TLP116A
TOSHIBA PHOTOCOUPLER IRED & PHOTO-IC
TLP116A
Plasma Display Panels (PDPs)
High-Speed Interface
Factory Automation (FA)
Unit: mm
6
Inverter logic (totem-pole output)
SO6 package
Guaranteed performance over: −40 to 100°C
Power supply voltage: 4.5 to 5.5V
Input thresholds current: IFHL = 5 mA (max)
Propagation delay time (tpHL / tpLH): 60 ns (max)
Switching speed: 20 MBd (typ.)
Common-mode transient immunity: 10 kV/μs
Isolation voltage: 3750 Vrms
UL-recognized: UL 1577, File No.E67349
3
1
3.7 ± 0.15
0.4
0.15
7.0 ± 0.4
0.1 2.1 ± 0.1
4
4.55 ± 0.15
The Toshiba TLP116A mini-flat coupler is a small-outline coupler suitable for
surface-mount assembly. The TLP116A consists of an infrared LED and an
integrated high-gain, high-speed photodetector. This unit is housed in the 6-pin
SO package and guarantees a creepage distance of ≥ 5.0mm, a clearance of
≥ 5.0mm and an insulation thickness of ≥ 0.4mm. Therefore, the TLP116A
meets the reinforced insulation class requirements of international safety
standards.
5
0.5 min
1.27
2.54
TOSHIBA
11−4L1
Weight: 0.08 g (typ.)
Pin Configuration (Top View)
1
VCC
6
1: ANODE
3: CATHODE
5
cUL-recognized: CSA Component Acceptance Service No.5A
GND
3
SHIELD
4
4: GND
5: VO (Output)
6: VCC
File No.E67349
CQC-approved: GB4943.1,GB8898 Japan and Thailand Factory
仅适用干海拔 2000m 以下地区安全使用
VDE-approved: EN 60747-5-5 , EN 62368-1
(Note 1)
Schematic
Note 1 : When a VDE approved type is needed,
ICC
please designate the Option(V4).
1+
Truth Table
Input
H
L
LED
ON
OFF
Tr1
OFF
ON
Tr2
ON
OFF
6
IF
Tr1
IO
VF
Output
L
H
3-
Tr2
SHIELD
Construction Mechanical Rating
Creepage Distance: 5.0mm (min)
Clearance:
5.0mm (min)
Insulation Thickness: 0.4mm (min)
VCC
5
4
VO
GND
A bypass capacitor of 0.1μF must be
connected between pins 6 and 4.
Start of commercial production
2008-07
© 2019
Toshiba Electronic Devices & Storage Corporation
1
2019-10-10
TLP116A
Absolute Maximum Ratings (Ta=25°C)
Characteristic
Symbol
Rating
Unit
IF
20
mA
ΔIF / °C
−0.5
mA/°C
IFPT
1
A
Forward current
LED
Forward current derating (Ta ≥ 85°C)
Peak transient forward current
(Note 1)
Reverse voltage
VR
5
V
Input power dissipation
PD
40
mW
ΔPD/°C
-1.0
mW/°C
Input power dissipation derating (Ta ≥ 85°C)
DETECTOR
Output current
IO
10
mA
ΔIO/°C
-0.25
mA/°C
Output voltage
VO
6
V
Supply voltage
VCC
6
V
Output current derating (Ta ≥ 85°C)
PO
40
mW
Operating temperature range
Output power dissipation
Topr
−40 to 100
°C
Storage temperature range
Tstg
−55 to 125
°C
Lead solder temperature(10 s)
Isolation voltage (AC,60 s, R.H. ≤ 60 %)
Note:
(Note 2)
Tsol
260
°C
BVs
3750
Vrms
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1 : Pulse width PW ≤ 1 μs, 300 pps.
Note 2 :This device is regarded as a two terminal device : pins 1 and 3 are shorted together, as are pins 4,5 and 6.
Recommended Operating Conditions
Characteristic
Input current
ON
Symbol
Min
Typ.
Max
Unit
IF(ON)
8
—
18
mA
VF(OFF)
0
—
0.8
V
Supply voltage
VCC
4.5
5.0
5.5
V
Operating temperature
Topr
-40
—
100
°C
Input voltage , OFF
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this product,
please confirm specified characteristics shown in this document.
Note:
The detector of this product requires a power supply voltage (VCC) of 4.5 V or higher for stable operation.
If the VCC is lower than this value, an ICC may increase, or an output may be unstable.
Be sure to use the product after checking the supply current, and the operation of a power-on/-off.
Correlation between Input current, switching speed and drive circuit
(reference information).
Input current
(IF)
12mA
8mA
8mA
Test Circuit
Typical switching speed
1
(Page 4)
1
(Page 4)
2
(Page 4, With Speed up capacitor)
© 2019
Toshiba Electronic Devices & Storage Corporation
21 to 23 MBd
18 to 20 MBd
23 to 27 MBd
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2019-10-10
TLP116A
Electrical Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, VCC=4.5 to 5.5 V )
Characteristic
Symbol
Test
Circuit
VF
—
IF = 10 mA ,Ta = 25 °C
ΔVF /ΔTa
—
IR
Min
Typ.
