292D

292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded FEATURES • 0805 Footprint • Wraparound lead (Pb)-free terminations: P and R Cases • 8 mm, 12 mm, 16 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3, 7" [178 mm] standard 13" [330 mm] available Pb-free Available RoHS* COMPLIANT P and R cases Image is not to scale PERFORMANCE CHARACTERISTICS Operating Temperature: - 55 °C to + 85 °C (To + 125 °C with voltage derating) Note: Refer to Doc. 40088 Capacitance Range: 1.0 µF to 47 µF Capacitance Tolerance: ± 10 %, ± 20 % standard Voltage Rating: 3 WVDC to 20 WVDC ORDERING INFORMATION 292D TYPE 106 CAPACITANCE X0 CAPACITANCE TOLERANCE X0 = ± 20 % X9 = ± 10 % 010 DC VOLTAGE RATING AT + 85 °C This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 volts). P CASE CODE 2 TERMINATION T REEL SIZE AND PACKAGING T = Tape and reel* 7" [178 mm] reel W = 13" [330 mm] reel *Cathode nearest sprocket hole This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow. See Ratings and Case Codes Table 2 = 100 % Tin 4 = Gold Plated 8 = Solder Plated (60/40) Special Order Note: Preferred Tolerance and reel sizes are in bold DIMENSIONS in inches [millimeters] P L Tantalum Wire Nib Identifies Anode (+) Terminal P W H CASE R P EIA 0805 [2012] 0805 [2012] L 0.079 ± 0.008 [2.0 ± 0.2] 0.079 ± 0.010 [2.0 ± 0.25] W 0.051 ± 0.008 [1.3 ± 0.2] 0.053 ± 0.008 [1.35 ± 0.2] H 0.047 (Max.) [1.2 Max.] 0.053 ± 0.008 [1.35 ± 0.2] P 0.020 ± 0.012 [0.5 ± 0.3] 0.020 ± 0.012 [0.5 ± 0.3] RATINGS AND CASE CODES µF 1.0 2.2 3.3 4.7 6.8 10 15 22 33 47 3V 4V R R R R R R P/R P/R P 6.3 V R R R P/R R P/R P 10 V R R P/R P/R P/R P/R P 16 V R R R R P 20 V R R * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 40042 Revision: 05-Mar-08 For technical questions, contact: tantalum@vishay.com www.vishay.com 35 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded STANDARD RATINGS CAPACITANCE (µF) 47 2.2 3.3 4.7 6.8 10 15 22 22 33 33 33 2.2 4.7 4.7 6.8 6.8 10 10 15 15 22 22 22 33 1.0 2.2 3.3 3.3 3.3 4.7 4.7 4.7 6.8 6.8 10 10 15 15 1.0 2.2 3.3 3.3 4.7 10 1.0 2.2 CASE CODE P R R R R R R P R P P R R R R R R P R R R P P R P R R R R P P R R P R P R P P R R R R R P R R MAX DCL MAX DF MAX ESR AT + 25 °C AT + 25 °C at 100 kHz (µA) (%) (Ω) 3 WVDC AT + 85 °C, SURGE = 3.9 V. . .1.9 WVDC AT + 125 °C, SURGE = 2.9 V 292D476X_003P2T 1.5 12 6.0 4 WVDC AT + 85 °C, SURGE = 5.2 V. . .2.7 WVDC AT + 125 °C, SURGE = 3.4 V 292D225X_004R2T 0.5 6 7.6 292D335X_004R2T 0.5 6 7.6 292D475X_004R2T 0.5 6 6.3 292D685X_004R2T 0.5 6 5.5 292D106X_004R2T 0.5 6 5.1 292D156X_004R27 0.8 8 3.5 292D226X_004P2T 0.9 8 3.5 292D226X_004R2T 0.9 10 3.5 292D336X_004P2T 1.3 10 3.5 292D336X_004P2T_035 1.3 10 1.1 292D336X_004R2T 1.3 12 3.5 6.3 WVDC AT + 85 °C, SURGE = 8 V. . .4 WVDC AT + 125 °C, SURGE = 5 V 292D225X_6R3R2T 0.5 10 7.6 292D475X_6R3R2T_035 0.6 6 2.0 292D475X_6R3R2T 0.6 6 3.4 292D685X_6R3R2T 0.5 6 5.0 292D685X_6R3R2T_035 0.5 6 2.0 292D106X_6R3P2T 0.6 6 3.5 292D106X_6R3R2T 0.6 6 1.2 292D156X_6R3R2T_035 0.9 10 3.5 292D15X_6R3R2_035 0.9 10 1.8 292D226X_6R3P2T 1.3 10 3.5 292D226X_6R3P2_035 0.9 10 1.1 292D226X_6R3R2T 1.4 10 3.5 292D336X_6R3P2T 2.1 12 3.5 10 WVDC AT+ 85 °C, SURGE = 13 V. . .7 WVDC AT + 125 °C, SURGE = 8 V 292D105X_010R2 0.5 4 9.6 292D225X_010R2T 0.5 6 6.3 292D335X_010R2T 0.5 8 2.0 292D335X_010R2_035 0.5 8 1.0 292D335X_010P2T 0.5 8 2.0 292D475X_010P2T 0.5 8 5.0 292D475X_010R2T 0.5 8 5.0 292D475X_010R2T_035 0.5 8 2.0 292D685X_010P2T 0.7 8 2.0 292D685X_010R2T 0.7 8 2.0 