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XCL101A271ER-G

XCL101A271ER-G

  • 厂商:

    TOREX(特瑞仕)

  • 封装:

    CL-2025-02

  • 描述:

    DC DC CONVERTER 2.7V 0.3W

  • 数据手册
  • 价格&库存
XCL101A271ER-G 数据手册
XCL100/XCL101 Series ETR28004-006a Inductor Built-in Step-up “micro DC/DC” Converter ☆Green Operation Compatible ■GENERAL DESCRIPTION The XCL100/XCL101 series is a synchronous step-up micro DC/DC converter which integrates an inductor and a control IC in one tiny package (2.5mm×2.0mm, h=1.0mm). A stable step-up power supply is configured using only two capacitors connected externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring. The XCL100/XCL101 series can be used in applications that start from a single alkaline or nickel-metal hydride battery because the input voltage range is 0.7V ~ 5.5V. The output voltage can be set from 1.8V to 5.0V (±2.0%) in steps of 0.1V. PFM control enables a low quiescent current, making these products ideal for portable devices that require high efficiency. The XCL100/XCL101 features a load disconnect function to break continuity between the input and output at shutdown (A,B Type), and a bypass mode function to maintain continuity between the input and output (C Type). ■FEATURES ■APPLICATIONS ●Wearable devices Input Voltage Range : Output Voltage Range : Operating hold voltage 0.7V~5.5V Start-up voltage ●Mobile phones, Smart phones ●Mouses, Keyboards 0.9V~5.5V XCL100 3.0V ~ 5.0V (±2.0%) XCL101 1.8V ~ 5.0V (±2.0%) ●Remote controls Output Current : 80mA@VOUT=3.3V, VBAT=1.8V ●Portable information devices Supply Current : 6.3μA (VBAT=VOUT+0.5V) Control Method : PFM Control PFM Switching Current : 350mA Functions : Load Disconnection or ●Game consoles Bypass Mode CL Discharge ■TYPICAL APPLICATION CIRCUIT Output Capacitor : Ceramic Capacitor Compatible Operating Ambient Temperature : -40ºC ~ 85ºC Package : CL-2025, CL-2025-02 Environmentally Friendly : EU RoHS Compliant, Pb Free ■ TYPICAL PERFORMANCE CHARACTERISTICS XCL101C501BR-G 7 L1 CL 10μF 1 Lx VSS 6 2 VOUT NC 5 3 VBAT CE 4 80 VCE 8 L2 VIN Efficiency:EFFI(%) VOUT 100 4.2V 3.6V 60 VIN= 3.0V 40 20 CIN 10μF (TOP VIEW) “L1 and Lx”, “L2 and VBAT” is connected by PCB pattern. VOUT =5.0V 0 0.01 0.1 1 10 100 1000 Output Current:IOUT (mA) 1/25 XCL100/XCL101 Series ■BLOCK DIAGRAM XCL101A/XCL101C Type L1 L2 Inductor LX PFM C omparator U nit CFB RFB1 Parasitic Diode Controller VOUT VOUT Current Sense RFB2 PFM Comparator FB - PFM C ontroller + Buffer Driver and Inrush Current Protection VSS V OUT V REF VDD CE and Bypass Controller Logic CE VBAT - VOUT Detector VBAT * Diodes inside the circuits are ESD protection diodes and parasitic diodes. XCL101B Type L1 L2 Inductor LX PFM C omparator U nit CFB RFB1 Parasitic Diode Contr oller VOUT VOUT Cur rent Sense RFB2 PFM Compar ator FB + PFM C ontroller CL Dis charge Buffer Dr iver and Inrush Cur rent Protection VSS V OUT V REF CE CE and Bypass Contr oller Logic VDD VBAT - VOUT Detector VBAT * Diodes inside the circuits are ESD protection diodes and parasitic diodes. 2/25 XCL100/XCL101 Series ■BLOCK DIAGRAM XCL100A/XCL100C Type L1 L2 Inductor LX PFM C omparator U nit CFB RFB1 Parasitic Diode Contr oller VOUT VOUT Cur rent Sense RFB2 PFM Compar ator FB - Buffer Dr iver and Inrush Cur rent Protection PFM C ontroller + VSS V OUT V REF CE VDD CE and Bypass Contr oller Logic VBAT - VOUT Detector Hy ste re si s UVLO Compa rator VBAT + - * Diodes inside the circuits are ESD protection diodes and parasitic diodes. XCL100B Type L1 L2 Inductor LX PFM C omparator U nit CFB RFB1 Parasitic Diode Contr oller VOUT VOUT Cur rent Sense RFB2 PFM Compar ator FB + CL Dis charge Buffer Dr iver and Inrush Cur rent Protection PFM C ontroller VSS V OUT V REF CE VDD CE and Bypass Contr oller Logic VBAT - VOUT Detector Hy ste re si s UVLO Compa rator VBAT + - * Diodes inside the circuits are ESD protection diodes and parasitic diodes. 