TC62D902FG,C,8,EL

TC62D902FG TOSHIBA CDMOS Integrated Circuit Silicon Monolithic TC62D902FG Offline Isolated flyback LED Controller with PFC TC62D902FG 1. Feature This product is isolated fly back LED controller IC with the power factor correction function. A LED current that flows to the secondary-side of transformer is controlled by feedback primary-side of transformer. Therefore, the Photo coupler is not used. External parts can be decreased compared with a past isolated fly back system. Moreover, PFC function of one converter type is built into, and the power factor improvement is possible by few parts. P-SOP8-0504-1.27-001 Weight: 0.07g (Typ.) 2. Use of recommend LED lighting 3. Characteristics • • • • • • Isolated PFC LED driver with minimum number of external parts TRIAC Dimmable 1 converter type PFC (PFC >0.9) Opto-isolator not need (Few parts and High Reliability) Valley switch operation (Efficiency improvement &EMI reduction) Detection function Under voltage lockout (UVLO) VIN over voltage detection (VIN-OVD) Sense resistor short detection (SRSD) Sense line open detection (IOD) Over temperature detection (OTD) Output open circuit detection (OOD) Output short circuit detection (OSD) Over current detection (OCD) • Package : P-SOP8-0504-1.27-001 Rev 1.05 1 2012, Dec 01 TC62D902FG 4. Block Diagram 5. Pin Assignment (top view) Rev 1.05 1 OREF VCC 8 2 VSEN GATE 7 3 VIN ISEN 6 4 BLDR GND 5 2 2012, Dec 01 TC62D902FG 6. Pin Functions Pin No 1 Pin Name OREF 2 VSEN I 3 VIN I 4 5 BLDR GND O P 6 ISEN I 7 8 GATE VCC O PI I/O Function I Capacitor connection terminal for internal oscillator Auxiliary voltage sense terminal. The LED current is controlled based on the detection result with this terminal. PFC and TRIAC dimming operates based on the detection result with this terminal. Output terminal for control of external bleeder MOSFET. Grand terminal. Primary current sense terminal. The LED current is controlled based on the detection result with this terminal. Output terminal for control of external power MOSFET. Power supply input terminal. I: input terminal, O: output terminal, P: power supply and ground 7. Absolute Maximum Ratings (Ta = 25°C) Characteristics S u p p l y v o l t a g e Symbol Rating Note1 Unit VCC −0.3~ 40 V OREF terminal voltage VOREF −0.3~ 6.0 V VSEN terminal voltage VVSEN −0.7~ 6.0 V v o l t a g e VVIN −0.3~ 6.0 V V I N t e r m i n a l BLDR terminal voltage VBLDR −0.3~ VCC V I SEN termi nal voltage VISEN −0.3~ 6.0 V terminal voltage VGATE −0.3~VCC V temperature Topr −40~85 °C t e m p e r a t u r e Tstg −55~150 °C Rth(j-a) 90 Note3 °C/ W PD 1.38 Note3,4 W GATE Operating S t o r a g e T h e r m a l P o w e r r e s i s t a n c e d i s s i p a t i o n Note1: Voltage is ground referenced. Note2: PCB condition is 76.2×114.3×1.6mm (JEDEC 4 layer substrate) Note3: When ambient temperature is 25°C or more. Every time ambient temperature exceeded 1°C, please decrease 1/Rth(j-a). Ta Topr Tj : the ambient air temperature of IC. : the ambient air temperature of IC under operation. : It is the junction temperature of IC under operation. Tj maximum is restricted by the TSD (thermal shutdown) circuit. Tj maximum recommends carrying out a thermal design within the limit of a 120 degreeC Cautions on absolute maximum ratings The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. The value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. This device does not have over-voltage protection. Therefore, the device is