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W29N01GZDIBA

W29N01GZDIBA

  • 厂商:

    WINBOND(华邦)

  • 封装:

    VFBGA-48

  • 描述:

    IC FLASH 1GBIT PARALLEL 48VFBGA

  • 数据手册
  • 价格&库存
W29N01GZDIBA 数据手册
W29N01GZ/W W29N01GZ/W 1G-BIT 1.8V NAND FLASH MEMORY 1 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 7 2. FEATURES ....................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 8 3.1 Pin assignment 48 ball VFBGA(X8/X16) ......................................................................... 8 3.2 Pin Descriptions .................................................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Enable (#CE).............................................................................................................. 10 4.2 Write Enable (#WE) ............................................................................................................ 10 4.3 Read Enable (#RE) ............................................................................................................ 10 4.4 Address Latch Enable (ALE) .............................................................................................. 10 4.5 Command Latch Enable (CLE) .......................................................................................... 10 4.6 Write Protect (#WP)............................................................................................................ 10 4.7 Ready/Busy (RY/#BY) ........................................................................................................ 10 4.8 Input and Output (I/Ox) ....................................................................................................... 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. MEMORY ARRAY ORGANIZATION .............................................................................................. 12 6.1 X8 Array Organization ........................................................................................................ 12 6.2 X16 Array Organization ...................................................................................................... 13 7. MODE SELECTION TABLE ........................................................................................................... 14 8. COMMAND TABLE......................................................................................................................... 15 9. DEVICE OPERATIONS .................................................................................................................. 16 9.1 READ operation .................................................................................................................. 16 9.2 9.3 9.4 9.1.1 PAGE READ (00h-30h)......................................................................................................... 16 9.1.2 CACHE READ OPERATIONS .............................................................................................. 17 9.1.3 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 21 9.1.4 READ ID (90h) ...................................................................................................................... 22 9.1.5 READ PARAMETER PAGE (ECh) ....................................................................................... 23 9.1.6 READ STATUS (70h)............................................................................................................ 25 9.1.7 READ UNIQUE ID (EDh) ...................................................................................................... 27 PROGRAM operation ......................................................................................................... 28 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 28 9.2.2 SERIAL DATA INPUT (80h).................................................................................................. 28 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 29 9.2.4 CACHE PROGRAM (80h-15h) ............................................................................................. 29 COPY BACK operation....................................................................................................... 31 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 31 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 31 BLOCK ERASE operation .................................................................................................. 33 9.4.1 9.5 RESET operation................................................................................................................ 34 9.5.1 9.6 BLOCK ERASE (60h-D0h).................................................................................................... 33 RESET (FFh) ........................................................................................................................ 34 FEATURE OPERATION..................................................................................................... 35 Release Date: February 1st, 2016 2 – Revision G W29N01GZ/W 9.7 9.8 9.9 9.6.1 GET FEATURES (EEh) ........................................................................................................ 38 9.6.2 SET FEATURES (EFh) ......................................................................................................... 39 ONE TIME PROGRAMMABLE (OTP) area ....................................................................... 40 9.7.1 OTP DATA PROGRAM (A0h-10h)........................................................................................ 40 9.7.2 OTP DATA PROTECT (A5h-10h) ......................................................................................... 42 9.7.3 OTP DATA READ (AFh-30h) ................................................................................................ 43 WRITE PROTECT .............................................................................................................. 44 BLOCK LOCK ..................................................................................................................... 46 10. ELECTRICAL CHARACTERISTICS............................................................................................... 47 10.1 Absolute Maximum Ratings ................................................................................................ 47 10.2 Operating Ranges .............................................................................................................. 47 10.3 Device power-up timing ...................................................................................................... 48 10.4 DC Electrical Characteristics .............................................................................................. 49 10.5 AC Measurement Conditions ............................................................................................. 50 10.6 AC timing characteristics for Command, Address and Data Input ..................................... 50 10.7 AC timing characteristics for Operation .............................................................................. 51 10.8 Program and Erase Characteristics ................................................................................... 52 11. TIMING DIAGRAMS ....................................................................................................................... 53 12. INVALID BLOCK MANAGEMENT .................................................................................................. 62 12.1 Invalid blocks ...................................................................................................................... 