3/25 XCL100/XCL101 Series ■PRODUCTION CLASSIFICATION ●Ordering Information XCL100①②③④⑤⑥-⑦(*1) PFM control, With UVLO function DESIGNATOR ① ITEM Product Type SYMBOL A Load Disconnection Without CL Auto Discharge B Load Disconnection With CL Auto Discharge C VBAT Bypass Without CL Auto Discharge ②③ Output Voltage 30 ~ 50 (*2) UVLO Function 1 Packages (Order Unit) ER-G(*3) ④ ⑤⑥-⑦ DESCRIPTION Output Voltage e.g. VOUT=3.6V⇒②=3, ③=6 UVLO Function VUVLO_R=1.65V CL-2025-02 (3,000pcs/Reel) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. (*2) Please contact our sales representatives for UVLO release voltage other than those listed above. It can be set from 1.65V to 2.2V in 0.05V increments. (*3) ER-G is storage temperature range "-40℃ ~ 125 ℃". XCL101①②③④⑤⑥-⑦(*1) PFM control, Without UVLO function DESIGNATOR ① ITEM Product Type SYMBOL A Load Disconnection Without CL Auto Discharge B Load Disconnection With CL Auto Discharge C VBAT Bypass Without CL Auto Discharge ②③ Output Voltage 18 ~ 50 ④ UVLO Function 1 ⑤⑥-⑦ (*1) The Packages (Order Unit) DESCRIPTION Output Voltage e.g. VOUT=3.6V⇒②=3, ③=6 No UVLO BR-G(*2) CL-2025 (3,000pcs/Reel) ER-G(*3) CL-2025-02 (3,000pcs/Reel) “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. (*2) BR-G is storage temperature range "-40℃ ~ 105 ℃". (*3) ER-G is storage temperature range "-40℃ ~ 125 ℃". 4/25 XCL100/XCL101 Series ■PIN CONFIGURATION 7 L1 VSS 6 1 LX NC 5 2 VOUT * If the dissipation pad needs to be connected to other pins, it should be connected CE 4 3 VBAT * Please refer to pattern layout page for the connecting to PCB. to the VSS pin. 8 L2 (BOTTOM VIEW) ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS 1 LX Switching 2 VOUT Output Voltage 3 VBAT Power Input 4 CE Chip Enable 5 NC No Connection 6 VSS Ground 7 L1 8 L2 Inductor Electrodes ■CE PIN FUNCTION PIN NAME SIGNAL CE STATUS H Operation L A,B Type : Stand-by C Type : Bypass Mode * Please do not leave the CE pin open. ■ ABSOLUTE MAXIMUM RATINGS Ta=25ºC PARAMETER SYMBOL RATINGS UNITS VBAT Pin Voltage VBAT -0.3 ~ 7.0 V LX Pin Voltage VLX -0.3 ~ VOUT + 0.3 or 7.0 (*1) V VOUT Pin Voltage VOUT -0.3 ~ 7.0 V CE Pin Voltage VCE -0.3 ~ 7.0 V LX Pin Current ILX 700 mA Power Dissipation Pd 1000 (40mm x 40mm Standard board) (*2) mW Operating Ambient Temperature Topr -40 ~+85 ºC -40 ~ 105 ºC -40 ~ 125 ºC Storage Temperature(*3) CL-2025 CL-2025-02 Tstg All voltages are described based on the GND. (*1) The maximum value should be either VOUT+0.3V or 7.0V in the lowest. (*2) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to PACKAGING INFORMATION for the mounting condition. (*3) Storage temperature, are divided by the product specification of the package. 5/25 XCL100/XCL101 Series ■ELECTRICAL CHARACTERISTICS XCL101Axx1/ XCL101Bxx1 Ta=25 ºC PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Input Voltage VBAT - - 5.5 V - Output Voltage VOUT(E)(*2) V ① Operation Start Voltage VST1 IOUT=1mA - - 0.9 V ② Operation Hold Voltage VHLD RL=1kΩ - 0.7 - V ② Supply Current Iq μA ③ Input Pin Current IBAT VOUT=VOUT(T) (*1)+0.5V - 0.25 1.0 μA ③ Stand-by Current ISTB VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V - 0.1 1.0 μA ④ LX Leak Current ILXL VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V - 0.1 1.0 μA ⑤ PFM Switching Current IPFM IOUT=3mA 295 350 405 mA ② Maximum On Time tONMAX VPULL=1.5V, VOUT=VOUT(T) (*1)×0.98 3.1 4.6 6.0 μs ① LX SW “Pch” ON Resistance (*3) RLXP VBAT=VCE=VLX=VOUT(E) (*2)+ 0.5V, IOUT=200mA Ω ⑦ LX SW “Nch” ON Resistance (*4) RLXN VBAT=VOUT(E) (*2)=3.3V, VOUT=1.7V VPULL=1.5V, Voltage to start oscillation while VOUT is decreasing Oscillation stops, VBAT=VCE=1.5V VOUT=VOUT(T) (*1) +0.5V VBAT=VPULL=1.5V VOUT=VOUT(T) (*1)×0.98 While VCE= 0.3→0.75V, Voltage to start oscillation VBAT=VPULL=1.5V VOUT=VOUT(T) (*1)× 0.98 While VCE=0.75 → 0.3V, Voltage to stop oscillation - 0.6 - Ω ⑧ 0.75 - 5.5 V ① VSS - 0.3 V ① CE “H” Voltage VCEH CE “L” Voltage VCEL CE “H” Current ICEH VBAT=VCE=VLX=VOUT=5.5V -0.1 - 0.1 μA ① CE “L” Current ICEL VBAT=VLX=VOUT=5.5V, VCE=0V -0.1 - 0.1 μA ① CL Discharge Resistance (B Type) RDCHG VBAT=VOUT=2.0V, VCE=0V 165 210 254 Ω ③ Inductance Value L Test Frequency=1MHz - 4.7 - μH - (Inductor) Rated Current IDC ΔT=+40℃ - 700 - mA - Unless otherwise stated, VBAT= VCE= 1.5V VOUT(T) =Nominal Output Voltage VOUT(E) =Effective Output Voltage The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example. (*3) L SW “Pch” ON resistance =(V -V X LX OUTpin measurement voltage) / 200mA (*4) L SW “Nch” ONresistance measurement method is shown in the measurement circuit diagram. X (*1) (*2) 6/25 XCL100/XCL101 Series ■ELECTRICAL CHARACTERISTICS (Continued) XCL101Cxx1 Ta=25 ºC PARAMETER SYMBOL CONDITIONS Input Voltage VBAT Output Voltage VOUT(E)(*2) Operation Start Voltage VST1 IOUT=1mA - - Operation Hold Voltage VHLD RL=1kΩ - 0.7 Supply Current Iq Input Pin Current IBAT VBAT=VCE=1.5V, VOUT=VOUT(E)(*2)+0.5V - 0.25 Bypass Mode Current IBYP VBAT=VLX=5.5V, VCE=0V - PFM Switching Current IPFM IOUT=3mA Maximum On Time tONMAX VPULL=1.5V, VOUT=VOUT(T)(*1)×0.98 LX SW “Pch” ON Resistance (*3) RLXP VBAT=VLX=VCE=VOUT(E)(*2)+ 0.5V, IOUT=200mA LX SW “Nch” ON Resistance (*4) RLXN