292D106X_010P2T 1.0 8 2.0 292D106X_010R2T 1.0 8 2.0 292D156X_010P2T 1.5 8 3.5 292D156X_010P2_035 1.5 8 1.1 16 WVDC AT + 85 °C, SURGE = 20 V. . .10 WVDC AT + 125 °C, SURGE = 12 V 292D105X_016R2 0.5 4 9.3 292D225X_016R2T 0.35 8 6.0 292D335X_016R2T 0.53 8 6.0 292D335X_016R2_035 0.53 8 3.0 292D475X_016R2T 0.75 8 6.0 292D106X_016P2T 1.6 8 6.0 20 WVDC AT + 85 °C, SURGE = 26 V. . .13 WVDC AT + 125 °C, SURGE = 16 V 292D105X_020R2T 0.2 8 5.0 292D225X_020R2T 0.5 8 6.0 PART NUMBER MAX RIPPLE 100 kHz Irms (A) 0.21 0.057 0.057 0.063 0.067 0.070 0.085 0.085 0.085 0.085 0.151 0.085 0.057 0.086 0.086 0.071 0.067 0.085 0.144 0.085 0.118 0.118 0.151 0.085 0.085 0.051 0.063 0.112 0.158 0.112 0.071 0.071 0.112 0.112 0.112 0.112 0.112 0.085 0.151 0.052 0.065 0.065 0.091 0.065 0.065 0.071 0.140 www.vishay.com 36 For technical questions, contact: tantalum@vishay.com Document Number: 40042 Revision: 05-Mar-08 292D Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded CAPACITORS PERFORMANCE CHARACTERISTICS ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM Category Temperature Range Capacitance Tolerance Dissipation Factor (at 120 Hz) ESR (100 kHz) PERFORMANCE CHARACTERISTICS - 55 °C to + 85 °C (to + 125 °C with voltage derating) ± 20 %, ± 10 % (at 120 Hz) 2 Vrms at + 25 °C using a capacitance bridge Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz. Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz. After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with Leakage Current 1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in. See graph below for the appropriate adjustment factor. Reverse Voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC 5 % of the DC rating at + 85 °C Vishay does not recommended intentional or repetitive application of reverse voltage Temperature Derating If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage 1.0 at + 25 °C 0.9 at + 85 °C 0.4 at + 125 °C Maximum Permissible Power Dissipation at 25 °C (W) in free air Operating Temperature P- + R-case: 0.025 + 85 °C RATING WORKING VOLTAGE SURGE VOLTAGE 4 5.2 6.3 8 10 13 16 20 20 26 25 32 35 46 50 65 + 125 °C RATING WORKING VOLTAGE SURGE VOLTAGE 2.7 3.4 4 5 7 8 10 12 13 16 17 20 23 28 33 40 Vishay Sprague TYPICAL LEAKAGE CURRENT FACTOR RANGE LEAKAGE CURRENT FACTOR 100 10 1.0 0.1 - 55 °C 0.01 + 125 °C + 85 °C + 55 °C + 25 °C 0 °C 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes: • At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings Table • At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table • At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table Document Number: 40042 Revision: 05-Mar-08 For technical questions, contact: tantalum@vishay.com www.vishay.com 37 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded ENVIRONMENTAL PERFORMANCE CHARACTERISTICS ITEM Life Test at + 85 °C CONDITION 1000 h application of rated voltage at 85 °C with a 3 Ω series resistance, MIL-STD 202G Method 108A At 40 °C/90 % RH 500 h, no voltage applied. MIL-STD 202G Method 103B POST TEST PERFORMANCE Capacitance Change Dissipation Factor Leakage Current Capacitance Change Dissipation Factor Leakage Current Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial Humidity Tests Thermal Shock At - 55 °C/+ 125 °C, 30 min. each, for 5 cycles. MIL-STD 202G Method 107G MECHANICAL PERFORMANCE CHARACTERISTICS TEST CONDITION Terminal Strength CONDITION Apply a pressure load of 5 N for 10 ± 1 s horizontally to the center of capacitor side