damaged if a voltage exceeding its rated maximum is applied. All voltage ratings including supply voltages must always be followed. The section on the protection features on the latter page should also be referred to. Rev 1.05 3 2012, Dec 01 TC62D902FG 8. Electrical Characteristics (Unless otherwise noted, Ta = -40~85 °C, VCC=15V) Characteristics Maximum operating voltage S t a r t - u p c u r r e n t Operating supply current Zener diode clamp voltage UVLO release threshold voltage UVLO operati on threshold vol tage I n p u t v o l t a g e r a n g e VIN-OVD threshold voltage Conduction angle detection voltage BLDR terminal off voltage BLDR terminal source resistance BLDR terminal sink resistance O u t p u t V o l t a g e I n p u t l e a k a g e c u r r e n t Valley detection voltage O O P t h r e s h o l d v o l t a g e O S P t h r e s h o l d v o l t a g e GATE terminal sauce resistance GATE terminal sink resistance G AT E t e r m i n a l r i s e t i m e G A T E t e r m i n a l f a l l t i m e Maximum operating frequency O u t p u t V o l t a g e O C P t h r e s h o l d v o l t a g e I O P t h r e s h o l d v o l t a g e S R O P t h r e s h o l d v o l t a g e B l a n k i n g t i m e OTP operation temperature OTP hysteresis temperature Rev 1.05 Symbol VCC(MAX) IINST ICC VZ VUVLO(REL) VUVLO(OPE) Test Circuit Test Conditions VIN = 10 V, CVCC = 10 µF BLDR=OFF,GATE=OFF TA = 25°C, IZ = 5 mA VCC rising VCC falling VIN VVIN-OVD VANG_DET VBLDR RBLDRH RBLDRL VBLDR IIN(Vsen) VVMS VOOP VOSP RGATEH RGATEL trGATE tfGATE fSW(MAX) VBLDR VOCP VOCP VSROP tBLANK TOTP TOTP(HYS) Min Typ. Max Unit 10 1.7 25 15 2.5 29 11 6.5 12 7.5 13 8.5 V µA mA V V V 0 1.85 0.10 2.10 0.14 1.8 2.35 0.18 V V V 0.34   V Ω Ω 0.22   0.28 300 300 Vcc 0.10 1.85 0.10 0.14 2.10 0.14 1 0.18 2.35 0.18 µA V V V     200  30 50 50 30  Vcc       Ω Ω ns ns kHz 1.85 1.85 0.10 0.2 2.10 2.10 0.14 0.3 2.35 2.35 0.18 0.4 V V V µs Temperature rising  140  °C Temperature falling  20  °C IGATE=-5mA IGATE=+5mA VSENSE = 2 V TA = 25°C IGATE=-10mA IGATE=+10mA CL=330pF, 10%to90%,TA = 25°C CL=330pF, 90%to10%,TA = 25°C Ta=25°C 4 2012, Dec 01 TC62D902FG 9. Application Information 9-1Constant current control of LED current IS ILED 0.1µF Duty control circuit VSEN VVMS Bridge Diode GATE V G Q 1 IP Constant current regulation circuit ISEN R SEN VPEAK This waveform shows VAC’s short time. Note: This waveform shows VAC’s short time. 1: Q1 is turned on, and IP flows to the primary-side of transformer. 2: IP is detected by ISEN terminal when IP reaches IP(peak), and Q1 is turned off. *IP(peak)= VPEAK/RSEN 3: IS(peak) is generated on the secondary-side of transformer. *IS(peak)= IP(peak)×Ntr= VPEAK/RSEN×Ntr *Ntr: Ratio of transformer winding on the primary-side and the secondary-side. 4: This current IS decreases as the energy charged in the transformer decreases. And, it becomes 0mA. When IS becomes 0mA, it is detected by VSEN terminal. As a result, TSON can be detected. 5: The frequency control circuit controls T so that TSON/T may become constant. The LED current can be calculated by the following expressions. IC keeps the LED current constant by controlling VPEAK and TSON/T. ILED(Average of IS)=IS(peak)×1/2×TSON/T×2/π = IP(peak)×Ntr×1/2×TSON/T×2/π = VPEAK/RSEN×Ntr×1/2×TSON/T×2/π Application Condition： Rev 1.05 Tson/T = 4/7 (typ.), 1/T = 100kHz ( 30kHz ~ 200kHz) 5 2012, Dec 01 TC62D902FG 9-2 One converter PFC This IC adjusts VPEAK according to AC shape of wave form detected with the VIN terminal. As