VBAT=VOUT(E)(*2)=3.3V, VOUT=1.7V - MIN. TYP. MAX. UNITS CIRCUIT - - 5.5 V - V ① 0.9 V ② - V ② μA ③ 1.0 μA ③ 3.5 6.1 μA ⑥ 295 350 405 mA ② 3.1 4.6 6.0 μs ① Ω ⑦ VPULL=1.5V, Voltage to start oscillation while VOUT is decreasing Oscillation stops, VOUT=VOUT(T)+0.5V (*1) VBAT=VPULL=1.5V VOUT=VOUT(T)(*1)×0.98 While VCE=0.3→0.75V, Voltage to start oscillation VBAT=VPULL=1.5V VOUT=VOUT(T) (*1)× 0.98 While VCE=0.75 → 0.3V, Voltage to stop oscillation - 0.6 - Ω ⑧ 0.75 - 5.5 V ① VSS - 0.3 V ① CE “H” Voltage VCEH CE “L” Voltage VCEL CE “H” Current ICEH VBAT=VCE=VLX=VOUT=5.5V -0.1 - 0.1 μA ① CE “L” Current ICEL VBAT=VLX=VOUT=5.5V, VCE=0V -0.1 - 0.1 μA ① Inductance Value L Test Frequency=1MHz - 4.7 - μH - (Inductor) Rated Current IDC ΔT=+40℃ - 700 - mA - Unless otherwise stated, VBAT= VCE= 1.5V VOUT(T) =Nominal Output Voltage VOUT(E) =Effective Output Voltage The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example. (*3) L SW “Pch” ON resistance =(V -V X LX OUTpin measurement voltage) / 200mA (*4) L SW “Nch” ONresistance measurement method is shown in the measurement circuit diagram. X (*1) (*2) 7/25 XCL100/XCL101 Series ■ELECTRICAL CHARACTERISTICS (Continued) XCL100Axxx/ XCL100Bxxx Ta=25℃ PARAMETER SYMBOL CONDITIONS Input Voltage VBAT Output Voltage VOUT(E) (*2) Operation Start Voltage VST IOUT=1mA Operation Hold Voltage VHLD RL=1kΩ Supply Current2 Input Pin Current2 Stand-by Current LX Leak Current PFM Switching Current Iq Maximum ON Time tONMAX LX SW “Pch” ON Resistance(*3) RLXP VBAT=VLX=VCE=VOUT(T)+0.5V (*1), IOUT=200mA LX SW “Nch” ON Resistance (*4) RLXN VBAT=VCE=3.3V, VOUT=1.7V MIN. MAX. UNITS CIRCUIT 5.5 V - V ① V ② - V ② 295 E4 E5 0.1 0.1 350 1.0 1.0 405 μA μA μA μA mA ③ ③ ④ ⑤ ② 3.1 4.6 6.0 μs ① Ω ⑦ VPULL=1.5V, Voltage to start oscillation while VOUT is decreasing TYP. E9 - - VDETECT (E) Oscillation stops,VOUT=VOUT(T)+0.5V (*1) IBAT VOUT=VOUT(T)+0.5V (*1) ISTB VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V ILXL VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V IPFM IOUT=3mA VPULL=VRELEASE(T)+0.1V (*5), VOUT=VOUT(T)×0.98 (*1) - (*7) VRELEAS E(E) (*6) E3 - 0.6 - Ω ⑧ VCEH VBAT=VPULL=VRELEASE(T)+0.1V (*5), VOUT=VOUT(T)×0.98 (*1) While VCE=0.3→0.75V, Voltage to start oscillation 0.75 - 5.5 V ① CE “L” Voltage VCEL VBAT=VPULL=VRELEASE(T)+0.1V (*5), VOUT=VOUT(T)×0.98 (*1) While VCE=0.75→0.3V, Voltage to stop oscillation VSS - 0.3 V ① CE “H” Current CE “L” Current CL Discharge Resistance (B Type) ICEH VBAT=VCE=VLX=VOUT=5.5V ICEL VBAT= VLX=VOUT=5.5V, VCE=0V -0.1 -0.1 - 0.1 0.1 μA μA ① ① VBAT=VOUT=2.0V, VCE=0V 165 210 254 Ω ③ CE “H” Voltage UVLO Current UVLO Release Voltage RDCHG IDQ VRELEASE(E) (*6) UVLO Hysteresis Voltage VHYS(E) (*8) Inductance Value (Inductor) Rated Current IDC L VBAT=VCE=VDETECT(E) - 0.1V(*7), IOUT=0mA E6 μA ② VPULL=VOUT=VOUT(T)×0.98 (*1) ,VBAT=VCE Voltage to start oscillation while VBAT is increasing E7 V ① VPULL=VOUT=VOUT(T)×0.98(*1), VBAT=VCE VRELEASE(E) -Voltage to stop oscillation while VBAT is decreasing (*6) Test Frequency=1.0MHz ⊿T=+40℃ 0.1 0.15 0.2 V ① - 4.7 700 - μH mA - Unless otherwise stated, VBAT=VCE= VRELEASE(T)+0.1V (*5) VOUT(T)=Nominal Output Voltage VOUT(E)=Effective Output Voltage The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example. (*3) LX SW “Pch” ON resistance=(VLX-VOUT pin measurement voltage) / 200mA (*1) (*2) (*4) The LX SW “Nch” ON resistance measurement method is shown in the measurement circuit diagram. (*5) VRELEASE(T)= Nominal UVLO release voltage (*6) VRELEASE(E)= Actual UVLO release voltage (*7) VDETECT(E)= VRELEASE(E) -VHYS(E)= Actual UVLO detect voltage (*8) VHYS(E)= Actual UVLO hysteresis voltage 8/25 XCL100/XCL101 Series ■ELECTRICAL CHARACTERISTICS (Continued) XCL100Cxxx Ta=25℃ PARAMETER SYMBOL CONDITIONS Input Voltage VBAT Output Voltage VOUT(E) (*2) Operation Start Voltage VST IOUT=1mA Operation Hold Voltage VHLD RL=1kΩ Supply Current2 Input Pin Current2 Bypass Mode Current PFM Switching Current Iq Maximum ON Time tONMAX LX SW “Pch” ON Resistance(*3) RLXP VBAT=VLX=VCE=VOUT(T)+0.5V (*1), IOUT=200mA LX SW “Nch” ON Resistance (*4) RLXN VBAT=VCE=3.3V, VOUT=1.7V MIN. MAX. UNITS CIRCUIT 5.5 V - V ① V ② - V ② 295 E4 E5 3.5 350 6.1 405 μA μA μA mA ③ ③ ⑥ ② 3.1 4.6 6.0 μs ① Ω ⑦ VPULL=1.5V, Voltage to start oscillation while VOUT is decreasing E9 - VOUT=VOUT(T)+0.5V (*1) IBYP VBAT=VLX=5.5V, VCE=0V IPFM IOUT=3mA - VDETECT (E) VPULL=VRELEASE(T)+0.1V (*5), VOUT=VOUT(T)×0.98 (*1) - (*7) Oscillation stops,VOUT=VOUT(T)+0.5V (*1) IBAT TYP. VRELEAS E(E) (*6) E3 - 0.6 - Ω ⑧ VCEH VBAT=VPULL=VRELEASE(T)+0.1V (*5), VOUT=VOUT(T)×0.98 (*1) While VCE=0.3→0.75V, Voltage to start oscillation 0.75 - 5.5 V ① CE “L” Voltage VCEL VBAT=VPULL=VRELEASE(T)+0.1V (*5), VOUT=VOUT(T)×0.98 (*1) While VCE=0.75→0.3V, Voltage to stop oscillation VSS - 0.3 V ① CE “H” Current CE “L” Current ICEH VBAT=VCE=VLX=VOUT=5.5V ICEL VBAT= VLX=VOUT=5.5V, VCE=0V -0.1 -0.1 - 0.1 0.1 μA μA ① ① UVLO Current IDQ VBAT=VCE=VDETECT(E) - 0.1V(*7), IOUT=0mA E6 μA ② VPULL=VOUT=VOUT(T)×0.98 (*1) ,VBAT=VCE Voltage to start oscillation while VBAT is increasing E7 V ① CE “H” Voltage UVLO Release Voltage UVLO Hysteresis Voltage Inductance Value (Inductor) Rated Current VRELEASE(E) (*6) VHYS(E) L IDC (*8) VPULL=VOUT=VOUT(T)×0.98(*1), VBAT=VCE VRELEASE(E) -Voltage to stop oscillation while VBAT is decreasing (*6) Test Frequency=1.0MHz ⊿T=+40℃ 0.1 0.15 0.2 V ① - 4.7 700 - μH mA - Unless otherwise stated, VBAT=VCE= VRELEASE(T)+0.1V (*5) VOUT(T)=Nominal Output Voltage VOUT(E)=Effective Output Voltage The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example. (*3) LX SW “Pch” ON resistance=(VLX-VOUT pin measurement voltage) / 200mA (*1) (*2) (*4) The LX SW “Nch” ON resistance measurement method is shown in the measurement circuit diagram. (*5) VRELEASE(T)= Nominal UVLO release voltage (*6) VRELEASE(E)= Actual UVLO release voltage (*7) VDETECT(E)= VRELEASE(E) -VHYS(E)= Actual UVLO detect voltage (*8) VHYS(E)= Actual UVLO hysteresis voltage 9/25 XCL100/XCL101 Series ■ELECTRICAL CHARACTERISTICS (Continued) SYMBOL E1 E9 E2 E3 E4 PARAME TER Output Voltage (XCL101) Output Voltage (XCL100) Supply Current LX SW “Pch” ON RESISTANCE Supply Current2 UNITS: V UNITS: V UNITS: V UNITS: μA UNITS: Ω UNITS: μA OUTPUT VOLTAGE MIN. MAX. MIN. MAX. 1.8 1.764 1.836 - - 1.9 1.862 1.938 - - 2.0 1.960 2.040 - - 2.1 2.058 2.142 - - 2.2 2.156 2.244 - - 2.3 2.254 2.346 - - 2.4 2.352 2.448 - - 2.5 2.450 2.550 - - 2.6 2.548 2.652 - - 2.7 2.646 2.754 - - 2.8 2.744 2.856 - - 2.9 2.842 2.958 - - 3.0 2.940 3.060 2.940 3.060 3.1 3.038 3.162 3.038 3.162 3.2 3.136 3.264 3.136 3.264 3.3 3.234 3.366 3.234 3.366 3.4 3.332 3.468 3.332 3.468 3.5 3.430 3.570 3.430 3.570 3.6 3.528 3.672 3.528 3.672 3.7 3.626 3.774 3.626 3.774 3.8 3.724 3.876 3.724 3.876 3.9 3.822 3.978 3.822 3.978 4.0 3.920 4.080 3.920 4.080 4.1 4.018 4.182 4.018 4.182 4.2 4.116 4.284 4.116 4.284 4.3 4.214 4.386 4.214 4.386 4.4 4.312 4.488 4.312 4.488 4.5 4.410 4.590 4.410 4.590 4.6 4.508 4.692 4.508 4.692 4.7 4.606 4.794 4.606 4.794 4.8 4.704 4.896 4.704 4.896 4.9 4.802 4.998 4.802 4.998 5.0 4.900 5.100 4.900 5.100 10/25 TYP. MAX. TYP. MAX. TYP. MAX. 6.1 9.4 0.84 1.08 6.8 9.7 6.2 9.7 0.75 0.97 6.9 9.8 6.3 10.0 0.65 0.85 7.0 10.0 6.4 10.2 0.61 0.78 7.1 10.1 6.5 10.4 0.57 0.74 7.2 10.2 6.7 10.7 0.53 0.72 7.3 10.3 XCL100/XCL101 Series ■ELECTRICAL CHARACTERISTICS (Continued) SYMBOL E5 E6 E7 E8 PARAMETER Input Pin Current2 UVLO Current UVLO RELEASE VOLTAGE UVLO Bypass Current UNITS:V UNITS:μA UNITS:μA UNITS:V UNITS:μA UVLO Release Voltage 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 TYP. MAX. TYP. MAX. 0.71 1.50 3.25 6.00 0.73 1.60 3.27 6.10 0.75 1.60 3.29 6.20 0.77 1.60 3.31 6.20 0.79 1.70 3.33 6.30 0.82 1.70 3.35 6.30 MIN. MAX. 1.601 1.699 1.649 1.751 1.698 1.802 1.746 1.854 1.795 1.905 1.843 1.957 1.892 2.008 1.940 2.060 1.989 2.111 2.037 2.163 2.086 2.214 2.134 2.266 TYP. MAX. 2.15 4.10 2.20 4.20 2.30 4.20 2.35 4.30 2.40 4.30 2.45 4.40 11/25 XCL100/XCL101 Series ■TEST CIRCUITS CE L2 VBAT L2 CE VBAT A NC GND VOUT NC CIN Rpull Lx L1 CL V Waveform check point L2 NC VBAT CE VOUT NC L GND CL Lx L1 CIN Waveform check point A V A L2 NC GND Lx A VBAT VOUT *External components CIN:4.7μF(Ceramic) CL:10μF(Ceramic) L:4.7μH(Selected goods) L1 Lx A VBAT CE VOUT NC A Lx L1 L2 GND V RL CE L1 CE GND *External components CIN:4.7μF(Ceramic) CL:10μF(Ceramic) Rpull:100 ohm Vpull VOUT A L2 VBAT VOUT GND L1 Lx CIN V ↓ *External components CIN:4.7μF(Ceramic) CE L2 NC GND L1 L2 VBAT CE VOUT NC Lx GND A VBAT VOUT L1 Lx Rpull V1 CL CIN Vpull Waveform check point *External components CIN:4.7μF(Ceramic) CL:10μF(Ceramic) Rpull:4.7 ohm Use Test Circuit No.8 to adjust Vpull so that the LX pin voltage becomes 100mV when the Nch drive Tr is ON and then the voltage at both ends of Rpull is measured to find the Lx SW "Nch" ON resistance. RLXN=0.1V / {(V1 - 0.1V) / 4.7Ω)} Note that V1 is the Rpull previous voltage when the Nch driver Tr is ON. Use an oscilloscope or other instrument to measure the LX pin voltage and V1. 