62 12.2 Initial invalid blocks ............................................................................................................. 62 12.3 Error in operation ................................................................................................................ 63 12.4 Addressing in program operation ....................................................................................... 63 13. PACKAGE DIMENSIONS ............................................................................................................... 64 13.1 VFBGA48Ball (8X6.5 MM2, Ball pitch:0.8mm, Ø=0.45mm) ............................................... 64 14. ORDERING INFORMATION .......................................................................................................... 65 15. VALID PART NUMBERS ................................................................................................................ 66 16. REVISION HISTORY ...................................................................................................................... 67 3 Release Date: February 1st, 2016 – Revision G W29N01GZ/W List of Tables Table 3-1 Pin Descriptions ............................................................................................................................ 9 Table 6-1 Addressing(X8) ........................................................................................................................... 12 Table 6-2 Addressing(X16) ......................................................................................................................... 13 Table 7-1 Mode Selection ........................................................................................................................... 14 Table 8-1 Command Table ......................................................................................................................... 15 Table 9-1 Device ID and configuration codes for Address 00h .................................................................. 22 Table 9-2 ONFI identifying codes for Address 20h ..................................................................................... 22 Table 9-3 Parameter Page Output Value .................................................................................................... 24 Table 9-4 Status Register Bit Definition ...................................................................................................... 26 Table 9-5 Features ...................................................................................................................................... 35 Table 9-6 Feature Address 01h .................................................................................................................. 35 Table 9-7 Feature Address 80h .................................................................................................................. 36 Table 9-8 Feature Address 81h .................................................................................................................. 37 Table 10-1 Absolute Maximum Ratings ...................................................................................................... 47 Table 10-2 Operating Ranges ..................................................................................................................... 47 Table 10-3 DC Electrical Characteristics .................................................................................................... 49 Table 10-4 AC Measurement Conditions .................................................................................................... 50 Table 10-5 AC timing characteristics for Command, Address and Data Input ........................................... 50 Table 10-6 AC timing characteristics for Operation .................................................................................... 51 Table 10-7 Program and Erase Characteristics .......................................................................................... 52 Table 12-1 Valid Block Number .................................................................................................................. 62 Table 12-2 Block failure .............................................................................................................................. 63 Table 15-1 Part Numbers for Industrial Temperature ................................................................................. 66 Table 16-1 History Table ............................................................................................................................. 67 4 Release Date: February 1st, 2016 – Revision G W29N01GZ/W List of Figures Figure 3-1 Pin Assignment 48-ball VFBGA (Package Code B) .................................................................... 8 Figure 5-1 NAND Flash Memory Block Diagram ........................................................................................ 11 Figure 6-1 Array Organization(X8) .............................................................................................................. 12 Figure 6-2 Array Organization(X16) ............................................................................................................ 13 Figure 9-1 Page Read Operations .............................................................................................................. 16 Figure 9-2 Sequential Cache Read Operations .......................................................................................... 18 Figure 9-3 Random Cache Read Operation ............................................................................................... 19 Figure 9-4 Last Address Cache Read Operation ........................................................................................ 20 Figure 9-5 Random Data Output ................................................................................................................. 21 Figure 9-6 Read ID ...................................................................................................................................... 22 Figure 9-7 Read Parameter Page ............................................................................................................... 23 Figure 9-8 Read Status Operation .............................................................................................................. 25 Figure 9-9 Read Unique ID ......................................................................................................................... 27 Figure 9-10 Page Program.......................................................................................................................... 28 Figure 9-11 Random Data Input ................................................................................................................. 29 Figure 9-12 Cache Program Start ............................................................................................................... 30 Figure 9-13 Cache Program End ................................................................................................................ 30 Figure 9-14 Copy Back Program Operation ................................................................................................ 32 Figure 9-15 Copy Back Operation with Random Data Input ....................................................................... 32 Figure 9-16 Block Erase Operation ............................................................................................................. 