VLMY3191

VLMY3191 Vishay Semiconductors Standard SMD LED PLCC2 94 8553 FEATURES • Lead (Pb)-free product - RoHS compliant • SMD LED with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with infrared, vapor phase and wave solder processes according to CECC • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: acc. to JEDEC level 2 a APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product series: LED • Package: SMD PLCC-2 • Product group: standard • Angle of half intensity: ± 60° PARTS TABLE PART VLMY3191-GS08 VLMY3191-GS18 COLOR, LUMINOUS INTENSITY Yellow, IV = (7.1 to 18) mcd Yellow, IV = (7.1 to 18) mcd TECHNOLOGY GaAsP on GaP GaAsP on GaP Document Number 84760 Rev. 1.4, 24-Sep-07 www.vishay.com 1 VLMY3191 Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMY3191 PARAMETER Reverse voltage 2) TEST CONDITION Tamb ≤ 60 °C tp ≤ 1 0 μ s Tamb ≤ 60 °C SYMBOL VR IF IFSM PV Tj Tamb Tstg VALUE 6 30 0.5 100 100 - 40 to + 100 - 55 to + 100 260 400 UNIT V mA A mW °C °C °C °C K/W DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ ambient t≤5s mounted on PC board (pad size > 16 mm2) Tsd RthJA Note: 1) Tamb = 25 °C, unless otherwise specified 2) Driving the LED in reverse direction is suitable for short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMY3191, YELLOW PARAMETER Luminous intensity Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 μA VR = 0, f = 1 MHz PART VLMY 3191 SYMBOL IV λd λp ϕ VF VR Cj 6 MIN 7.1 583 588 590 ± 60 2.4 15 15 3.0 TYP. MAX 18 592 UNIT mcd nm nm deg V V pF Note: 1) Tamb = 25 °C, unless otherwise specified LUMINOUS INTENSITY CLASSIFICATION GROUP K1 K2 L1 L2 Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, singe wavelength groups will not be orderable. LUMINOUS INTENSITY (MCD) MIN. 7.10 9.00 11.20 14.00 MAX. 9.00 11.20 14.00 18.00 COLOR CLASSIFICATION GROUP DOMINANT WAVELENGTH (NM) YELLOW MIN. 1 2 3 4 5 6 581 583 585 587 589 591 MAX. 584 586 588 590 592 594 www.vishay.com 2 Document Number 84760 Rev. 1.4, 24-Sep-07 VLMY3191 Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 0° 10° 20° 30° 100 IV rel - Relative Luminous Intensity 125 P - Power Dissipation (mW) V 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6 75 50 25 0 0 95 10904 20 40 60 80 100 95 10319 Tamb - Ambient Temperature (°C) Figure 1. Power Dissipation vs. Ambient Temperature Figure 4. Rel. Luminous Intensity vs. Angular Displacement 60 100 yellow IF - Forward Current (mA) 40 30 20 10 0 0 20 40 60 80 100 - Forward Current (mA) I F 50 10 1 0.1 0 95 9987 1 2 3 4 5 95 10905 Tamb - Ambient Temperature (°C) V F - Forward Voltage (V) Figure 2. Forward Current vs. Ambient Temperature Figure 5. Forward Current vs. Forward Voltage 10000 t p /T = 0.005 Tamb < 60 °C 0.01 0.02 0.05 2.0 I v rel - Relative Luminous Intensity yellow 1.6 I F - Forward Current (mA) 1000 1.2 100 0.2 0.5 DC 0.8 10 0.1 0.4 1 0.01 95 9985 0 0.1 1 10 100 95 9992 0 20 40 60 80 100 t p - Pulse Length (ms) T amb - Ambient Temperature (°C) Figure 3. Forward Current vs. Pulse Length Figure 6. Rel. Luminous Intensity vs. Ambient Temperature Document Number 84760 Rev. 1.4, 24-Sep-07 www.vishay.com 3 VLMY3191 Vishay Semiconductors 2.4 I v rel - Relative Luminous Intensity IV rel - Relative Luminous Intensity yellow 2.0 1.6 1.2 0.8 0.4 0 95 10260 1.2 yellow 1.0 0.8 0.6 0.4 0.2 0 550 95 10039 10 1 20 0.5 50 0.2 100 0.1 200 0.05 500 I F (mA) 0.02 tp /T 570 590 610 630 650 λ - Wavelength (nm) Figure 7. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle Figure 9. Relative Luminous Intensity vs. Wavelength 10 I v rel - Relative Luminous Intensity yellow 1 0.1 0.01 1 95 9999 10 I F - Forward Current (mA) 100 Figure 8. Relative Luminous Intensity vs. Forward Current PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 1.75 ± 0.10 technical drawings according to DIN specifications 0.9 Mounting Pad Layout Pin identification 1.2 area covered with solder resist 2.6 (2.8) + 0.15 2.2 C A 2.8 4 1.6 (1.9) ? 2.4 3 + 0.15 Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1 www.vishay.com 4 4 Document Number 84760 Rev. 1.4, 24-Sep-07 VLMY3191 Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertation. The blister tape is a plastic strip with impressed component cavaties, covered by a top tape. REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (=8000 PCS.) PREFERRED 120° 10.4 8.4 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Identification Label: Vishay Type Group Tape Code Production Code Quantity Adhesive Tape 321 329 14.4 max. 18857 Figure 12. Reel Dimensions - GS18 Blister Tape SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a 300 Component Cavity 94 8670 250 Temperature (°C) 255 °C 255°C 240 °C 217 °C max. 260 °C 245 °C TAPING OF VLM.3... 3.5 3.1 2.2 2.0 200 max. 30 s 150 max. 120 sec max. 100 sec 100 max. Ramp Up 3 °C/sec max. Ramp Down 6 °C/sec 5.75 5.25 3.6 3.4 1.85 1.65 50 4.0 3.6 8.3 7.7 0 0 19470-2 50 100 150 Time (s) 200 250 300 max. 2 cycles allowed 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 Figure 13. Vishay Lead (Pb) -free Reflow Soldering Profile (acc. to J-STD-020B) TTW Soldering (acc. to CECC00802) 948626-1 94 8668 Figure 10. Tape Dimensions in mm for PLCC-2 300 250 5s 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C second wave ca. 2 K/s Lead Temperature full line: typical dotted line: process limits REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (=1500 PCS.) 120° 10.0 9.0 Temperature (°C) 200 150 100 50 0 2 K/s forced cooling ca. 5 K/s 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 0 50 100 Time (s) 150 200 250 Identification Label: Vishay Type Group Tape Code Production Code Quantity Figure 14. Double Wave Soldering of Opto Devices (all packages) 180 178 14.4 max. 94 8665 Figure 11. Reel Dimensions - GS08 Document Number 84760 Rev. 1.4, 24-Sep-07 www.vishay.com 5 VLMY3191 Vishay Semiconductors BAR CODE PRODUCT LABEL 106 A H VISHAY 37 BC 19799 D E F G A) Type of componenent B) Manufacturing plant C) SEL - selection code (bin): e.g.: K2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE –SENSITIVE DEVICES CAUTION 2a 1. Shelf life in sealed bag 12 months at