SSM6N29TU

SSM6N29TU TOSHIBA Field-Effect Transistor Silicon N Channel MOS Type SSM6N29TU High-Speed Switching Applications • • • 1.8 V drive N-ch 2-in-1 Low ON-resistance: Ron = 235 mΩ (max) (@VGS = 1.8 V) Ron = 178 mΩ (max) (@VGS = 2.5 V) 0.65 0.65 2.0±0.1 1.3±0.1 2.1±0.1 1.7±0.1 +0.1 0.3-0.05 Unit V μA μA V S mΩ pF pF pF ns V Unit: mm Ron = 143 mΩ (max) (@VGS = 4.0 V) Absolute Maximum Ratings (Ta = 25 °C) (Q1 , Q2 Common) Characteristic Drain-source voltage Gate-source voltage Drain current Drain power dissipation Channel temperature Storage temperature range DC Pulse Symbol VDS VGSS ID IDP PD (Note 1) Tch Tstg Rating 20 ± 12 0.8 1.6 500 150 − 55 to 150 Unit V V A mW °C °C 1 2 3 6 5 4 0.7±0.05 Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on an FR4 board. (total dissipation) 2 (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad : 645 mm ) Note: 1.Source1 2.Gate1 UF6 3.Drain2 JEDEC JEITA TOSHIBA Weight: 7 mg (typ.) 4.Source2 5.Gate2 6.Drain1 ― ― 2-2T1B Electrical Characteristics (Ta = 25°C) (Q1 , Q2 Common) Characteristic Drain-source breakdown voltage Drain cutoff current Gate leakage current Gate threshold voltage Forward transfer admittance Symbol V (BR) DSS V (BR) DSX IDSS IGSS Vth ⏐Yfs⏐ RDS (ON) Ciss Coss Crss ton toff VDSF Test Conditions ID = 1 mA, VGS = 0 ID = 1 mA, VGS = − 12 V VDS = 20 V, VGS = 0 VGS = ± 12 V, VDS = 0 VDS = 3 V, ID = 1 mA VDS = 3 V, ID = 0.6 A ID = 0.6 A, VGS = 4.0 V Drain-source ON-resistance ID = 0.4 A, VGS = 2.5 V ID = 0.2 A, VGS = 1.8 V Input capacitance Output capacitance Reverse transfer capacitance Switching time Turn-on time Turn-off time (Note 2) (Note 2) (Note 2) (Note 2) Min 20 10 ⎯ ⎯ 0.4 2.3 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ (Note 2) ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ 3.75 116 134 160 268 44 34 9 16 − 0.8 Max ⎯ ⎯ 1 ±1 1.0 ⎯ 143 178 235 ⎯ ⎯ ⎯ ⎯ ⎯ VDS = 10 V, VGS = 0, f = 1 MHz VDS = 10 V, VGS = 0, f = 1 MHz VDS = 10 V, VGS = 0, f = 1 MHz VDD = 10 V, ID = 0.25 A, VGS = 0 to 2.5 V, RG = 4.7 Ω ID = − 0.8 A, VGS = 0 V Drain-source forward voltage − 1.15 Note 2 : Pulse test 1 2007-11-01 +0.06 0.16-0.05 SSM6N29TU Switching Time Test Circuit (a) Test Circuit (b) VIN OUT IN 0V RG 10 μs VDD = 10 V RG = 4.7 Ω < D.U. = 1% VIN: tr, tf < 5 ns Common Source Ta = 25 °C 10 % 2.5 V 90 % 2.5 V 0 VDD (c) VOUT VDD 10 % 90 % tr ton tf toff VDS (ON) Marking 6 5 4 Equivalent Circuit (top view) 6 5 4 KK1 1 2 3 Q1 Q2 1 2 3 Precaution Vth can be expressed as the voltage between gate and source when the low operating current value is ID= 1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth, and VGS (off) requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on). ) Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. 2 2007-11-01 SSM6N29TU 5 ID - VDS 10 ID - VGS 10 4.0 2.5 1.8 Drain Current ID (A) 1 Ta = 85 °C 4 Drain Current ID (A) 3 0.1 1.5 2 0.01 25 °C 1 VGS = 1.2 V Common Source Ta = 25 °C 0.001 - 25 °C Common Source V DS = 3 V 0 0 0.2 0.4 0.6 0.8 Drain-Source Voltage VDS (V) 1 0.0001 0 1 Gate-Source Voltage VGS (V) 2 RDS(ON) - VGS 200 180 Drain-Source ON-Resistance RDS(ON) (mΩ) 160 140 120 100 80 60 40 20 0 0 1 2 34 56 78 Gate-Source Voltage VGS (V) 9 10 0.5 A ID = 0.2 A 1A Common Source Ta = 25 °C 300 250 200 150 RDS(ON) - Ta Common Source Drain-Source ON-Resistance RDS(ON) (mΩ) 1.8 V , 0.2 A 2.5 V , 0.5 A 100 50 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 VGS = 4 V , ID = 1 A Ambient Temperature Ta(℃) 200 180 Drain-Source ON-Resistance RDS(ON) (mΩ) RDS(ON) - ID 1 Vth - Ta Common Source ID = 1 mA VDS = 3 V Gate Threshold Voltage Vth(V) 160 140 120 100 80 60 40 20 0 0 1 2 3 4 5 Drain Current ID (A) 1.8 V 2.5 V VGS = 4 V 0.8 0.6 0.4 Common Source Ta = 25 °C 0.2 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta(°C) 3 2007-11-01 SSM6N29TU 10.0 |Yfs| - ID 10 Drain Reverse Current IDR (A) IDR - VDS Common Source VGS = 0 V Ta = 25 °C D Forward Transfer Admittance 25 °C - 25 °C 1.0 Ta = 85 °C 1 |Yfs| (S) G IDR 0.1 S 25 °C - 25 °C Common Source V DS = 3 V Ta = 25 °C 0.01 Ta = 85 °C 0.1 0.01 0.1 1 10 Drain Current ID (A) 0.001 0 -0.2 -0.4 -0.6 -0.8 Drain-Source Voltage VDS (V) -1 1000 C - VDS 1000 t - ID Common Source VDD = 10 V VGS = 0 to 2.5 V Ta = 25 °C Switching Time t (ns) Capacitance C (pF ) Ciss toff 100 100 tf ton tr 10 Common Source VGS = 0 V f = 1 MHz Ta = 25 °C 10 0.1 1 10 Coss Crss 100 1 0.01 Drain-Source Voltage V DS ( V) 0.1 1 Drain Current ID ( A) 10 1000 Drain Power Dissipation PD (mW) PD - Ta 1000 Transient Thermal Impedance Rth (°C/W) a : Mounted on an FR4 board. (25.4mm×25.4mm×1.6mm) Cu Pad :25.4mm×25.4mm b : Mounted on a ceramic board. (25.4mm×25.4mm×0.8mm) Cu Pad :25.4mm×25.4mm Rth - tw 800 600 b c 100 b a Single pulse a : Mounted on a ceramic board. (25.4mm×25.4mm×0.8mm) Cu Pad :25.4mm×25.4mm b : Mounted on an FR4 board. (25.4mm×25.4mm×1.6mm) Cu Pad :25.4mm×25.4mm c : Mounted on an FR4 Board (25.4mm×25.4mm×1.6mm) Cu Pad :0.45mm×0.8mm×3 a 400 200 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta(°C) 10 1 0.001 0.01 0.1 1 10 Pulse Width tw (S) 100 1000 4 2007-11-01 SSM6N29TU RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2007-11-01