BYV26EGP

BYV26DGP & BYV26EGP Vishay General Semiconductor Glass Passivated Ultrafast Rectifier FEATURES • Cavity-free glass-passivated junction ® • Ultrafast reverse recovery time • Low forward voltage drop • Low switching losses, high efficiency * nted e Pat * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 • High forward surge capability • Meets environmental standard MIL-S-19500 DO-204AC (DO-15) • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF TJ max. 1.0 A 800 V, 1000 V 30 A 75 ns 1.3 V 175 °C MECHANICAL DATA Case: DO-204AC, molded epoxy over glass body Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC Q101 qualified), meets JESD 201 class 2 whisker test Polarity: Color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5 mm) lead length (Fig. 1) Peak forward surge current 10 ms single half sine-wave superimposed on rated load Non repetitive peak reverse energy (1) Operating junction and storage temperature range Note: (1) Peak reverse energy measured at IR = 400 mA, TJ = TJ max. on inductive load, t = 20 µs SYMBOL VRRM VRMS VDC IF(AV) IFSM ERSM TJ, TSTG BYV26DGP 800 560 800 1.0 30 10 - 65 to + 175 BYV26EGP 1000 700 1000 UNIT V V V A A mj °C Document Number: 88554 Revision: 20-Aug-07 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com www.vishay.com 1 BYV26DGP & BYV26EGP Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER Minimum avalanche breakdown voltage Maximum instantaneous forward voltage Maximum DC reverse current at rated DC blocking voltage Max. reverse recovery time Typical junction capacitance TEST CONDITIONS 100 µA 1.0 A TJ = 25 °C TJ = 175 °C TA = 25 °C TA = 165 °C IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 4.0 V, 1 MHz SYMBOL VBR VF IR trr CJ BYV26DGP 900 2.5 1.3 5.0 150 75 15 BYV26EGP 1100 UNIT V V µA ns pF THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER Typical thermal resistance (1)(2) Notes: (1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on P.C.B. with 0.5 x 0.5" (12 x 12 mm) copper pads (2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink SYMBOL RθJA RθJL BYV26DGP 70 16 BYV26EGP UNIT °C/W ORDERING INFORMATION (Example) PREFERRED P/N BYV26EGP-E3/54 BYV26EGP-E3/73 BYV26EGPHE3/54 (1) BYV26EGPHE3/73 Note: (1) Automotive grade AEC Q101 qualified (1) UNIT WEIGHT (g) 0.428 0.428 0.428 0.428 PREFERRED PACKAGE CODE 54 73 54 73 BASE QUANTITY 4000 2000 4000 2000 DELIVERY MODE 13" diameter paper tape and reel Ammo pack packaging 13" diameter paper tape and reel Ammo pack packaging RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) 1.2 1.8 Resistive or Inductive Load 1.0 TL = Lead Temperature Lead Mounted on Heatsinks 1.6 D = 0.3 D = 0.2 D = 0.1 Average Forward Rectified Current (A) D = 0.8 D = 0.5 Average Power Loss (W) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 D = 1.0 0.8 0.6 Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.5 x 0.5" (12 x 12 mm) Copper Pads TA = Ambient Temperature 0 0 25 50 75 100 125 150 175 0.4 T 0.2 D = tp/T tp 0 0.2 0.4 0.6 0.8 1.0 1.2 Temperature (°C) Average Forward Current (A) Figure 1. Maximum Forward Current Derating Curve Figure 2. Forward Power Loss Characteristics www.vishay.com 2 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com Document Number: 88554 Revision: 20-Aug-07 BYV26DGP & BYV26EGP Vishay General Semiconductor 100 100 TJ = TJ Max. 10 ms Single Half Sine-Wave TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p Peak Forward Surge Current (A) 10 Junction Capacitance (pF) 1 10 100 10 1 1 0.1 1 10 100 Number of Cycles at 60 Hz Reverse Voltage (V) Figure 3. Maximum Non-Repetitive Peak Forward Surge Current Figure 6. Typical Junction Capacitance 100 100 TJ = 175 °C 10 TJ = 150 °C 1 TJ = 125 °C 0.1 Transient Thermal Impedance (°C/W) Instantaneous Forward Current (A) 10 Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.47 x 0.47" (12 x 12 mm) Copper Pads TJ = 25 °C 0.01 0.2 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 1 0.01 0.1 1 10 100 Instantaneous Forward Voltage (V) t - Pulse Duration (s) Figure 4. Typical Instantaneous Forward Voltage Characteristics Figure 7. Typical Transient Thermal Impedance 100 TJ = 175 °C TJ = 165 °C Instantaneous Reverse Leakage Current (µA) 10 TJ = 125 °C 1 0.1 TJ = 25 °C 0.01 0.001 0 20 40 60 80 100 Percent of Peak Reverse Voltage (%) Figure 5. Typical Reverse Leakage Characteristics Document Number: 88554 Revision: 20-Aug-07 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com www.vishay.com 3 BYV26DGP & BYV26EGP Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-204AC (DO-15) 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 0.300 (7.6) 0.230 (5.8) 0.140 (3.6) 0.104 (2.6) DIA. 1.0 (25.4) MIN. www.vishay.com 4 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com Document Number: 88554 Revision: 20-Aug-07 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1