33 Figure 9-17 Reset Operation....................................................................................................................... 34 Figure 9-18 Get Feature Operation……………………………………………………………………………… 38 Figure 9-19 Set Feature Operation ............................................................................................................. 39 Figure 9-20 OTP Data Program .................................................................................................................. 41 Figure 9-21 OTP Data Protect .................................................................................................................... 42 Figure 9-22 OTP Data Read ....................................................................................................................... 43 Figure 9-23 Erase Enable……………………………………………………………………………………… ... .44 Figure 9-24 Erase Disable .......................................................................................................................... 44 Figure 9-25 Program Enable ....................................................................................................................... 44 Figure 9-26 Program Disable ...................................................................................................................... 45 Figure 9-27 Program for Copy Back Enable ............................................................................................... 45 Figure 9-28 Program for Copy Back Disable .............................................................................................. 45 Figure 10-1 RY/#BY Behavior During Power-On ........................................................................................ 48 Figure 11-1 Command Latch Cycle ............................................................................................................ 53 Figure 11-2 Address Latch Cycle ................................................................................................................ 53 Figure 11-3 Data Latch Cycle ..................................................................................................................... 54 Figure 11-4 Serial Access Cycle after Read ............................................................................................... 54 Figure 11-5 Serial Access Cycle after Read (EDO) .................................................................................... 54 Figure 11-6 Read Status Operation ............................................................................................................ 55 Figure 11-7 Page Read Operation .............................................................................................................. 55 Figure 11-8 #CE Don't Care Read Operation ............................................................................................. 56 Figure 11-9 Random Data Output Operation .............................................................................................. 56 Figure 11-10 Cache Read Operation (1/2) ................................................................................................. 57 5 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Figure 11-11 Cache Read Operation (2/2) ................................................................................................. 57 Figure 11-12 Read ID .................................................................................................................................. 58 Figure 11-13 Page Program........................................................................................................................ 58 Figure 11-14 #CE Don't Care Page Program Operation ............................................................................ 59 Figure 11-15 Page Program with Random Data Input ................................................................................ 59 Figure 11-16 Copy Back ............................................................................................................................. 60 Figure 11-17 Cache Program...................................................................................................................... 60 Figure 11-18 Block Erase............................................................................................................................ 61 Figure 11-19 Reset ..................................................................................................................................... 61 Figure 12-1 flow chart of create initial invalid block table ........................................................................... 62 Figure 12-2 Bad block Replacement ........................................................................................................... 63 Figure 13-1 Fine-Pitch Ball Grid Array 48-Ball (8x6.5mm) ......................................................................... 64 Figure 14-1 Ordering Part Number Description .......................................................................................... 65 6 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 1. GENERAL DESCRIPTION The W29N01GZ/W (1G-bit) NAND Flash memory provides a storage solution for embedded systems with limited space, pins and power. It is ideal for code shadowing to RAM, solid state applications and storing media data such as, voice, video, text and photos. The device operates on a single 1.7V to 1.95V power supply with active current consumption as low as 25mA and 10uA for CMOS standby current. The memory array totals 138,412,032 bytes, and organized into 1,024 erasable blocks of 135,168 bytes. Each block consists of 64 programmable pages of 2,112-bytes each. Each page consists of 2,048-bytes for the main data storage area and 64-bytes for the spare data area (The spare area is typically used for error management functions). The W29N01GZ/W supports the standard NAND flash memory interface using the multiplexed 8-bit bus to transfer data, addresses, and command instructions. The five control signals, CLE, ALE, #CE, #RE and #WE handle the bus interface protocol. Also, the device has two other signal pins, the #WP (Write Protect) and the RY/#BY (Ready/Busy) for monitoring the device status. 2. FEATURES  Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : X8 X16 – Operating temperature  Industrial: - 40°C to 85°C  Single-Level Cell (SLC) technology.  Organization – Density: 1G-bit/128M-byte – Page size  2,112 bytes (2048 + 64 bytes)  1,056 words(1024 +32 words) – Block size  64 pages (128K + 4K bytes)  64 pages(64K +2K words)  Highest Performance – Read performance (Max.)  Random read: 25us  Sequential read cycle: 35ns – Write Erase performance  Page program time: 300us(typ.)  Block erase time: 2ms(typ.) – Endurance 100,000 Erase/Program Cycles(1) – 10-years data retention  Command set – Standard NAND command set – Additional command support  Sequential Cache Read  Random Cache Read  Cache Program  Copy Back  OTP Data Program  OTP Data Lock by Page  OTP Data Read – Contact Winbond for block Lock feature  Lowest power consumption – Read: 10mA(typ.) – Program/Erase: 10mA(typ.) – CMOS standby: 10uA(typ.)  Space Efficient Packaging – 48-ball VFBGA – Contact Winbond for stacked packages/KGD Note: 1. Endurance specification is based on 1bit/528 byte ECC (Error Correcting Code). 7 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 3. PACKAGE TYPES AND PIN CONFIGURATIONS W29N01GZ/W is offered in a 48-ball VFBGA package (Code D) as shown in Figure 3-1 , respectively. Package diagrams and dimensions are illustrated in Section: Package Dimensions. 