12/25 XCL100/XCL101 Series ■TYPICAL APPLICATION CIRCUIT 7 L1 VOUT CL 10μF 1 Lx VSS 6 2 VOUT NC 5 3 VBAT CE 4 VCE 8 L2 VIN CIN 10μF (TOP VIEW) * The embedded coil is optimized for XCL100/XCL101 series. Please do not use for other purposes. 【Recommended External Components】 MANUFACTURE TDK CIN, CL TAIYO YUDEN PRODUCT NUMBER VALUE L×W (mm) C1608JB1A106K 10μF/10V 1.60 × 0.80 C1608X5R1A106K 10μF/10V 1.60 × 0.80 C2012JB1A106K 10μF/10V 2.00 × 1.25 C2012X5R106K 10μF/10V 2.00 × 1.25 LMK107BBJ106MALT 10μF/10V 1.60 × 0.80 LMK212ABJ106KG 10μF/10V 2.00 × 1.25 LMK212BBJ226MG 22μF/10V 2.00 × 1.25 JMK212BBJ476MG 47μF/6.3V 2.00 × 1.25 13/25 XCL100/XCL101 Series ■OPERATION EXPLANATION The XCL100/XCL101 Series consists of a standard voltage source, a PFM comparator, a Nch driver Tr, a Pch synchronous rectifier switch Tr, a current sense circuit, a PFM control circuit and a CE control circuit, etc. (refer to the block diagram below.) L1 L2 Inductor LX L1 LX PFM C omparator U nit CFB PFM C omparator U nit RFB1 Parasitic Diode Controller CFB VOUT RFB2 PFM Comparator FB + RFB1 Parasitic Diode Controller VOUT Current Sense PFM C ontroller RFB2 PFM Comparator FB VSS VDD VBAT + VOUT PFM C ontroller CL Dis charge Buffer Driver and Inrush Current Protection VSS V OUT V REF VBAT - VOUT Detector Hy ste re si s UVLO Compa rator + V OUT CE and Bypass Controller Logic VOUT Current Sense CL Dis charge Buffer Driver and Inrush Current Protection V REF CE L2 Inductor CE VDD CE and Bypass Controller Logic VBAT - VOUT Detector VBAT - < XCL101BType BLOCK DIAGRAM > < XCL100B Type BLOCK DIAGRAM > Current limit PFM control is used for the control method to make it difficult for the output voltage ripple to increase even when the switching current is superimposed, so the product can be used within a wide voltage and current range. Further, because PFM control is used, it has excellent transient response to support low capacity ceramic capacitors to realize a compact, high-performance boost DC/DC converter. The synchronous driver and rectifier switch Tr efficiently sends the coil energy to the capacitor connected to the VOUT pin to achieve highly efficient operation from low to high loads. The electrical characteristics actual output voltage VOUT(E) is the PFM comparator threshold voltage shown in the block diagram. Therefore, the booster circuit output voltage average value, including the peripheral components, depends on the ripple voltage, so this must be carefully evaluated before being used in the actual product. VBAT=VCE=2.0V、VOUT=3.3V、IOUT=20mA、L=4.7μH、CL=10μF、Ta=25℃ VOUT Voltage Average VBAT=VCE=2.0V、VOUT=3.3V、IOUT=70mA、L=4.7μH、CL=10μF、Ta=25℃ VLX VLX VOUT VOUT VLX:2V/div VOUT Voltage VOUT:50mV/div Average ILX:200mA/div VOUT(E) VOUT(E) IPFM ILX 2[μs/div] ILX 2[μs/div] < Reference Voltage Source (VREF)> The reference voltage source (VREF voltage) provides the reference voltage to ensure stable output voltage of the DC/DC converter. < PFM Control > ①The voltage from the output voltage divided by the division resistors RFB1 and RFB2 in the IC is used as feedback voltage (FB voltage), and the PFM comparator is compared with the FB voltage and VREF. If the FB voltage is lower than VREF, the signal is sent to the buffer driver via the PFM control circuit and the Nch driver Tr is turned ON. If the FB voltage is higher than VREF, the PFM comparator sends a signal that does not turn ON the Nch driver Tr. ②The current sense circuit monitors the current flowing in the Nch driver Tr connected to the Lx pin when the Nch driver Tr is ON. When the prescribed PFM switching current (IPFM) is reached, the signal is sent to the buffer driver via the PFM control circuit to turn OFF the Nch driver Tr and turn ON the Pch synchronous rectifier switch Tr. ③The Pch synchronous rectifier switch Tr ON time (off time) is dynamically optimized internally. After the off time has passed, when the PFM comparator confirms the VOUT voltage has exceeded the set voltage, a signal that does not allow the Nch driver Tr to be turned on is sent from the PFM comparator to the PFM control circuit, but if the VOUT voltage remains lower than the set voltage, then Nch driver Tr ON is started. The intervals of the above ①②③ linked operations are continuously adjusted in response to the load current to ensure the output voltage is kept stable from low to high loads and that it is done with good efficiency. 