TOTX1350(F)

TOTX1350(F) FIBER OPTIC TRANSMITTING MODULE TOTX1350(F) GENERAL PURPOSE OPTICAL TRANSMITTING MODULE  JIS F05 type fiber optic connector  650 nm LED  Low current LED drive 1. Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Storage Temperature Tstg −40 to 95 °C Operating Temperature Topr −40 to 85 °C Forward Current (DC) IFDC 30 mA Reverse Voltage VR 5 V Soldering Temperature Tsol 260 (Note 1) °C Note 1: Soldering time ≤ 10 s (More than 1 mm apart from the package). Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature , etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/ “Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc.). 2. Operating Ranges Characteristics Symbol Min Typ. Max Unit IF - 6 8 mA DC - 10 Mb / s Forward Current (DC) Data Rate Start of commercial production 2013-11 © 2015-2020 Toshiba Electronic Devices & Storage Corporation 2020-03-12 1 TOTX1350(F) 3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V) Characteristics Symbol Data Rate (Note 2) Transmission Distance (Note 2) Test Condition Min Typ. Max Unit NRZ Code DC - 10 Mb / s APF (Note 3), IF = 6 mA, Using TORX1350A(F) 40 - 100 m APF (Note 3), IF = 1.5 mA, Using TORX1350A(F) 0.2 - 50 m 0.2 - 10 m - 23.6 - mm - 34.0 - mm -30 - 30 % IF = 6 mA, Using APF (Note 3), -6 - -2 dBm IF = 1.5 mA, Using APF (Note 3), -13 - -8 dBm - 650 - nm IF = 6 mA - 2.0 2.1 V IF = 1.5 mA - 1.8 2.0 V VR = 5 V - - 10 μA APF (Note 3), IF = 6 mA, Using TORX1355(F) IF = 6 mA, Using TORX1350A(F) and TOCA1300 IF = 6 mA, Using TORX1355(F) and TOCA1300 Transmission Distance (Note 2) (Note 4) IF = 6 mA, Using TORX1350A(F) and TOCA1301 IF = 6 mA, Using TORX1355(F) and TOCA1301 Pulse Width Distortion (Note 5) Fiber Output Power (Note 6) Δtw Pf Center Emission Wavelength λc Forward VF Voltage Reverse Current IR Note 2: Use the drive circuit of Chapter 4. Note 3: All Plastic Fiber (980 μm core / 1000 μm cladding, NA = 0.5). Polished surface. Transmission loss is less than 0.18 dB/m. (100m @650nm). Note 4: A distance between fixing pin of TOTX1350(F) and fixing pin of TORX1350A(F) or TORX1355(F) when they connect with optical adapter (TOCA1300 or TOCA1301). Note 5: Between input of driver circuit of TOTX1350(F) and output of TORX1350A(F) or TORX1355(F). Use the drive circuit of Chapter 4. Note 6: Measure with a standard optical fiber with fiber optic connectors. Valued by peak. © 2015-2020 Toshiba Electronic Devices & Storage Corporation 2020-03-12 2 TOTX1350(F) 4. Application Circuit (1) IF = 6 mA operation, Using TORX1350A(F) TOTX1350(F) Replace 47 pF of capacitor with 82 pF if need a smaller jitter. (2) IF = 1.5 mA operation, Using TORX1350A(F) TOTX1350(F) (3) IF = 4 mA operation, Using TORX1355(F) TOTX1350(F) © 2015-2020 Toshiba Electronic Devices & Storage Corporation 2020-03-12 3 TOTX1350(F) (4) IF = 6 mA operation, Using TOCA1300 or TOCA1301 TOTX1350(F) 5. Applicable Optical Fiber with Fiber Optic Connectors All Plastic Fiber (980 μm core / 1000 μm cladding, NA = 0.5) with F05 type optical connector. Polished surface. Transmission loss is less than 0.18 dB/m. (100m @650nm). 6. Applicable Optical Adapters TOCA1300, TOCA1301 7. Precautions during use (1) Absolute maximum rating The absolute maximum ratings are the limit values which must not be exceeded during operation of device. Any rating value must not be exceeded. If the absolute maximum rating value is exceeded, the characteristics of devices may never be restored properly. In extreme cases, the device may be permanently damaged. (2) Operating Range The operating range is the range of conditions necessary for the device to operate as specified in individual technical datasheets and databooks. Care must be exercised in the design of the equipment. If a device is used under conditions that do not exceed absolute maximum ratings but exceed the operating range, the specifications related to device operation and electrical characteristics may not be met, resulting in a decrease in reliability. If greater reliability is required, derate the device’s operating ranges for voltage, current, power and temperature before use. (3) Lifetime of light emitters If an optical module is used for a long period of time, degeneration in the characteristics will mostly be due to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical output of the LEDs used as the light source. The cause of degradation of the optical output of the LEDs may be defects in wafer crystallization or mold resin stress. The detailed causes are, however, not clear. The lifetime of light emitters is greatly influenced by the operating conditions and the environment in which they are used as well as by the lifetime characteristics unique to the device type. Thus, when a light emitting device and its operating conditions determined, Toshiba recommends that lifetime characteristics be checked. Depending on the environment conditions, Toshiba recommends the maintenance such as regular checks of the amount of optical output in accordance with the condition of operating environment. © 2015-2020 Toshiba Electronic Devices & Storage Corporation 2020-03-12 4 TOTX1350(F) (4) Soldering Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules are optical components. During soldering, ensure that flux does not contact with the emitting surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering. Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof. As mentioned before, optical modules are optical components. Thus, in principle, soldering where there may be flux residue and flux removal after soldering are not recommended. Toshiba recommends that soldering be performed without the optical module mounted on the board. Then, after the board has been cleaned, the optical module should be soldered on to the board manually. If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of flux. In such a cases, be sure to check the devices’ reliability. (5) Vibration and shock This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of equipment which will be subject to high levels of vibration. (6) Fixing fiber optical transmitting module Solder the fixing pin (pins 4 and 5) of fiber optic transmitting module TOTX1350(F) to the printed circuit board to fix the module to the board. (7) Solvent When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour solvent into the optical connector ports. If solvent is inadvertently poured into them, clean it off using cotton tips. (8) Protective cap When the TOTX1350(F) is not in use, attach the protective cap. (9) An influence of flash or strong light Do not emit a flash or a strong light to the optical module directly they may cause an error in data transmission. (10) Soldering condition Solder at 260°C or less for no more than ten seconds. (11) Precautions when disposing of devices and packing materials. When disposing devices and packing materials, follow the procedures stipulated by local regulations in order to protect the environment against contamination. (12) Others This product is an optical transmitting module for plastic optical fiber. Use only for an optical transmitting module purpose. © 2015-2020 Toshiba Electronic Devices & Storage Corporation 2020-03-12 5 TOTX1350(F) 8. Package Outline drawing Unit: mm 5 4 3 2 Pin connection 1 1. NC 2. Cathode 3. Anode 4. NC 5. NC Weight: 1.7 g (typ.) © 2015-2020 Toshiba Electronic Devices & Storage Corporation 2020-03-12 6 TOTX1350(F) RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”.  TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.  This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.  Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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