3.1 Pin assignment 48 ball VFBGA(X8/X16) Top View, ball down 1 2 3 4 5 6 A #WP ALE Vss #CE #WE RY/#BY B N.C #RE CLE N.C N.C N.C C N.C N.C N.C N.C N.C N.C D N.C N.C N.C N.C N.C N.C E DNU N.C DNU IO13 IO15 N.C F IO8 IO0 IO10 IO12 IO14 Vcc G IO9 IO1 IO11 Vcc IO5 IO7 H Vss IO2 IO3 IO4 IO6 Vss Note: For x8 product, IO8 to IO15 are N.C Figure 3-1 Pin Assignment 48-ball VFBGA (Package Code B) 8 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 3.2 Pin Descriptions PIN NAME I/O FUNCTION #WP I Write Protect ALE I Address Latch Enable #CE I Chip Enable #WE I Write Enable RY/#BY O Ready/Busy #RE I Read Enable CLE I Command Latch Enable I/O[0-7] I/O[0-15] I/O Data Input/Output (X8 X16) Vcc Supply Power supply Vss Supply Ground DNU - Do Not Use: This pins are unconnected pins. N.C - No Connect Table 3-1 Pin Descriptions Note: 1. Connect all Vcc and Vss pins to power supply or ground. Do not leave Vcc or Vss disconnected. 9 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 4. PIN DESCRIPTIONS 4.1 Chip Enable (#CE) #CE pin enables and disables device operation. When #CE is high the device is disabled and the I/O pins are set to high impedance and enters into standby mode if not busy. When #CE is set low the device will be enabled, power consumption will increase to active levels and the device is ready for Read and Write operations. 4.2 Write Enable (#WE) #WE pin enables the device to control write operations to input pins of the device. Such as, command instructions, addresses and data that are latched on the rising edge of #WE. 4.3 Read Enable (#RE) #RE pin controls serial data output from the pre-loaded Data Register. Valid data is present on the I/O bus after the tREA period from the falling edge of #RE. Column addresses are incremented for each #RE pulse. 4.4 Address Latch Enable (ALE) ALE pin controls address input to the address register of the device. When ALE is active high, addresses are latched via the I/O pins on the rising edge of #WE. 4.5 Command Latch Enable (CLE) CLE pin controls command input to the command register of the device. When CLE is active high, commands are latched into the command register via I/O pins on the rising edge of #WE. 4.6 Write Protect (#WP) #WP pin can be used to prevent the inadvertent program/erase to the device. When #WP pin is active low, all program/erase operations are disabled. 4.7 Ready/Busy (RY/#BY) RY/#BY pin indicates the device status. When RY/#BY output is low, it indicates that the device is processing either a program, erase or read operations. When it returns to high, those operations have completed. RY/#BY pin is an open drain. 4.8 Input and Output (I/Ox) I/Ox bi-directional pins are used for the following; command, address and data operations. 10 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 5. BLOCK DIAGRAM Status Register #CE ALE CLE #RE #WE #WP Command Resister Column Decoder Cache Register Data Register I/O Control I/Ox Address Register NAND Flash Array Logic Control High Voltage Generator Row Decoder RY/#BY Figure 5-1 NAND Flash Memory Block Diagram 11 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 6. MEMORY ARRAY ORGANIZATION 6.1 X8 Array Organization Total 1024 blocks IO0 ~ IO7 1 block 2048 Data register 64 2048 Cache register 64 1 page = 2048+64 bytes 1 block = 64 pages = (128K+4K) bytes 1 device =1024 blocks = (128M + 4M) bytes 2112 bytes Figure 6-1 Array Organization(X8) I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 1st cycle A7 A6 A5 A4 A3 A2 A1 A0 2nd cycle L L L L A11 A10 A9 A8 3rd cycle A19 A18 A17 A16 A15 A14 A13 A12 4th A27 A26 A25 A24 A23 A22 A21 A20 cycle Table 6-1 Addressing(X8) Notes: 1. “L” indicates a low condition, which must be held during the address cycle to insure correct processing. 2. A0 to A11 during the 1st and 2nd cycles are column addresses. A12 to A27 during the 3rd and 4th cycles are row addresses. 3. The device ignores any additional address inputs that exceed the device’s requirement. 12 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 6.2 X16 Array Organization Total 1024 blocks 1 block IO0 ~ IO15 1024 Data register 32 1024 Cache register 32 1 page = 1024+32 words 1 block = 64 pages = (64K+2K) words 1 device =1024 blocks = (64M + 2M) words 1056 words Figure 6-2 Array Organization(X16) I/O8~15 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 1st cycle L A7 A6 A5 A4 A3 A2 A1 A0 2nd cycle L L L L L L A10 A9 A8 3rd cycle L A18 A17 A16 A15 A14 A13 A12 A11 4th L A26 A25 A24 A23 A22 A21 A20 A19 cycle Table 6-2 Addressing(X16) NOTE: 1. “L” must to be held Low during the address cycle is inputted 2. A0 to A10 of 1st and 2nd cycle are column address, A11 to A26 of 3rd and 4th cycle are row address 3. The device ignores any additional address input than the device is required 13 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 7. MODE SELECTION TABLE MODE CLE ALE #CE #WE #RE #WP Read mode Command input H L L H X Address input L H L H X Write mode Command input H L L H H Address input L H L H H Data input L L L H H Sequential Read and Data output L L L H During read (busy) X X X X H X During program (busy) X X X X X H During erase (busy) X X X X X H Write protect X X X X X L Standby X X H X X 0V/Vcc X Table 7-1 Mode Selection Notes: 1. “H” indicates a HIGH input level, “L” indicates a LOW input level, and “X” indicates a Don’t Care Level. 2. #WP should be biased to CMOS HIGH or LOW for standby. 14 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 8. COMMAND TABLE 1st CYCLE 2nd CYCLE PAGE READ 00h 30h READ for COPY BACK 00h 35h SEQUENTIAL CACHE READ 31h RANDOM CACHE READ 00h LAST ADDRESS CACHE READ 3Fh READ ID 90h READ STATUS 70h Yes RESET FFh Yes PAGE PROGRAM 80h 10h PROGRAM for COPY BACK 85h 10h CACHE PROGRAM 80h 15h BLOCK ERASE 60h D0h COMMAND RANDOM DATA INPUT(1) Acceptable during busy 31h 85h RANDOM DATA OUTPUT(1) 05h READ PARAMETER PAGE ECh READ UNIQUE ID EDh GET FEATURES EEh SET FEATURES EFh OTP DATA PROTECT A5h 10h OTP DATA PROGRAM A0h 10h OTP DATA READ AFh 30h E0h Table 8-1 Command Table Notes: 4. RANDOM DATA INPUT and RANDOM DATA OUTPUT command is only to be used within a page. 5. Any commands that are not in the above table are considered as undefined and are prohibited as inputs. 15 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9. DEVICE OPERATIONS 9.1 READ operation 9.1.1 PAGE READ (00h-30h) When the device powers on, the default is READ mode. This operation can also be entered by writing 00h command to the command register, and then write four address cycles, followed by writing 30h command. After writing 30h command, the data is transferred from NAND array to Data Register during tR. Data transfer progress can be done by monitoring the status of the RY/#BY signal output. RY/#BY signal will be LOW during data transfer. Also, there is an alternate method by using the READ STATUS (70h) command. If the READ STATUS command is issued during read operation, the Read (00h) command must be re-issued to read out the data from Data Register. When the data transfer is complete, RY/#BY signal goes HIGH, and the data can be read from Data Register by toggling #RE. Read is sequential from initial column address to the end of the page. (See Figure 9-1) Figure 9-1 Page Read Operations 16 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.2 CACHE READ OPERATIONS To obtain a higher degree of performance read operations, the device’s Cache and Data Register can be used independent