14/25 XCL100/XCL101 Series ■OPERATION EXPLANATION (Continued) The PFM switching current unit monitors the current flowing in the Nch driver Tr and functions to limit the current flowing in the Nch driver Tr, but if the load current becomes much larger than the PFM switching energy, the VOUT voltage becomes lower and prevents the coil current in the Nch driver Tr OFF period from lowering, which affects the internal circuit delay time and results in an excessive current that is larger than the PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr. When "L" voltage is input to the CE pin, the A/B type enters into standby mode and the C type enters into bypass mode to stop the circuit required for the boost operation. In the standby mode the load cut-off function operates and both the Nch driver Tr and Pch synchronous rectifier switch Tr are turned OFF, which cuts off the current to the LX pin and VOUT pin and the parasitic diode control circuit connects the parasitic diode cathode of the Pch synchronous rectifier switch Tr to the LX pin ①. In the bypass mode the Nch driver Tr is OFF, the Pch synchronous rectifier switch Tr is ON when VLX > VOUT, and the parasitic diode control circuit connects the parasitic diode cathode of the Pch synchronous rectifier switch Tr to the VOUT pin ②. Also, when VLX < VOUT, the Pch synchronous rectifier switch Tr is turned OFF and the parasitic diode cathode is connected to the VOUT pin ②. Note: Except for the moment when the VBAT voltage rises up under a start-up condition. ① ② Parasitic Diode Controller LX Pin Side Parasitic Diode Controller VOUT Pin Side LX Pin Side VOUT Pin Side Buffer Driver Buffer Driver < VBAT-VOUT Voltage Detection Circuit> The VBAT-VOUT voltage detection circuit compares the VBAT pin voltage with the VOUT pin voltage, and whichever is the highest is operated to become the IC power supply (VDD). In addition, if, during normal operation, the input voltage becomes higher than the output voltage, the Nch driver Tr is turned OFF and the Pch synchronous rectifier switch Tr is kept ON so that the input voltage passes through to the output voltage (through mode). When the input voltage becomes lower than the output voltage, the circuit automatically returns to the normal boost operation. This detection circuit does not operate when in the standby mode. When the VBAT or VCE power supply is input, CL is charged via the stable current that results from the inrush current protection function (refer to graphs below). Therefore, this function minimizes potential over current from the VBAT pin to the VOUT pin. Also, this current value depends on the VBAT voltage. After CL is charged by the aforementioned stable current and VOUT reaches around the VBAT voltage level, the inrush current protection function will be released after several hundred μs ~ several ms and the IC will then move to step-up mode, bypass mode or through mode. Inrush Current Protection Characteristics 600 Inrush Current Protection (mA) 300 550 250 500 200 450 400 150 350 100 300 50 0 0.5 250 1.0 1.5 2.0 2.5 200 3.0 3.0 Input Voltage: VBAT (V) 3.5 4.0 4.5 5.0 5.5 15/25 XCL100/XCL101 Series ■OPERATION EXPLANATION (Continued) The UVLO function is selectable on the XCL100 series as an option. When the VBAT pin voltage falls below the UVLO detect voltage, the IC stops switching or BYPASS operation and cuts off the current to the LX pin and VOUT pin (UVLO mode). In addition, when the VBAT pin voltage recovers to above the UVLO release voltage, the IC begins operating again. B types can discharge the electric charge at the output capacitor (CL) quickly during standby mode(CE=”L”) via the Nch FET located between VOUT and GND. Electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction during standby mode. Discharge time of the output capacitor (CL) is set by the CL discharge resistance (RDCHG) and the output capacitor (CL). By setting time constant of a CL discharge resistance value [RDCHG] and an output capacitor value (CL) as τ(τ=CL×RDCHG), discharge time can be the calculated by the following formulas. However, the CL discharge resistance [RDCHG] is depends on the VBAT or VOUT. We recommend that you fully check actual performance. V=VOUT × e - t /τor t=τ In(VOUT / V) 16/25 V : Output voltage after discharge VOUT : Output voltage t : Discharge time τ : CL × RDCHG CL : Capacity value of the load capacitor (CL) RDCHG : CL Discharge resistance, it depends on the VBAT or VOUT XCL100/XCL101 Series ■NOTE ON USE 1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC. 2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor. 3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC operation to become unstable, so reinforce the area around the GND pin of the IC in particular. 