Max
Unit
1.45
1.58
1.85
V
IF = 10 mA
—
-2.0
—
mV/°C
—
VR=5 V, Ta = 25 °C
—
—
10
μA
CT
—
VF = 0 V, f= 1 MHz, Ta = 25 °C
—
60
—
pF
Logic low output voltage
VOL
1
IOL = 1.6 mA,
IF = 12 mA, VCC = 5 V
—
—
0.4
V
Logic high output voltage
VOH
2
4.0
—
—
V
Logic low supply current
ICCL
3
IF = 12 mA
—
—
5.0
mA
Logic high supply current
ICCH
4
VF = 0 V
—
—
5.0
mA
IFHL
—
IO = 1.6 mA, VO < 0.4 V
—
—
5
mA
VFLH
—
IO = -0.02 mA, VO > 4.0 V
0.8
—
—
V
Input forward voltage
Temperature coefficient
of forward voltage
Input reverse current
Capacitance between Input
terminals
Input current logic low
output
Input voltage logic high
output
Conditions
IOH = −0.02 mA,
VF = 1.05 V, VCC = 5 V
*All typical values are at Ta=25°C, VCC=5 V, IF(ON)=12 mA unless otherwise specified
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
Min
Typ.
Max
Unit
―
0.8
―
pF
Capacitance input to output
CS
Vs = 0 V,f = 1 MHz
Isolation resistance
RS
R.H. ≤ 60 %, VS = 500 V
1012
1014
―
Ω
Isolation voltage
BVS
AC, 60 s
3750
―
―
Vrms
Note : This device is regarded as a two terminal device : pins 1 and 3 are shorted together, as are pins 4,5 and 6.
© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-10-10
TLP116A
Switching Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, VCC=4.5 to 5.5 V)
Characteristic
Test
Circuit
Symbol
Propagation delay time
to logic low output
Propagation delay time
to logic high output
60
ns
tpLH
IF = 12→0 mA
CL = 15 pF
(Note 1)
—
—
60
ns
tpHL
VIN = 0→5 V
(IF = 0→8 mA)
—
—
60
ns
—
—
60
ns
—
—
30
ns
—
15
—
ns
—
15
—
ns
10000
—
—
V/μs
-10000
—
—
V/μs
Switching time dispersion
|tpHL-
between ON and OFF
tpLH|
Output fall time(90-10%)
tf
Output rise time(10-90%)
tr
VIN = 5→0 V
(IF = 8→0 mA)
RIN = 470 Ω
CIN = 27 pF
CL = 15 pF
(Note 1)
IF = 12 mA , RIN = 100 Ω,
CL =15 pF (Note 1)
5
RIN = 100 Ω
CL = 15 pF
(Note 1)
IF = 0→12 mA
IF = 12→0 mA
Common mode transient
immunity at high Level
Unit
—
tpLH
to logic low output
Max
—
6
Propagation delay time
Typ.
RIN = 100 Ω
5
Propagation delay time
Min
IF = 0→12 mA
tpHL
to logic high output
Conditions
VCM = 1000 Vp-p, IF = 0 mA,
CMH
Vo(Min) = 4 V, Ta = 25°C
output
7
Common mode transient
immunity at low level
VCM = 1000 Vp-p, IF = 12 mA,
CML
Vo(Max) = 0.4 V, Ta = 25°C
output
*All typical values are at Ta=25°C
Note 1: CL is less than 15 pF which includes probe and Jig/stray wiring capacitance.
TEST CIRCUIT 1: VOL
IF
→
1
TEST CIRCUIT 2: VOH
VCC
6
5
↑
3
GND 4
SHIELD
1
VCC
0.1 μF
5
IOL
VOL
V
6
VCC
3
↑
SHIELD
GND 4
V
VO
↑
IOH
VCC
0.1 μF
VOH = VCC - VO
TEST CIRCUIT 3: ICCL
IF
→
1
TEST CIRCUIT 4: ICCH
VCC
↑
3
GND
6
ICCL
5
0.1 μF
1
VCC
A
5
VCC
3
4
SHIELD
SHIELD
© 2019
Toshiba Electronic Devices & Storage Corporation
6
4
GND
ICCH
A
0.1 μF
VCC
4
2019-10-10
TLP116A
TEST CIRCUIT 5: tpHL, tpLH
IF = 12 mA(P.G)
(f = 5 MHz , duty = 50%
less than tr = tf = 5 ns)
50%
VCC
0.1 μF
INPUT
MONITORING
NODE
GND
SHIELD
CL=15 pF
IF
Vo
MONITORING
NODE
VCC
tf
VO
tr
V
90% OH
CL = 15 pF
RIN=100 Ω
1.5 V
10%
VOL
tpLH
tpHL
CL is capacitance of the probe and JIG.
(P.G): Pulse Generator
TEST CIRCUIT 6: tpHL, tpLH
VIN = 5 V(P.G)
(f = 5 MHz , duty = 50%
less than tr = tf = 5 ns)
INPUT MONITORING NODE
VCC
0.1 μF
CL=15 pF
SHIELD
CIN=27 pF
GND
Vo
MONITORING
NODE
CL=15 pF
50%
IF
VCC
tf
VO
tr
V
90% OH
RIN=470 Ω
1.5 V
10%
CL is capacitance of the probe and JIG.
(P.G): Pulse Generator
VOL
tpLH
tpHL
TEST CIRCUIT 7: Common-Mode Transient Immunity Test Circuit
90%
IF
→
SW
A
1000 V
6
1
VCC
B
10%
5
VCC
3
SHIELD
GND
4
tf
・SW B : IF=0 mA
CMH
4V
0.4 V
・SW A : IF=12 mA
VCM
CM
© 2019
Toshiba Electronic Devices & Storage Corporation
tr
0.1 μF
VO
5
H
=
800(V )
t r ( µs )
CML
CM
L
=
800(V )
t f ( µs )
2019-10-10
TLP116A
Soldering and Storage
1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown
below, irrespectiveof whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used.
The soldering temperature profile is based on the package surface temperature
(See the figure shown above.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow
Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 °C within 10 seconds is recommended
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not
exceeding 350 °C.
Heating by soldering iron must be done only once per lead.
2. Precautions for General Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-10-10
TLP116A
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-10-10