TPC8110_06

TPC8110 TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOS III) TPC8110 Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications • • • • • Small footprint due to small and thin package Low drain-source ON resistance: RDS (ON) = 17 mΩ (typ.) High forward transfer admittance: |Yfs| = 16 S (typ.) Low leakage current: IDSS = −10 µA (max) (VDS = −40 V) Enhancement mode: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −1 mA) Unit: mm Absolute Maximum Ratings (Ta = 25°C) Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 kΩ) Gate-source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD PD EAS IAR EAR Tch Tstg Rating −40 −40 ±20 −8 −32 1.9 1.0 59.4 −8 0.19 150 −55 to 150 Unit V V V A W JEDEC JEITA TOSHIBA ― ― 2-6J1B Weight: 0.080 g (typ.) Pulsed(Note 1) Drain power dissipation (t = 10 s) (Note 2a) Drain power dissipation (t = 10 s) (Note 2b) Single pulse avalanche energy (Note 3) Avalanche current Repetitive avalanche energy (Note 2a) (Note 4) Channel temperature Storage temperature range Circuit Configuration W mJ A mJ °C °C 8 7 6 5 1 2 3 4 Note: (Note 1), (Note 2), (Note 3) and (Note 4): See the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2006-11-16 TPC8110 Thermal Characteristics Characteristics Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Symbol Rth (ch-a) Rth (ch-a) Max 65.8 125 Unit °C/W °C/W Marking (Note 5) TPC8110 Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 × 25.4 × 0.8 (unit: mm) FR-4 25.4 × 25.4 × 0.8 (unit: mm) (a) (b) Note 3: VDD = −24 V, Tch = 25°C (initial), L = 1.0 mH, RG = 25 Ω, IAR = −8 A Note 4: Repetitive rating: pulse width limited by maximum channel temperature Note 5: • on lower left of the marking indicates Pin 1. ※ Weekly code: (Three digits) Week of manufacture (01 for the first week of a year: sequential number up to 52 or 53) Year of manufacture (The last digit of a year) 2 2006-11-16 TPC8110 Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge 1 Gate-drain (“miller”) charge tf toff Qg Qgs1 Qgd Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) |Yfs| Ciss Crss Coss tr ton 0V VGS −10 V 4.7 Ω ID = −4 A VOUT RL = 5 Ω VDS = −10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = ±16 V, VDS = 0 V VDS = −40 V, VGS = 0 V ID = −10 mA, VGS = 0 V ID = −10 mA, VGS = 20 V VDS = −10 V, ID = −1 mA VGS = −4 V, ID = −4.0 A VGS = −10 V, ID = −4.0 A VDS = −10 V, ID = −4.0 A Min ⎯ ⎯ −40 −25 −0.8 ⎯ ⎯ 8 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ VDD ∼ −32 V, VGS = −10 V, − ID = −8 A ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ 27 17 16 2180 275 330 6.0 15 30 115 48 5.5 12 Max ±10 −10 ⎯ ⎯ −2.0 35 25 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ns ⎯ ⎯ ⎯ ⎯ ⎯ nC pF Unit µA µA V V mΩ S VDD ∼ −20 V − Duty < 1%, tw = 10 µs = Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristics Drain reverse current Forward voltage (diode) Pulse (Note 1) Symbol IDRP VDSF Test Condition ⎯ IDR = −8 A, VGS = 0 V Min ⎯ ⎯ Typ. ⎯ ⎯ Max −32 1.2 Unit A V 3 2006-11-16 TPC8110 ID – VDS −10 −10 −8 −8 −6 −5 −6 −4 −3.75 −3.5 −3.25 −3.0 −2.75 −40 −8 −6 −5 −4 ID – VDS Common source Ta = 25°C Pulse test −3.25 ID ID Common source Ta = 25°C Pulse test (A) (A) −30 −10 −3.75 −3.5 Drain current Drain current −2.5 −4 VGS = −2.25 V −2 −20 −3.0 −2.75 −10 −2.5 VGS = −2.25 V 0 0 −0 .2 −0 .4 −0 .6 −0 .8 −1 0 0 −1 −2 −3 −4 −5 Drain-source voltage VDS (V) Drain-source voltage VDS (V) ID – VGS −40 Common source Pulse test VDS = −10 V −30 −0.8 VDS – VGS Common source Ta = 25°C −0.6 Pulse test (A) ID Drain-source voltage Drain current VDS 25 100 (V) −0.4 −20 ID = −8.0 A −0.2 −10 −2.0 −4.0 Ta = −55°C 0 0 −1 −2 −3 −4 −5 0 0 −2 −4 −6 −8 −10 −12 Gate-source voltage VGS (V) Gate-source voltage VGS (V) |Yfs| – ID 100 (S) 50 30 Common source VDS = −10 V Pulse test 1000 500 Ta = −55°C RDS (ON) – ID Common source Ta = 25°C Pulse test |Yfs| Forward transfer admittance 100 10 5 3 25 Drain-source ON resistance RDS (ON) (mΩ) 300 100 50 30 VGS = −4 V −10 10 5 1 0.5 0.3 −0.1 −0.3 −0.5 −1 −3 −5 −10 −30 −50 3 −0.1 −0.3 −0.5 −1 −3 −5 −10 −30 −50 Drain current ID (A) Drain current ID (A) 4 2006-11-16 TPC8110 RDS (ON) – Tc 50 Common source Pulse test −100 IDR – VDS −5 IDR (A) Drain-source ON resistance RDS (ON) (mΩ) 40 ID = 8.0 A −2.0/−4.0 A −10 −10 −3 VGS = −4 V 20 ID = −2.0/−4.0/−8.0 A 10 −10 V Drain reverse current 30 −1 −1 VGS = 0 V, 1 V 0 −80 −40 0 40 80 120 160 −0.1 0 Common source Ta = 25°C Pulse test 0.4 0.8 1.2 1.6 Case temperature Tc (°C) Drain-source voltage VDS (V) Capacitance – VDS 10000 5000 3000 Ciss −2 Vth – Tc Common source VDS = −10 V −1.6 ID = −1 mA Pulse test −1.2 (pF) 1000 500 300 Coss Crss 100 50 30 −0.1 Common source VGS = 0 V f = 1 MHz Ta = 25°C −0.3 −0.5 −1 −3 −5 −10 −30 −50 Gate threshold voltage Capacitance C Vth (V) −0.8 −0.4 0 −80 −40 0 40 80 120 160 Drain-source voltage VDS (V) Case temperature Tc (°C) PD – Tc 2.0 (1) (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) t = 10 s −40 Dynamic Input/Output Characteristics Common source ID = −10 A Ta = 25°C Pulse test −40 (W) (V) 1.6 PD Drain power dissipation Drain-source voltage (2) 0.8 −20 −16 −8 −10 VGS VDD = 32 V −20 −10 0.4 0 0 25 50 75 100 125 150 175 0 0 20 40 80 0 80 Ambient temperature Tc (°C) Total gate charge Qg (nC) 5 2006-11-16 Gate-source voltage 1.2 VDS −30 −30 VGS (V) VDS TPC8110 rth − tw 1000 (°C/W) (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) 100 t = 10 s (2) (1) Normalized transient thermal impedance rth 10 1 Single pulse 0.1 0.001 0.01 0.1 1 10 100 1000 Pulse width tw (s) Safe Operating Area −100 −50 −30 10 ms * ID max (pulse)* 1 ms* (A) ID Drain current −10 −5 −3 −1 −0.5 *: Single pulse Ta = 25°C −0.3 Curves must be derated linearly with increase in temperature. −0.1 −0.1 −1 VDSS max −10 −100 Drain-source voltage VDS (V) 6 2006-11-16 TPC8110 RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 030619EAA • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 7 2006-11-16