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XC3202B183MR-G

XC3202B183MR-G

  • 厂商:

    TOREX(特瑞仕)

  • 封装:

    SOT-23

  • 描述:

    Digital Switch Omnipolar Switch Push-Pull Hall Effect SOT-23D

  • 数据手册
  • 价格&库存
XC3202B183MR-G 数据手册
XC3202B series is Not Recommended for New Designs. XC3202B Series ETR2602-005a Low Power Consumption Hall IC (Magnetic Sensor) ■GENERAL DESCRIPTION The XC3202B series is a Hall effect magnetic sensor IC with a built-in CMOS output driver. The device features low power consumption and small packaging which is ideally suited for battery powered portable applications such as mobile phones, electronic dictionaries and handheld game consoles. When the magnetic flux density is higher than the operating point (Bop), the Low level signal is output. The High level signal is output when the magnetic flux density is lower than the release point (Brp). ■APPLICATIONS ■FEATURES ●Cover detectors ●Mobile phones ●Electronic dictionaries ●Portable game consoles ●Home electronics (refrigerators, washing machines etc) ■TYPICAL APPLICATION CIRCUIT VDD Supply Voltage Range : 2.4~5.5V Average Supply Current Operating Point : 8μA : South Pole 3mT(TYP.) Release point North Pole : South Pole -3mT(TYP.) 2mT(TYP.) North Pole -2mT(TYP.) Hysteresis Width : South Pole 1mT(TYP.) North Pole 1mT(TYP.) Packages : SOT-23D Environmentally Friendly QFN-0601 : EU RoHS Compliant, Pb Free ■ TYPICAL PERFORMANCE CHARACTERISTICS VOUT XC 3202 OUTPUT VSS C: Capacitor to stabilize input voltage and decrease noise. Recommendation value: 10nF~100nF Average Supply Current:IDD (μA) ●Supply Current (avg) vs. Ambient Temperature 40 30 VIN=5.5V 20 3.0V 10 2.4V 0 -40 -20 0 20 40 60 80 Ambient Temperature:Ta (℃) 100 1/9 XC3202B series is Not Recommended for New Designs. XC3202B Series ■PIN CONFIGURATION VSS 3 1 2 VDD VOUT NC 6 1 VDD VSS 5 2 NC NC 4 3 VOUT QFN-0601 (BOTTOM VIEW) SOT-23D (TOP VIEW) ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 1 VDD Power Input 2 3 VOUT Output Pin 3 5 VSS Ground - 2,4,6 NC No Connection SOT-23D QFN-0601 1 ■PRODUCT CLASSIFICATION ●Ordering Information XC3202①②③④⑤⑥-⑦(*1) DESIGNATOR ITEM SYMBOL ① Product Type B ②③④ Product No. 183 ⑤⑥-⑦ Packages (Order Unit) (*1) 2/9 DESCRIPTION CMOS Output Based on the internal standard MR-G SOT-23D (3,000/Reel) ZR-G QFN-0601 (3,000/Reel) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. XC3202B XC3202B series is Not Recommended for New Designs. Series ■BLOCK DIAGRAMS VDD Power switch Offset Cancelling Hall Plate Amp Latch VOUT Logical Offset Cancelling Hall Plate Amp Latch VSS ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ PARAMETER SYMBOL RATINGS UNITS Supply Voltage VDD 7 V Magnetic Flux Density B Unlimited - Operating Temperature Range Topr -40~+85 ℃ Storage Temperature Range Tstg -55~+150 ℃ SOT-23D Power Dissipation QFN-0601 150 Pd mW 120 Maximum Junction Temperature Tjc 125 ℃ Maximum Output Current IOUT 40 mA (*1) This IC should be used within the stated absolute maximum ratings in order to prevent damage. ■ELECTRICAL CHARACTERISTICS Ta=25℃ PARAMETER SYMBOL CONDITONS MIN. TYP. MAX. UNITS CIRCUIT Output ON Voltage (High) VOUT_H VDD=3V, IOUT=-1mA VDD-0.2 - - Output ON Voltage (Low) VOUT_L Supply Current IDD (en) IDD (dis) IDD (avg) VDD=3V, IOUT=1mA VDD=3V VDD=3V VDD=3V - 3 5 8 0.1 6 10 16 V ③ mA μA μA ② ① ② Detection Time (*1) t_awake VDD=3V - 75 150 μs Detection Period (*1) t_period VDD=3V - 75 150 ms Duty Cycle DTY - 0.1 - % Power Supply Voltage VDD 2.4 - 5.5 V ② ② (*1) Normal operation starts 150ms later from the supply voltage (VDD=2.4~5.5V) (*2) For supply current, detection time, and detection period, please refer to the below. t_period IDD(en) t_awake IDD(dis) 両極探知ホールICは間欠動作によって消費電流を低減しています。 The Hall IC is operated intermittently to reduce supply current. 検出動作時間内で磁気の探知を行い検出動作時間以外はHall Plate,Latchなどの探知回路を OFFにして電流を抑えています。 Measurement is done during detection time, in the rest period sensing circuits of Hall plate and latch are turned off to minimize the current. 