4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance. 5. An excessive current that is larger than the PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr, which could destroy the IC. 6. When in the bypass mode, the internal Pch synchronous rectifier switch Tr turns ON to allow current to flow to the Lx pin and VOUT pin. When an excessive current comes from the VOUT pin when this bypass operates, it could destroy the Pch synchronous rectifier switch Tr. 7. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin. 8. The embedded coil is optimized for XCL100/XCL101 series. Please do not use for other purposes. 9. At high temperatures, the product performance could vary causing the efficiency to decline. Evaluate this carefully before use if the product will be used at high temperatures. 10. Please note that the leak current of the Pch synchronous rectifier switch Tr during high-temperature standby operation could cause the output voltage to increase. 11. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple voltage will be too large. And when the ripple voltage becomes big by influence of a load current, please add the CL capacitor. 12. When the booster circuit is activated by a low input voltage, during the time until the output voltage reaches about 1.7V, the PFM switching current function might not operate causing the coil current to be superimposed. (See the figure below.) VBAT=VCE=0→0.9V、VOUT=1.8V、IOUT=1mA、L=4.7μH、CL=10μF、Ta=25℃ V OUT V BAT =V CE VBAT=VCE:1.0V/div V LX VOUT:1.0V/div VLX:2.0V/div ILX:200mA/div ILX 200[μs/div] V OUT V BAT =V CE VBAT=VCE:1.0V/div V LX Zoom VOUT:1.0V/div VLX:2.0V/div ILX:200mA/div ILX 50[μs/div] VBAT=VCE=0→1.7V、VOUT=1.8V、IOUT=1mA、L=4.7μH、CL=10μF、Ta=25℃ V BAT =V CE V LX VBAT=VCE:1.0V/div V OUT VOUT:1.0V/div VLX:2.0V/div ILX ILX:200mA/div 200[μs/div] V BAT =V CE V LX V OUT VBAT=VCE:1.0V/div VOUT:1.0V/div Zoom VLX:2.0V/div ILX ILX:200mA/div 50[μs/div] 17/25 XCL100/XCL101 Series ■NOTE ON USE (Continued) 13. If the CL capacity or load current becomes excessively large, the output voltage start-up time, when the power is turned on, will increase, so the coil current might be superimposed during the time it takes for the output voltage to become sufficiently higher than the VBAT voltage. 14. If the input voltage is higher than the output voltage, then the circuit automatically enters the through mode. When the input voltage becomes close to the output voltage, there could be repeated switching between the boost mode and through mode causing the ripple voltage to fluctuate. (Refer to the graphic below) VBAT=VCE=3.316V,VOUT=3.412V,IOUT=3mA,L=4.7μH,CL=10μF,Ta=25℃ VOUT VOUT:100mV/div VBAT VBAT:100mV/div VLX VLX:2.0V/div 200[μs/div] 15. If a different power supply is connected from an external source to the IC could be destroyed. Refer to the table below for external voltage availability for each product type and operating conditions. Series/ TYPE Applied Voltage to the VOUT pin Applied Voltage to the VOUT pin VRELEASE(E)≦VBAT≦5.5V (UVLO Release State) 0.9V≦VBAT<VRELEASE(E) (UVLO Detect State) CE="L" CE="L" CE="H" Yes Yes No (CL Discharge Operation) No (CL Discharge Operation) Yes Yes XCL100A Yes XCL100B No (CL Discharge Operation) XCL100C No (Reverse Flow toward the input) CE="H" Yes 0.9V≦VBAT≦5.5V Series/ TYPE CE="L" XCL101A Yes XCL101B No (CL Discharge Operation) XCL101C No (Reverse Flow toward the input) VBAT<0.9V CE="L" CE="H" No No VBAT<0.9V CE="H" CE="L" CE="H" Yes No No 16. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 17. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and postaging protection treatment when using Torex products in their systems. 18/25 XCL100/XCL101 Series ■NOTE ON USE (Continued) 18. With the A Type, when the VBAT or VCE power supply is input, if the VOUT pin voltage does not exceed VBAT -0.35V, which can happen due to the load current being more than the inrush protection current, step-up mode or through mode operations won’t function correctly. 19. In the case of products with the UVLO function that do not have CL discharge, the output voltage may occasionally rise due to leakage current from the Pch synchronous switch Tr when high-temperature UVLO mode operates. 