of each other. Data can be read out from the Cache Register, while array data is transferred from the NAND Array to the Data Register. The CACHE READ mode starts with issuing a PAGE READ command (00h-30h) to transfer a page of data from NAND array to the Cache Register. RY/#BY signal will go LOW during data transfer indicating a busy status. Copying the next page of data from the NAND array to the Data Register while making the Cache Register page data available is done by issuing either a SEQUENTIAL CACHE READ (31h) or RANDOM CACHE READ (00h-31h) command. The SEQUENTIAL CACHE READ mode will copy the next page of data in sequence from the NAND array to the Data Register or use the RANDOM CACHE READ mode (00h-31h) to copy a random page of data from NAND array to the Data Register. The RY/#BY signal goes LOW for a period of tRCBSY during the page data transfer from NAND array to the Data Register. When RY/#BY goes HIGH, this means that the Cache Register data is available and can be read out of the Cache Register by toggling #RE, which starts at address column 0. If it is desired to start at a different column address, a RANDOM DATA OUTPUT (05h-E0h) command can be used to change the column address to read out the data. At this point in the procedure when completing the read of the desired number of bytes, one of two things can be chosen. Continue CACHE READ (31h or 00h-31h) operations or end the CACHE READ mode with a LAST ADDRESS CACHE READ (3Fh) command. To continue with the read operations, execute the CACHE READ (31h or 00h-31h) command. The RY/#BY signal goes LOW for the period of tRCBSY while data is copied from Data Register to the Cache Register and the next page of data starts being copied from the NAND array to the Data Register. When RY/#BY signal goes HIGH signifying that the Cache Register data is available, at this time #RE can start toggling to output the desired data starting at column 0 address or using the RANDOM DATA OUPUT command for random column address access. To terminate the CACHE READ operations a LAST ADDRESS CACHE READ (3Fh) command is issued, RY/#BY signal goes LOW and the Data Register contents is copied to the Cache Register. At the completion of the Data Register to Cache Register transfer, RY/#BY goes HIGH indicating data is available at the output of the Cache Register. At this point Data can be read by toggling #RE starting at column address 0 or using the RANDOM DATA OUPUT command for random column address access. The device NAND array is ready for next command set. 17 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.2.1. SEQUENTIAL CACHE READ (31h) The SEQUENTIAL CACHE READ (31h) copies the next page of data in sequence within block to the Data Register while the previous page of data in the Cache Register is available for output. This is done by issuing the command (31h), RY/#BY signal goes LOW and the STATUS REGISTER bits 6 and 5 = “00” for the period of tRCBSY. When RY/#BY signal goes HIGH and STATUS REGISTER bits 6 and 5 = “10”, data at the Cache Register is available. The data can be read out from the Cache Register by toggling #RE, starting address is column 0 or by using the RANDOM DATA OUPUT command for random column address access. Figure 9-2 Sequential Cache Read Operations 18 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.2.2. RANDOM CACHE READ (00h-31h) The RANDOM CACHE READ (00h-31h) will copy a particular page from NAND array to the Data Register while the previous page of data is available at the Cache Register output. Perform this function by first issuing the 00h command to the Command Register, then writing the four address cycles for the desired page of data to the Address Register. Then write the 31h command to the Command Register. Note; the column address bits are ignored. After the RANDOM CACHE READ command is issued, RY/#BY signal goes LOW and STATUS REGISTER bits 6 and 5 equal “00” for the period of tRCBSY. When RY/#BY signal goes HIGH and STATUS REGISTER bits 6 and 5 equal “10”, the page data in the Cache Register is available. The data can read out from the Cache Register by toggling #RE, the starting column address will be 0 or use the RANDOM DATA OUTPUT (05h-E0h) command change the column address to start reading out the data. Figure 9-3 Random Cache Read Operation 19 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.2.3. LAST ADDRESS CACHE READ (3Fh) The LAST ADDRESS CACHE READ (3Fh) copies a page of data from the Data Register to the Cache Register without starting the another cache read. After writing the 3Fh command, RY/#BY signal goes LOW and STATUS REGISTER bits 6 and 5 equals “00” for the period of tRCBSY. When RY/#BY signal goes HIGH and STATUS REGISTER bits 6 and 5 equals “11”, the Cache Register data is available, and the device NAND array is in ready state. The data can read out from the Cache Register by toggling #RE, starting at address column 0 or RANDOM DATA OUTPUT (05h-E0h) command to change the column address to read out the data. Figure 9-4 Last Address Cache Read Operation 20 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.3 RANDOM DATA OUTPUT (05h-E0h) The RANDOM DATA OUTPUT allows the selection of random column addresses to read out data from a single or multiple of addresses. The use of the RANDOM DATA OUTPUT command is available after the PAGE READ (00h-30h) sequence by writing the 05h command following by the 2 cycle column address and then the E0h command. Toggling #RE will output data sequentially. The RANDOM DATA OUTPUT command can be issued multiple times, but limited to the current loaded page. Figure 9-5 Random Data Output 21 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.4 READ ID (90h) READ ID command is comprised of two modes determined by the input address, device (00h) or ONFI (20h) identification information. To enter the READ ID mode, write 90h to the Command Register followed by a 00h address cycle, then toggle #RE for 5 single byte cycles, the W29N01GZ/W pre-programmed code includes the Manufacturer ID, Device ID, and Product-Specific Information (see Table 9.1). If the READ ID command is followed by 20h address, the output code includes 4 single byte cycles of ONFI identifying information (see Table 9.2). The device remains in the READ ID mode until the next valid command is issued. Figure 9-6 Read ID # of Byte/Cycles 1st Byte/Cycle 2nd Byte/Cycle 3rd Byte/Cycle 4th Byte/Cycle 5th Byte/Cycle X8 EFh A1h 80h 15h. 00h. X16 EFh B1h 80h 55h 00h Device ID Cache Programming Supported Page Size:2KB Spare Area Size:64b BLK Size w/o Spare:128KB Organized:X8 X16 Serial Access:35ns Description MFR ID Table 9-1 Device ID and configuration codes for Address 00h # of Byte/Cycles 1st Byte/Cycle 2nd Byte/Cycle 3rd Byte/Cycle 4th Byte/Cycle Code 4Fh 4Eh 46h 49h Table 9-2 ONFI identifying codes for Address 20h 22 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.5 READ PARAMETER PAGE (ECh) READ PARAMETER PAGE can read out the device’s parameter data structure, such as, manufacturer information, device organization, timing parameters, key features, and other pertinent device parameters. The data structure is stored with at least three copies in the device’s parameter page. Figure 9-7 shows the READ PARAMETER PAGE timing. The RANDOM DATA OUTPUT (05h-E0h) command is supported during data output. Figure 9-7 Read Parameter Page Byte Description Value 0-3 Parameter page signature 4Fh, 4Eh, 46h, 49h 4-5 Revision number 02h, 00h 6-7 Features supported 8-9 Optional commands supported 37h, 00h 10-31 Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h 32-43 Device manufacturer 57h, 49h, 4Eh, 42h, 4Fh, 4Eh, 44h, 20h, 20h, 20h, 20h, 20h 44-63 64 W29N01GZ (x8) 10h, 00h W29N01GW (x16) 11h, 00h W29N01GZ (x8) 57h, 32h, 39h, 4Eh, 30h, 31h, 47h, 5Ah, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h W29N01GW( X16) 57h, 32h, 39h, 4Eh, 30h, 31h, 47h, 57h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h, 20h Device model Manufacturer ID EFh 65-66 Date code 00h, 00h 67-79 Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h 80-83 # of data bytes per page 00h, 08h, 00h, 00h 84-85 # of spare bytes per page 40h, 00h 86-89 # of data bytes per partial page 00h, 02h, 00h, 00h 90-91 # of spare bytes per partial page 10h, 00h 23 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Byte Description Value 92-95 # of pages per block 40h, 00h, 00h, 00h 96-99 # of blocks per unit 00h, 04h, 00h, 00h 100 # of logical units 01h 101 # of address cycles 22h 102 # of bits per cell 01h 103-104 Bad blocks maximum per unit 14h, 00h 105-106 Block endurance 01h, 05h Guaranteed valid blocks at beginning of target 01h Block endurance for guaranteed valid blocks 00h, 00h 110 # of programs per page 04h 111 Partial programming attributes 00h 112 # of ECC bits 01h 113 # of interleaved address bits 00h 114 Interleaved operation attributes 00h Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h I/O pin capacitance 0Ah 129-130 Timing mode support 07h, 00h 131-132 Program cache timing 07h, 00h 133-134 Maximum page program time BCh, 02h 135-136 Maximum block erase time 10h, 27h 137-138 Maximum random read time 19h, 00h 139-140 tCCS minimum 46h, 00h 141-163 Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h 164-165 Vendor specific revision # 01h,00h 166-253 Vendor specific 00h 254-255 Integrity CRC Set at shipment 256-511 Value of bytes 0-255 512-767 Value of bytes 0-255 107 108-109 115-127 128 >767 Additional redundant parameter pages Table 9-3 Parameter Page Output Value 24 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.6 READ STATUS (70h) The W29N01GZ/W has an 8-bit Status Register which can be read during device operation. Refer to Table 9.3 for specific Status Register definitions. After writing 70h command to the Command Register, read cycles will only read from the Status Register. The status can be read from I/O[7:0] outputs, as long as #CE and #RE are LOW. Note; #RE does not need to be toggled for Status Register read. The Command Register remains in status read mode until another command is issued. To change to normal read mode, issue the PAGE READ (00h) command. After the PAGE READ command is issued, data output starts from the initial column address. Figure 9-8 Read Status Operation 25 Release Date: February 1st, 2016 – Revision G W29N01GZ/W SR bit I/O 0 Page Read Cache Read Page Program Cache Program Block Erase Definition 0=Successful Program/Erase Not Use Not Use Pass/Fail Pass/Fail(N) Pass/Fail 1=Error in Program/Erase I/O 1 Not Use Not Use Not Use Pass/Fail(N-1) Not Use 0=Successful Program 1=Error in Program I/O 2 Not Use Not Use Not Use Not Use Not Use 0 I/O 3 Not Use Not Use Not Use Not Use Not Use 0 I/O 4 Not Use Not Use Not Use Not Use Not Use 0 I/O 5 Ready/Busy Ready/Busy1 Ready/Busy Ready/Busy Ready/Busy I/O 6 Ready/Busy Cache Ready/Busy2 Ready/Busy Cache Ready/Busy Ready/Busy I/O 7 Write Protect Write Protect Write Protect Write Protect Write Protect Ready = 1 Busy = 0 Ready = 1 Busy = 0 Unprotected = 1 Protected = 0 Table 9-4 Status Register Bit Definition Notes: 1. SR bit 5 is 0 during the actual programming operation. If cache mode is used, this bit will be 1 when all internal operations are complete. 2. SR bit 6 is 1 when the Cache Register is ready to accept new data. RY/#BY follows bit 6. 26 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.1.7 READ UNIQUE ID (EDh) The W29N01GZ/W NAND Flash device has a method to uniquely identify each NAND Flash device by using the READ UNIQUE ID command. The format of the ID is limitless, but the ID for every NAND Flash device manufactured, will be guaranteed to be unique. Numerous NAND controllers typically use proprietary error correction code (ECC) schemes. In these cases Winbond cannot protect unique ID data with factory programmed ECC. However, to ensure data reliability, Winbond will program the NAND Flash devices with 16 bytes of unique ID code, starting at byte 0 on the page, immediately followed by 16 bytes of the complement of that unique ID. The combination of these two actions is then repeated 16 times. This means the final copy of the unique ID will resides at location byte 511. At this point an XOR or exclusive operation can be performed on the first copy of the unique ID and its complement. If the unique ID is good, the results should yield all the bits as 1s. In the event that any of the bits are 0 after the XOR operation, the procedure can be repeated on a subsequent copy of the unique ID data. Figure 9-9 Read Unique ID 27 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.2 PROGRAM operation 9.2.1 PAGE PROGRAM (80h-10h) The W29N01GZ/W Page Program command will program pages sequentially within a block, from the lower order page address to higher order page address. Programming pages out of sequence is prohibited. The W29N01GX supports partial-page programming operations up to 4 times before an erase is required if partitioning a page. Note; programming a single bit more than once without first erasing it is not supported. 9.2.2 SERIAL DATA INPUT (80h) Page Program operation starts with the execution of the Serial Data Input command (80h) to the Command Register, following next by inputting four address cycles and then the data is loaded. Serial data is loaded to Cache Register with each #WE cycle. The Program command (10h) is written to the Command Register after the serial data input is finished. At this time the internal write state controller automatically executes the algorithms for program and verifies operations. Once the programming starts, determining the completion of the program process can be done by monitoring the RY/#BY output or the Status Register Bit 6, which will follow the RY/#BY signal. RY/#BY will stay LOW during the internal array programming operation during the period of (tPROG). During page program operation, only two commands are available, READ STATUS (70h) and RESET (FFh). When the device status goes to the ready state, Status Register Bit 0 (I/O0) indicates whether the program operation passed (Bit0=0) or failed (Bit0=1), (see Figure 9-10). The Command Register remains in read status mode until the next command is issued. Figure 9-10 Page Program 28 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.2.3 RANDOM DATA INPUT (85h) After the Page Program (80h) execution of the initial data has been loaded into the Cache Register, if the need for additional writing of data is required, using the RANDOM DATA INPUT (85h) command can perform this function to a new column address prior to the Program (10h) command. The RANDOM Data INPUT command can be issued multiple times in the same page (See Figure 9-11). Figure 9-11 Random Data Input 9.2.4 CACHE PROGRAM (80h-15h) CACHE PROGEAM (80h) command is started by writing the command to the Command Register. The next writes should be four cycles of address, and then either writing a full or partial page of input data into the Cache Register. Issuing the CACHE PROGRAM (15h) command to the Command Register, starting transferring data from the Cache Register to the Data Register on the rising edge of #WE and RY/#BY