3/9 XC3202B series is Not Recommended for New Designs. XC3202B Series ■MAGNETIC STATE CHARACTERISTICS PARAMETER SYMBOL MIN. Ta=25℃, VDD=3V, 1mT=10Gauss TYP. MAX. UNITS CIRCUIT Operating Magnetic Flux Density: South Pole Bops 2 3 4 mT ③ Operating Magnetic Flux Density: North Pole Bopn -4 -3 -2 mT ③ Release Magnetic Flux Density: South Pole Brps 1 2 - mT ③ Release Magnetic Flux Density: North Pole Hysteresis Width Brpn Bhy(Bop-Brp) 0.5 -2 1 -1 - mT mT ③ ③ * Characteristics Values are guaranteed in design. The values may be affected by the conditions such as temperature and mounting. ●Magnetic field and detect surface The IC Hall plates detect the perpendicular magnetic field so that IC surface should be placed in a direction perpendicular to the magnetic field. ■OPERATIONAL ●Operating by flux density Bhy ON Bhy OFF OFF (on-state) Bopn (off-state) VDD Output Voltage Output Voltage VDD (off-state) ON (on-state) Brpn 0 0 North Pole magnetic flux density Brps Bops South Pole magnetic flux density ●Timing chart t_period Time IDD t_period Time I DD t_awake Time t_awake Time Time Time B B Bop Brp V OUT High V OUT *1 Low High *2 Low *1: When the magnetic flux density to the IC becomes larger than Bop, the IC goes into an on-state and outputs a low signal (VOUT=Low) at the leading edge of the next “tawake” pulse. *2: When the magnetic flux density to the IC becomes lower than Brp, the IC goes into an off-state and outputs a high signal (VOUT=High) at the leading edge of the next “tawake” pulse. During the other periods, the previous state is maintained. 4/9 XC3202B series is Not Recommended for New Designs. XC3202B Series ■NOTES ON USE 1. The magnetic flux density will be changed when an external capacitor (CIN) is connected between VDD and VSS. North Pole Magnetic Flux Density vs. Input Capacitance (CIN) North Pole magnetic flux density VIN=3V,Ta=25℃ magnetic flux density(mT) -4.0 -3.5 Operating -3.0 -2.5 -2.0 Release -1.5 -1.0 -0.5 0.0 0.001 0.01 0.1 1 10 Ceramic Capacitor CIN(μF) South Pole Magnetic Flux Density vs. Input Capacitance (CIN) South Pole magnetic flux density VIN=3V,Ta=25℃ magnetic flux density(mT) 4.0 3.5 Operating 3.0 2.5 2.0 Release 1.5 1.0 0.5 0.0 0.001 0.01 0.1 1 10 Ceramic Capacitor CIN(μF) 2. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 3. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 5/9 XC3202B series is Not Recommended for New Designs. XC3202B Series ■TEST CIRCUITS 測定回路 Circuit ① 1 1.VDD 3.VOUT V 2.VSS A Circuit ② 測定回路 2 1.VDD 3.VOUT 2.VSS OSC OSC: Oscilloscope Circuit ③ 測定回路 3 Bcoil Vcoil 1.VDD 3.VOUT 2.VSS OSC OSC: Oscilloscope 6/9 XC3202B XC3202B series is Not Recommended for New Designs. Series ■PACKAGING INFORMATION ●Sensor Position ●SOT-23D 3.0±0.1 0.4 +0.1 -0.05 3 0.45±0.1 0~0.1 2 1 0.8 2.85±0.15 1.6±0.1 3 (1.9) 1 1.5 2 0.65 1.15±0.15 0.15±0.05 (0.95) ●Sensor Position ●QFN-0601 1.0mm +0.075 2.0-0.05 +0.075 2.0 -0.05 0~0.05 0.65mm 0.43mm 1.55±0.1 1 2 3 6 5 4 R0 .1 0.35±0.05 0.86±0. 1 0.6±0.03 1pin INDENT (0.65) 0.25±0.05 7/9 XC3202B series is Not Recommended for New Designs. XC3202B Series ■ MARKING RULE ●SOT-23D SC59(SOT-23D) ●SOT-23D / QFN-0601 ① represents product series 3 r ① MARK PRODUCTS SERIES 2 XC3202******-G ② ③ ④ ⑤ 2 1 ●QFN-0601 DFN2020-6(QFN-0601)(開発中) ② represents product registration. MARK PRODUCTS SERIES 3 XC3202B183 ① ② ④ ③ ⑤ 1pin→ ③ represents a least significant digit of production year (ex.) MARK PRODUCTION YEAR 0 2010 1 2011 ④ represents production month. MARK PRODUCTION MONTH MARK PRODUCTION MONTH MARK PRODUCTION MONTH A January E May J September B February F June K October C March G July L November D April H August M December ⑤ represents production lot number. A~Z repeated. (G, I, J, O, Q, W excluded) 8/9 XC3202B series is Not Recommended for New Designs. XC3202B Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 9/9
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