20. The proper position of mounting is based on the coil terminal ●Instruction of pattern layouts 1. In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VBAT and ground pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors. 6. As precautions on mounting, please set the mounting position accuracy within 0.05 mm ●Recommended Pattern Layout TOREX XCL101 GND CE IC LX Lx CIN VIN CL GND VOUT ■About the appearance (coil part) (1) Coils are compliant with general surface mount type chip coil (inductor) specifications and may have scratches, flux contamination and the like. 19/25 XCL100/XCL101 Series ■TYPICAL PERFORMANCE CHARACTERISTICS 1) Output Voltage vs. Output Current XCL101C501BR-G XCL101C331BR-G 5.8 Ta=25℃ Output Voltage:V OUT(V) Output Voltage:V OUT(V) 3.7 3.5 3.3 VIN=1.5V 3.1 1.8V 3.0V Ta=25℃ 5.4 5.0 VIN=3.0V 4.6 3.6V 4.2V 4.2 2.9 0.01 0.1 1 10 100 0.01 1000 0.1 1 10 100 1000 Output Current:IOUT (mA) Output Current:IOUT (mA) 2) Efficiency vs. Output Current XCL101C501BR-G 100 100 80 80 60 3.0V 1.8V VIN= 1.5V 40 Efficiency:EFFI(%) Efficiency:EFFI(%) XCL101C331BR-G 4.2V 3.6V 60 VIN= 3.0V 40 20 20 Ta=25℃ Ta=25℃ 0 0.01 0.1 1 10 100 0 0.01 1000 0.1 1 10 100 1000 Output Current:IOUT (mA) Output Current:IOUT (mA) 3) Ripple Voltage vs. Output Current XCL101C501BR-G XCL101C331BR-G Ta=25℃ 160 120 Ripple Voltage:Vr(mV) Ripple Voltage:Vr(mV) 200 VIN=1.5V 1.8V 3.0V 80 40 0 0.01 0.1 1 10 Output Current:IOUT (mA) 20/25 200 100 1000 160 Ta=25℃ VIN=3.0V 3.6V 4.2V 120 80 40 0 0.01 0.1 1 10 Output Current:IOUT (mA) 100 1000 XCL100/XCL101 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 4) Bypass Voltage vs. Output Current XCL101C331BR-G 3.8 VIN=3.6V CE=0V -40℃ 3.6 Ta=25℃ 3.5 85℃ 3.4 3.3 3.2 3.1 0 50 100 150 200 250 VIN=5.0V CE=0V 5.1 Output Voltage : V OUT (V) 3.7 Output Voltage : V OUT (V) XCL101C501BR-G 5.2 300 5.0 -40℃ Ta=25℃ 4.9 85℃ 4.8 4.7 4.6 4.5 0 50 Output Current: IOUT (mA) 100 150 200 250 300 Output Current: IOUT (mA) 5) Load Transient Response XCL101C331BR-G XCL101C331BR-G IOUT= 1.0mA→50mA IOUT= 50mA→1.0mA VOUT VOUT IOUT =50mA IOUT SW IOUT SW IOUT =50mA IOUT =1.0mA IOUT =1.0mA VBAT=VCE=1.8V, VOUT=3.3V, Ta=25℃, CIN=4.7μF, CL=10μF VBAT=VCE=1.8V, VOUT=3.3V, Ta=25℃, CIN=4.7μF, CL=10μF VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs XCL101C501BR-G XCL101C501BR-G IOUT= 1.0mA→50mA IOUT= 1.0mA→50mA VOUT VOUT IOUT =50mA IOUT SW IOUT =1.0mA IOUT SW IOUT =50mA IOUT =1.0mA VBAT=VCE=3.0V, VOUT=5.0V, Ta=25℃, CIN=4.7μF, CL=10μF VBAT=VCE=3.0V, VOUT=5.0V, Ta=25℃, CIN=4.7μF, CL=10μF VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs 21/25 XCL100/XCL101 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS CL-2025 CL-2025 PKG CL-2025 Power Dissipation CL-2025-02 CL-2025-02 PKG CL-2025-02 Power Dissipation 22/25 XCL100/XCL101 Series ■MARKING RULE XCL101 ① represents products series MARK PRODUCT SERIES 1 1 ① ② ③ ⑤ 3 ④ 2 6 5 4 XCL101******-G ② represents integer portion of the output voltage XCL101A***** XCL101C***** VOUT (V) MARK VOUT (V) 1.x 2.x 3.x 4.x 5.x 1 2 3 4 5 MARK 1.x 2.x 3.x 4.x 5.x B C D E F CL-2025/CL-2025-02 ③ represents the decimal part of output voltage VOUT(V) MARK PRODUCT SERIES X.0 X.1 X.2 X.3 X.4 X.5 X.6 X.7 X.8 X.9 0 1 2 3 4 5 6 7 8 9 XCL101**0***-G XCL101**1***-G XCL101**2***-G XCL101**3***-G XCL101**4***-G XCL101**5***-G XCL101**6***-G XCL101**7***-G XCL101**8***-G XCL101**9***-G Example (mark②, ③) XCL101A33***-G ② ③ 3 3 MARK XCL101C28***-G ② ③ C 8 XCL101A50***-G ② ③ 5 0 ④, ⑤ represents production lot number 01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 23/25 XCL100/XCL101 Series ■MARKING RULE XCL100 ① represents products series MARK PRODUCT SERIES XCL100A**1/2/3/4/5/6/7/8/9/A/B/CE*-G XCL100B**1/2/3/4/5/6/7/8/9/A/B/CE*-G XCL100C**1/2/3/4/5/6/7/8/9/A/B/CE*-G R S T 1 ① ② ③ ⑤ 3 ④ 2 6 CL-2025-02 5 4 ② represents output voltage MARK VOUT (V) MARK VOUT (V) MARK 1 3.5 7 4.1 D 3.0 VOUT (V) 4.7 2 3.6 8 4.2 E 3.1 4.8 3 3.7 9 4.3 F 3.2 4.9 4 3.8 A 4.4 H 3.3 5.0 5 3.9 B 4.5 K 3.4 - 6 4.0 C 4.6 ③ represents output voltage range and UVLO release voltage MARK Output Voltage UVLO Range Release Voltage 0 3.0~3.4V 1 3.5~5.0V 2 3.0~3.4V 3 3.5~5.0V 4 3.0~3.4V 5 3.5~5.0V 6 3.0~3.4V 7 3.5~5.0V 8 3.0~3.4V 9 3.5~5.0V A 3.0~3.4V B 3.5~5.0V C 3.0~3.4V D 3.5~5.0V E 3.0~3.4V F 3.5~5.0V H 3.0~3.4V K 3.5~5.0V L 3.0~3.4V M 3.5~5.0V N 3.0~3.4V P 3.5~5.0V R 3.0~3.4V S 3.5~5.0V 1.65 XCL100***1**-G 1.70 XCL100***2**-G 1.75 XCL100***3**-G 1.80 XCL100***4**-G 1.85 XCL100***5**-G 1.90 XCL100***6**-G 1.95 XCL100***7**-G 2.00 XCL100***8**-G 2.05 XCL100***9**-G 2.10 XCL100***A**-G 2.20 XCL100***B**-G 2.15 XCL100***C**-G ④, ⑤ represents production lot number 01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 24/25 PRODUCT SERIES XCL100/XCL101 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 25/25
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