will go LOW. Programming to the array starts after the data has been copied into the Data Register and RY/#BY returns to HIGH. When RY/#BY returns to HIGH, the next input data can be written to the Cache Register by issuing another CACHE PROGRAM command series. The time RY/#BY goes LOW, is typical controlled by the actual programming time. The time for the first programming pass equals the time it takes to transfer the data from the Cache Register to the Data Register. On the second and subsequent programming passes, data transfer from the Cache Register to the Data Register is held until Data Register content is programming into the NAND array. The CACHE PROGRAM command can cross block address boundaries. RANDOM DATA INPUT (85h) commands are permitted with CACHE PROGRAM operations. Status Register’s Cache RY/#BY Bit 6 (I/O6) can be read after issuing the READ STATUS (70h) command for confirming when the Cache Register is ready or busy. RY/#BY, always follows Status Register Bit 6 (I/O6). Status Register’s RY/#BY Bit 5 (I/O5) can be polled to determine whether the array programming is in progress or completed for the current programming cycle. If only RY/#BY is used for detecting programming status, the last page of the program sequence must use the PAGE PROGRAM (10h) command instead of the CACHE PROGRAM (15h) command. If the 29 Release Date: February 1st, 2016 – Revision G W29N01GZ/W CACHE PROGRAM (15h) command is used every time, including the last page programming, Status Register’s Bit 5 (I/O5) must be used to determine when programming is complete. Status Register’s Pass/Fail, Bit 0 (I/O0) returns the pass/fail status for the previous page when Status Register’s Bit 6 (I/O6) equals a “1” (ready state). The pass/fail status of the current PROGRAM operation is returned with Status Register’s Bit 0 (I/O0) when Bit 5 (I/O5) of the Status Register equals a “1” (ready state) as shown in Figure 9-12 and 9-13. Note: The CACHE PROGRAM command cannot be used on blocks 0-3 if used as boot blocks. Figure 9-12 Cache Program Start Figure 9-13 Cache Program End 30 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.3 COPY BACK operation Copy Back operations require two command sets. Issue a READ for COPY BACK (00h-35h) command first, then the PROGRAM for COPY BACK (85h-10h) command. 9.3.1 READ for COPY BACK (00h-35h) The READ for COPY BACK command is used together with the PROGRAM for COPY BACK (85h-10h) command. To start execution, READ for COPY BACK (00h) command is written to the Command Register, followed by the four cycles of the source page address. To start the transfer of the selected page data from the memory array to the Cache Register, write the 35h command to the Command Register. After execution of the READ for COPY BACK command sequence and RY/#BY returns to HIGH marking the completion of the operation, the transferred data from the source page into the Cache Register may be read out by toggling #RE. Data is output sequentially from the column address that was originally specified with the READ for COPY BACK command. RANDOM DATA OUTPUT (05h-E0h) commands can be issued multiple times without any limitation after READ for COPY BACK command has been executed (see Figures 9-14 and 9-15). At this point the device is in ready state to accept the PROGRAM for COPY BACK command. 9.3.2 PROGRAM for COPY BACK (85h-10h) After the READ for COPY BACK command operation has been completed and RY/#BY goes HIGH, the PROGRAM for COPY BACK command can be written to the Command Register. The command results in the transfer of data from the Cache Register to the Data Register, then internal operations start programming of the new destination page. The sequence would be, write 85h to the Command Register, followed by the four cycle destination page address to the NAND array. Next write the 10h command to the Command Register; this will signal the internal controller to automatically start to program the data to new destination page. During this programming time, RY/#BY will go LOW. The READ STATUS command can be used instead of the RY/#BY signal to determine when the program is complete. When Status Register Bit 6 (I/O6) equals to “1”, Status Register Bit 0 (I/O0) will indicate if the operation was successful or not. The RANDOM DATA INPUT (85h) command can be used during the PROGRAM for COPY BACK command for modifying the original data. Once the data is copied into the Cache Register using the READ for COPY BACK (00h-35h) command, follow by writing the RANDOM DATA INPUT (85h) command, along with the address of the data to be changed. The data to be changed is placed on the external data pins. This operation copies the data into the Cache Register. Once the 10h command is written to the Command Register, the original data and the modified data are transferred to the Data Register, and programming of the new page commences. The RANDOM DATA INPUT command can be issued numerous times without limitation, as necessary before starting the programming sequence with 10h command. Since COPY BACK operations do not use external memory and the data of source page might include a bit errors, a competent ECC scheme should be developed to check the data before programming data to a new destination page. 31 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Figure 9-14 Copy Back Program Operation Figure 9-15 Copy Back Operation with Random Data Input 32 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.4 BLOCK ERASE operation 9.4.1 BLOCK ERASE (60h-D0h) Erase operations happen at the architectural block unit. This W29N01GZ/W has 1024 erase blocks. Each block is organized into 64 pages (2112 bytes/page,1056words/page), 132K bytes (128K + 4K bytes)/block,66Kwords(64K+2K words)/block The BLOCK ERASE command operates on a block by block basis. Erase Setup command (60h) is written to the Command Register. Next, the two cycle block address is written to the device. The page address bits are loaded during address block address cycle, but are ignored. The Erase Confirm command (D0h) is written to the Command Register at the rising edge of #WE, RY/#BY goes LOW and the internal controller automatically handles the block erase sequence of operation. RY/#BY goes LOW during Block Erase internal operations for a period of tBERS, The READ STATUS (70h) command can be used for confirm block erase status. When Status Register Bit6 (I/O6) becomes to “1”, block erase operation is finished. Status Register Bit0 (I/O0) will indicate a pass/fail condition (see Figure 9-16). Figure 9-16 Block Erase Operation 33 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.5 RESET operation 9.5.1 RESET (FFh) READ, PROGRAM, and ERASE commands can be aborted by the RESET (FFh) command during the time the W29N01GZ/W is in the busy state. The Reset operation puts the device into a known status. The data that is processed in either the programming or erasing operations are no longer valid. This means the data can be partially programmed or erased and therefore data is invalid. The Command Register is cleared and is ready to accept next command. The Data Register and Cache Register contents are marked invalid. The Status Register indicates a value of E0h when #WP is HIGH; otherwise a value of 60h when #WP is LOW. After RESET command is written to the command register, RY/#BY goes LOW for a period of tRST (see Figure 9-17). Figure 9-17 Reset Operation 34 Release Date: February 1st, 2016 – Revision G W29N01GZ/W FEATURE OPERATION 9.6 The GET FEATURES (EEh) and SET FEATURES (EFh) commands are used to