body. AECQ-200 rev. C Method 006 POST TEST PERFORMANCE Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Initial specified value or less Initial specified value or less There shall be no mechanical or visual damage to capacitors post-conditioning. Substrate Bending (Board flex) Vibration With parts soldered onto substrate test board, apply force to the test board for a deflection of 1 mm. AECQ-200 rev. C Method 005 MIL-STD-202G, Method 204D, 10 Hz to 2000 Hz, 20 G Peak Capacitance Change Dissipation Factor Leakage Current Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Initial specified value or less Initial specified value or less Refer to Standard Ratings Table Initial specified value or less Initial specified value or less There shall be no mechanical or visual damage to capacitors post-conditioning. Shock Mil-Std-202G, Method 213B, Condition I, 100G Peak Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Initial specified value or less Initial specified value or less There shall be no mechanical or visual damage to capacitors post-conditioning. Resistance to Solder Heat At 260 °C, for 10 s, reflow Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial There shall be no mechanical or visual damage to capacitors post-conditioning. Solderability MIL-STD-202G, Method 208H, ANSI/J-Std-002, Test B. Applies only to Solder and tin plated terminations. Does not apply to gold terminations. MIL-STD-202, Method 215D Encapsulation materials meet UL94 VO with an oxygen index of 32 %. There shall be no mechanical or visual damage to capacitors post-conditioning. There shall be no mechanical or visual damage to capacitors post-conditioning. Resistance to Solvents Flammability www.vishay.com 38 For technical questions, contact: tantalum@vishay.com Document Number: 40042 Revision: 05-Mar-08 292D Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Deformation Between Embossments 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] 10 Pitches Cumulative Toler ance on T ape ± 0.008 [0.200] Embossment 0.069 ± 0.004 0.079 ± 0.002 [1.75 ± 0.10] [2.0 ± 0.05] Vishay Sprague Tape Thickness 0.014 [0.35] MAX. Top Cover Tape B1 MAX. (Note 6) K0 Top Cover Tape 0.004 [0.1] MAX. For Tape Feeder Reference only including draft. Concentric around B0 (Note 5) Center Lines of Ca vity A0 B0 0.030 [0.75] MIN.(Note 3) 0.030 [0.75] MIN.(Note 4) 20° F W Maximum Component Rotation (Side or Front Sectional Vie w ) P1 D1 MIN. For Components 0.079 x 0.047 [2.0 x 1.2] and Larger . Maximum (Note 5) Cavity Siz e (Note 1) USER DIRECTION OF FEED Cathode (-) Anode (+) Direction of Feet 20° Maximum Component Rotation Typical Component Cavity Center Line 3.937 [100.0] 0.039 [1.0] MAX. Tape 0.039 [1.0] MAX. 0.9843 [250.0] Camber (Top Vie w) Allo wable Camber to be 0.039/3.937 [1/100] Non-Cumulative Ov er 9.843 [250.0] B0 Tape and Reel Specifications: All case sizes are available on plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3 is also available. Standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. The most efficient packaging quantities are full reel increments on a given reel diameter. The quantities shown allow for the sealed empty pockets required to be in conformance with EIA-481-1. Reel size and packaging orientation must be specified in the Vishay Sprague part number. A0 (Top View) Typical Component Center Line CASE CODE 292D P R TAPE SIZE B1 (MAX.) D1 (MIN.) F K0 (MAX.) P1 W 8 mm 0.092 ± 0.0039 0.0394 + 0.0098 [2.34 ± 