TQHIP

Production Process Power MESFET Foundry Service TQHiP Air Bridge - 4um Features • • Metal 1 Metal 1 – 2 um MIM Metal NiCr Metal 0 N+ N+ Isolation Isolation Implant N-/P- Channel • • • • • D MESFET MIM Capacitor Semi-Insulating GaAs Substrate NiCr Resistor Power MESFET Process Interconnects: • 2 Global (one airbridge) • 1 Local High-Q Passives Bulk & Thin Film Resistors Backside Vias Optional High Volume Production Processes Validated Models and Design Support TQHiP Process Cross-Section Applications • • • • • • General Description TriQuint’s TQHiP process is our robust, high power density MESFET process. It provides a straight-forward, low cost process for a variety of circuits and applications. Its high operating and breakdown voltages make it ideal for wireless or wired infrastructure applications. A thick (4 µm) gold airbridge complements the 2 µm thick gold global metal and 0.5 µm thick gold surface layer for wiring flexibility and interconnect density. Precision NiCr resistors and high value MIM capacitors are included. Power Amplifiers Switches Frequencies thru X-Band Base Station Driver Amplifiers CATV Line Amplifiers Cellular Power Amps, Drivers, Switches TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 1 of 4; Rev 2.1 4/30/02 Phone: 503-615-9000 Fax: 503-615-8905 Email: info@triquint.com Production Process Power MESFET Foundry Service TQHiP TQHiP Process Details TQHiP Process Details Element D-FET Vp Gate Length Idss Imax Ft @ 50% Idss Fmax Gm BVgso, Typical BVgdo, Typical BVds, Typical Interconnect MIM Caps Resistors Metal Layers Values NiCr Bulk Inductors Vias Mask Layers No Vias With Vias Q Parameter Value -2.3 0.5 245 370 16.5 60 140 9 14 18 3 600 50 800 25 Yes 14 16 -65 to +150 40 25 ºC V V pF/mm2 Ohms/sq Ohms/sq @ 2 GHz Units V um mA/mm mA/mm GHz GHz mS/mm V V V Maximum Ratings Operating Temperature Range Capacitor Breakdown Voltage—Typ. Min. TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 2 of 4; Rev 2.1 4/30/02 Phone: 503-615-9000 Fax: 503-615-8905 Email: info@triquint.com Production Process Power MESFET Foundry Service TQHiP Measured I-V Characteristic Curve 300 um Device; T=27degC 80.000 60.000 Id (mA) 40.000 20.000 0.000 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 Vd (V) H1SS_DC 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 0.0 1.0 2.0 3.0 Vds (volts) 4.0 5.0 6.0 Vgs=-2.0 Vgs=-1.5 Vgs=-1.0 Vgs=-0.5 Vgs=0.0 Measured vs. Modeled DC Characteristics; H1SS - D1010 FET (Lg = 1.0mm, Lgs = Lgd = 1.0mm) Model Parameters; @ T=27°C. TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 3 of 4; Rev 2.1 4/30/02 Phone: 503-615-9000 Fax: 503-615-8905 Email: info@triquint.com Production Process Power MESFET Foundry Service Prototyping and Development Process Qualification Status TQHiP • • Prototype Wafer Option (PWO): • Customer-specific Masks, Customer Schedule • 2 wafers delivered • Hot Lot Cycle Time • With thinning and sawing; optional backside vias Design Sensitivity Test Run (DST): • Yield Analysis • Design Sensitivity to Process Variation • 14 Wafer Start; Spread of Vp and Cgs values • • • TQHiP is a fully released and qualified process Reliability Reports • TQHiP Process Qualification • High Power Product Qualification • TQHiP Element Qualification Report For more information on Quality and Reliability, contact TriQuint or visit: www.triquint.com/ manufacturing/QR/bdy_qr-pubs.htm • • • • • • Device Library of Circuit Elements: FET, Diodes, Thin Film and Implanted Resistors, Capacitors, Inductors Parameters for “TriQuint’s Own Model” (TOM) in Popular Simulators Agilent ADS Design Kit Available Now PSPICE Models Available Now Layout and Verification Kit for ICEditors Now Qualified Package Models for Supported Package Styles Design Tools Available • • • • • • • • • Tiling of GDSII Stream Files including PCM Design Rule Check Services Layout versus Schematic Check Services Packaging Development Engineering Test Development Engineering: • On-Wafer • Packaged Parts Thermal Analysis Engineering Yield Enhancement Engineering Part Qualification Services Failure Analysis Applications Support Services • • GaAs Design Classes: • Half Day Introduction; Upon Request • Four Day Technical Training; Fall & Spring at TriQuint Oregon facility For Training and Schedules please visit:: www.triquint.com/foundry Training • • • • • • • • • Mask Making Production 150 Wafer Fab Wafer Thinning Wafer Sawing Substrate Vias DC Die Sort Testing RF On-Wafer Testing Plastic Packaging RF Packaged Part Testing Manufacturing Services Please contact your local TriQuint Semiconductor Representative/ Distributor or Foundry Services Division Marketing for Additional information: E-mail: sales@triquint.com; Phone: (503) 615-9000 Fax: (503) 615-8905 Semiconductors for Communications www.triquint.com Page 4 of 4; Rev 2.1 4/30/02 TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Phone: 503-615-9000 Fax: 503-615-8905 Email: info@triquint.com