a result, IP near the sine wave is achieved and power factor will near 0.9 VIN IP ILED IS GATE The output capacitance is necessary for LED to become smooth. The On time of GATE waveform changes by the PFC with the upper figure. Note) There are image, and anytime’s different from the actual wave form. Rev 1.05 6 2012, Dec 01 TC62D902FG 9-3 TRIAC Dimming function Triac Dimme VIN Gate Bleeder GATE Buffer Current Control Logic VBLDR ISEN Blank time VCC Peak current detection BLDR Conduction angle of modulation AC signal of the triac dimmer input to the VIN terminal is detected in threshold VANG-DET. The LED current is changed by adjusting VPEAK by the detection result. Triac dimming range is 5% to 100%. The input voltage of VIN terminal and BLDR terminal is 0V to 1.8V. Threshold voltage of Triac conduction angle Range of VIN VAng-DET≦0.14V (TYP) 0~1.8V VIN VANG_DET BLDR The bleeder current supply terminal changes depending on the input voltage to VIN terminal. Rev 1.05 VIN terminal input voltage condition The breeder current supply terminal Less than 0.28V BLDR ON Over than 0.28V BLDR Off 7 2012, Dec 01 TC62D902FG 9-4 Valley switch operation The EMI noise and the switching loss are decreased by doing the switching when VDS of MOS is the lowest. This IC detects the minimum of VDS by VSEN terminal. When it doesn't meet the condition of turning on by TSON/T control, the valley might be skipped. VGATE VDS 10. Detection function Detection function Over temperature detection (OTD) Effect Over heating prevention Detection point detection level Internal temperature of IC 140°C(TYP) Malfunction prevention by IC Supply voltage abnormality VCC terminal voltage VIN over voltage detection (VIN-OVD) Malfunction prevention by IC Supply voltage abnormality VIN terminal voltage Output open circuit detection (OOD) Over-voltage prevention by LED open-circuit of LED VSEN terminal voltage 2.10V(TYP) for 2 continuous switching cycles Output short circuit Detection (OSD) Malfunction prevention by IC by Short-circuit of LED VSEN terminal voltage 0.14V(TYP) Over current Detection (OCD) Over current prevention by circuit short-circuit ISEN terminal voltage 2.10V(TYP) ISEN line open detection (IOD) Open line of ISEN to Rsense ISEN terminal voltage 2.10V(TYP) 8 Release condition Temperature falls by 20°C(TYP) or more from a detection level Voltage rises by GATE terminal 4.5V(TYP) or more output voltage is set to 0V, and From a detection level 2.10V(TYP) switching Voltage falls by for 15 continuous control of Power blow detection level half AC cycles MOS is stopped. Under voltage lockout (UVLO) Rev 1.05 Operation at the time of detection 7.5V(TYP) Repetition of Starting and Stop. The function of UVLO GATE terminal output voltage is set to 0V, and switching control of Power MOS is stopped. 2012, Dec 01 TC62D902FG 11. Application figure 3 7 4 6 LED 1 TRIAC DIMMER -+ 2 P ＋3 OREF A2 S 4 VSEN － VIN D - 1 BLDR 8 2 7 3 6 4 5 VCC GATE ISEN G GND S G 1 D A1 S 2 AC ～ Rev 1.05 9 2012, Dec 01 TC62D902FG 10. Package dimension Unit : mm Weight: 0.07 g (Typ.) Rev 1.05 10 2012, Dec 01 TC62D902FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a detection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in detection functions. If the power supply is unstable, the detection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Rev 1.05 11 2012, Dec 01 TC62D902FG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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