 3.3 V, VCC, V+, and V– = 0 V, VO = 0 V VO = ±2 V 300 50k DIN = GND DIN = VCC MIN TYP (2) 5 –5 5.4 –5.4 ±0.01 ±0.01 ±1 ±1 ±60 MAX UNIT V V μA μA mA Ω Test conditions are C1–C4 = 0.1 μF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER CL = 1000 pF, MBAUD = GND Maximum data rate CL = 1000 pF, VCC = 4.5 V to 5.5 V, MBAUD = VCC CL = 250 pF, VCC = 3 V to 4.5 V, MBAUD = VCC tsk(p) Pulse skew (3) Slew rate, transition region (see Figure 1) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, MBAUD = VCC or GND, See Figure 2 VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, TA = 25°C CL = 150 pF to 1000 pF CL = 150 pF to 2500 pF, MBAUD = GND MBAUD = VCC MBAUD = GND 6 24 4 RL = 3 kΩ, 1 DIN switching, See Figure 1 TEST CONDITIONS MIN 250 1000 TYP (2) MAX UNIT kbit/s 1000 100 30 150 30 V/μs ns SR(tr) (1) (2) (3) Test conditions are C1–C4 = 0.1 μF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback 5 TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 www.ti.com RECEIVER SECTION xxx Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER VOH VOL VIT+ VIT– Vhys Ioz ri (1) (2) High-level output voltage Low-level output voltage Positive-going input threshold voltage Negative-going input threshold voltage Input hysteresis (VIT+ – VIT–) Output leakage current Input resistance EN = VCC VI = ±3 V to ±25 V 3 TEST CONDITIONS IOH = –1 mA IOL = 1 mA VCC = 3.3 V VCC = 5 V VCC = 3.3 V VCC = 5 V 0.6 0.8 1.5 2 1.1 1.5 0.5 ±0.05 5 ±10 7 MIN VCC – 0.6 TYP (2) VCC – 0.1 0.4 2.4 2.4 MAX UNIT V V V V V μA kΩ Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER tPLH tPHL ten tdis tsk(p) (1) (2) (3) Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Output enable time Output disable time Pulse skew (3) TEST CONDITIONS CL = 150 pF, See Figure 3 CL = 150 pF, See Figure 3 CL = 150 pF, RL = 3 kΩ, See Figure 4 CL = 150 pF, RL = 3 kΩ, See Figure 4 See Figure 3 TYP (2) 150 150 2.6 2.4 50 UNIT ns ns μs μs ns Test conditions are C1–C4 = 0.1 μF at VCC = 3 V to 5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection PIN HBM DIN, RIN, ROUT IEC61000-4-2, Contact Discharge IEC61000-4-2, Air-Gap Discharge TEST CONDITIONS TYP ±15 ±8 ±15 kV UNIT 6 Submit Documentation Feedback www.ti.com TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION 3V RS-232 Output 50 Ω RL 3V SHDN = VCC TEST CIRCUIT SR(tr) + CL (see Note A) Output 6V t THL or tTLH Input 0V tTHL 3V −3 V 3V −3 V tTLH VOH VOL Generator (see Note B) VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V RS-232 Output 50 Ω RL 3V SHDN = VCC TEST CIRCUIT CL (see Note A) Output Input 1.5 V 1.5 V 0V tPHL 50% VOLTAGE WAVEFORMS tPLH VOH 50% VOL Generator (see Note B) NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3 V or 0 V EN = GND Output Generator (see Note B) 50 Ω 3V EN = GND TEST CIRCUIT tPHL CL (see Note A) Output 50% VOLTAGE WAVEFORMS 50% VOL tPLH VOH Input 3V 1.5 V 1.5 V −3 V NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback 7 TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3V Input VCC 3 V or 0 V S1 RL 3 V or 0 V Output Output EN Generator (see Note B) 50 Ω CL (see Note A) 0.3 V tPLZ (S1 at VCC) 0.3 V Output TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS 50% VOL tPZL (S1 at VCC) 50% GND tPHZ (S1 at GND) 1.5 V 1.5 V −3 V tPZH (S1 at GND) VOH CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 8 Submit Documentation Feedback www.ti.com TRS3237E 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER SLLS796 – JUNE 2007 APPLICATION INFORMATION CBYPASS = 0.1 µF + − 1 + C2 − 3 4 − + C4 DOUT1 5 C2− V− C1− VCC 26 25 24 2 C2+ V+ GND C1+ 28 27 + − C3† + − C1 DIN1 DOUT2 6 23 DIN2 DOUT3 7 22 DIN3 RIN1 RS-232 Port RIN2 8 5 kΩ 9 5 kΩ 21 ROUT1 20 ROUT2 Logic I/Os DOUT4 RIN3 10 19 DIN4 11 5 kΩ 18 ROUT3 DOUT5 12 17 DIN5 16 ROUT1B EN SHDN 13 14 15 MBAUD † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC 3.3 V ± 0.15 V 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V C1 0.1 µF 0.22 µF 0.047 µF 0.22 µF C2, C3, and C4 0.1 µF 0.22 µF 0.33 µF 1 µF Figure 5. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback 9 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 PACKAGING INFORMATION Orderable Device TRS3237ECDB TRS3237ECDBG4 TRS3237ECDBR TRS3237ECDBRG4 TRS3237ECDW TRS3237ECDWG4 TRS3237ECDWR TRS3237ECDWRG4 TRS3237ECPW TRS3237ECPWG4 TRS3237ECPWR TRS3237ECPWRG4 TRS3237EIDB TRS3237EIDBG4 TRS3237EIDBR TRS3237EIDBRG4 TRS3237EIDW TRS3237EIDWG4 TRS3237EIDWR TRS3237EIDWRG4 TRS3237EIPW TRS3237EIPWG4 TRS3237EIPWR TRS3237EIPWRG4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP Package Drawing DB DB DB DB DW DW DW DW PW PW PW PW DB DB DB DB DW DW DW DW PW PW PW PW Pins Package Eco Plan (2) Qty 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 20 20 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 20 20 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) The marketing status values are defined as follows: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) 330 330 330 330 Reel Width (mm) 16 32 16 32 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 12 16 12 16 W Pin1 (mm) Quadrant 16 32 16 32 Q1 Q1 Q1 Q1 TRS3237ECDBR TRS3237ECDWR TRS3237EIDBR TRS3237EIDWR DB DW DB DW 28 28 28 28 SITE 41 SITE 60 SITE 41 SITE 60 8.2 11.35 8.2 11.35 10.5 18.67 10.5 18.67 2.5 3.1 2.5 3.1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device TRS3237ECDBR TRS3237ECDWR TRS3237EIDBR TRS3237EIDWR Package DB DW DB DW Pins 28 28 28 28 Site SITE 41 SITE 60 SITE 41 SITE 60 Length (mm) 346.0 346.0 346.0 346.0 Width (mm) 346.0 346.0 346.0 346.0 Height (mm) 33.0 49.0 33.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) 28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M PLASTIC SMALL-OUTLINE 0,25 0,09 5,60 5,00 8,20 7,40 Gage Plane 1 A 14 0°– 8° 0,25 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** DIM A MAX 14 16 20 24 28 30 38 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0°– 8° 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers RFID Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated

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