0.100] [1.5 + 0.100] 0.1378 ± 0.0098 [3.5 ± 0.05] 0.053 ± 0.0039 [1.35 ± 0.100] 0.157 ± 0.0039 [4.0 ± 0.2] 0.315 + 0.0118/- 0.0039 [8.0 + 0.30/- 0.10] Note: Metric dimensions will govern. Dimensions in inches are rounded and for reference only STANDARD PACKAGING QUANTITY SERIES 292D CASE CODE P, R QTY (PCS/REEL) 7" REEL 2500 13" REEL 10 000 Document Number: 40042 Revision: 05-Mar-08 For technical questions, contact: tantalum@vishay.com www.vishay.com 39 292D Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded RECOMMENDED VOLTAGE DERATING GUIDELINES STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS Capacitor Voltage Rating 4.0 6.3 10 16 20 25 35 50 SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS Capacitor Voltage Rating 4.0 6.3 10 16 20 25 35 50 Operating Voltage 2.5 3.6 6.0 10 12 15 24 28 Operating Voltage 2.5 3.3 5.0 8.0 10 12 15 24 RECOMMENDED REFLOW PROFILES Tp °C TL °C Temperature (°C) Ts MAX. °C (tL) (tp) Ts MAX. °C Preheat (ts) 25 °C All Case Codes TYPE 292D TP lead (Pb)-free 260 °C TP Sn/Pb 225 °C tP 10 TL lead (Pb)-free 217 °C TL Sn/Pb 183 °C TS MIN. lead (Pb)-free 150 °C TS MIN. Sn/Pb 100 °C TS MAX. lead (Pb)-free 200 °C TS MAX. Sn/Pb 150 °C tS lead (Pb)-free 60 - 150 tS Sn/Pb 60 - 90 tL 70 PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE 292D P, R A B C D 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] www.vishay.com 40 For technical questions, contact: tantalum@vishay.com Document Number: 40042 Revision: 05-Mar-08 292D Solid Tantalum Chip Capacitors, TANTAMOUNT® Lead Frameless Molded GUIDE TO APPLICATION 1. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: I rms = where, P= P --------------R ESR 7. 7.1 6. Vishay Sprague Printed Circuit Board Materials: Molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). Attachment: Solder Paste: The recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. Soldering: Capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per second. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. RESR = 2. Power Dissipation in Watts at + 25 °C as given in the table in Paragraph Number 5 (Power Dissipation). The capacitor Equivalent Series Resistance at the specified frequency. A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: P V rms = Z --------------R ESR or, from the formula: V rms = I rms × Z where, P= Power Dissipation in Watts at + 25 °C as given in the table in Paragraph Number 5 (Power Dissipation). The capacitor Equivalent Series Resistance at the specified frequency. The capacitor impedance at the specified frequency. 7.2 RESR = Z= 2.1 The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at + 25 °C. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at + 25 °C, 5 % of the DC rating at + 85 °C and 1 % of the DC rating at + 125 °C. Temperature Derating: If these capacitors are to be operated at temperatures above + 25 °C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: TEMPERATURE + 25 °C + 85 °C + 125 °C DERATING FACTOR 1.0 0.9 0.4 7.2.1 Backward and Forward Compatibility: Capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: Molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 minutes. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. www.vishay.com 41 2.2 3. 4. 8.1 9. 5. Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25 °C temperature rise.) Document Number: 40042 Revision: 05-Mar-08 For technical questions, contact: tantalum@vishay.com Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1