change the NAND Flash device behavior from the default power on settings. These commands use a one-byte feature address to determine which feature is to be read or modified. A range of 0 to 255 defines all features; each is described in the features table (see Table 9.4 thru 9.7). The GET FEATURES (EEh) command reads 4Byte parameter in the features table (See GET FEATURES function). The SET FEATURES (EFh) command places the 4-Byte parameter in the features table (See SET FEATURES function).When a feature set is volatile, meaning it remains active by default until the device is powered off. The set feature remains the set even if a RESET (FFh) command is issued. Feature address Description 00h N.A 01h Timing mode 02h-7Fh Reserved 80h Vendor specific parameter : Programmable I/O drive strength 81h Vendor specific parameter : Programmable RY/#BY pull-down strength 82h-FFh Reserved Table 9-5 Features Feature Address 01h: Timing Mode Sub feature Options I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 Value Notes parameter P1 Timing mode Mode 0 (default) Reserved (0) 0 0 0 00h 1 Mode 1 Reserved (0) 0 0 1 01h 1 Mode 2 Reserved (0) 0 1 0 02h 1 Mode 3 Reserved (0) 0 1 1 03h 2 Mode 4 Reserved (0) 1 0 0 04h 2 Mode 5 Reserved (0) 1 0 1 05h 2 P2 Reserved (0) 00h Reserved (0) 00h Reserved (0) 00h P3 P4 Table 9-6 Feature Address 01h Notes: 1. 2. Timing mode is set to mode 0 by default. The timing mode should be selected to indicate the maximum speed at which the device will receive addresses, commands, and data cycles. The five supported settings for the timing mode are shown. The device returns to mode 0 when a power cycle has occurred. Supported timing modes are reported in the parameter page. Not supported. 35 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Feature Address 80h: Programmable I/O Drive Strength Sub feature Options I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 Value Notes 1 parameter P1 I/O Full (default) Reserved (0) 0 0 00h drive strength Three-quarters Reserved (0) 0 1 01h One-half Reserved (0) 1 0 02h One-quarter Reserved (0) 1 1 03h P2 Reserved (0) 00h Reserved (0) 00h Reserved (0) 00h P3 P4 Table 9-7 Feature Address 80h Note: 1. The default drive strength setting is Full strength. The Programmable I/O Drive Strength mode is used to change from the default I/O drive strength. Drive strength should be selected based on expected loading of the memory bus. This table shows the four supported output drive-strength settings. The device returns to the default drive strength mode when a power cycle has occurred. AC timing parameters may need to be relaxed if I/O drive strength is not set to full. 36 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Feature Address 81h: Programmable RY/#BY Pull-down Strength Sub feature Options I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 Value Notes 1 parameter P1 RY/#BY Full (default) Reserved (0) 0 0 00h pull-down Three-quarters Reserved (0) 0 1 01h One-half Reserved (0) 1 0 02h One-quarter Reserved (0) 1 1 03h strength P2 Reserved (0) 00h Reserved (0) 00h Reserved (0) 00h P3 P4 Table 9-8 Feature Address 81h Note: 1. The default programmable RY/#BY pull-down strength is set to Full strength. The pull-down strength is used to change the RY/#BY pull-down strength. RY/#BY pull-down strength should be selected based on expected loading of RY/#BY. The four supported pull-down strength settings are shown. The device returns to the default pull-down strength when a power cycle has occurred. 37 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.6.1 GET FEATURES (EEh) The GET FEATURES command returns the device feature settings including those previously set by the SET FEATURES command. To use the Get Feature mode write the command (EEh) to the Command Register followed by the single cycle byte Feature Address. RY/#BY will goes LOW for the period of tFEAT. If Read Status (70h) command is issued for monitoring the process completion status, Read Command (00h) has to be executed to re-establish data output mode. Once, RY/#BY goes HIGH, the device feature settings can be read by toggling #RE. The device remains in Feature Mode until another valid command is issued to Command Register. See Figure 9-18. Figure 9-18 Get Feature Operation 38 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.6.2 SET FEATURES (EFh) The SET FEATURES command sets the behavior parameters by selecting a specified feature address. To change device behavioral parameters, execute Set Feature command by writing EFh to the Command Register, followed by the single cycle feature address. Each feature parameter (P0-P3) is latched at the rising edge of each #WE. The RY/#BY signal will go LOW during the period of tFEAT while the four feature parameters are stored. The Read Status (70h) command can be issued for monitoring the progress status of this operation. The parameters are stored in device until the device goes through a power on cycle. The device remains in feature mode until another valid command is issued to Command Register. Figure 9-19 Set Feature Operation 39 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.7 ONE TIME PROGRAMMABLE (OTP) area The device has One-Time Programmable (OTP) memory area comprised of ten pages (2112 bytes/page). This entire range of pages is functionally guaranteed. Only the OTP commands can access the OTP area. When the device ships from Winbond, the OTP area is in an erase state (all bits equal “1”). In the OTP area, programming or partial-page programming is done only by programming “0” bits. The OTP area cannot be erased, therefore protecting the area only prevent further programming. OTP area programming and protection have two separate commands. The OTP DATA PROGRAM (A0h10h) command is used to program an OTP page. Programming an entire page as one operation or up to four partial-page programming sequences is available. Programming other OTP pages can be done in the same way. The OTP DATA PROTECT (A5h-10h) command will permanently protected the OTP area from further programming operations. The OTP DATA READ command (AFh-30h) can read the OTP area with or without protection set. Note; there is no erase command for OTP area. 9.7.1 OTP DATA PROGRAM (A0h-10h) Programming the OTP area can be done using the OTP DATA PROGRAM (A0h-10h) command. An entire page can be programmed at once or up to four partial page programming sequences per page. This command enables programming into the offset of an OTP page by using the two bytes of Column Address [11:0]. If OTP area is protected by OTP DATA PROTECT command, the programming the OTP area will not be executed, and RY/#BY goes LOW for a period of tOBSY. To use this command sequence, the A0h command is written to Command Register. Then issue the four address cycles that are column address of first two cycles and range page address[0B:02] of the two remaining cycles. Then write 1 to 2112 bytes of data, followed by program confirmation command (10h) is written to Command Register. At this point the internal controller automatically executes the algorithms for program and verify. The RY/#BY will go LOW during the program execution for the period of (tPROG). Program verification only detects 1’s that are not successfully programmed to 0’s. If OTP area is not protected, RANDOM DATA INPUT commands can be used during OTP program operations. READ STATUS (70h) command is valid during the OTP program operation. For this operation, Status Register Bit5 and Bit6 (I/O5 and I/O6, respectively) will follow same state as RY/#BY. If the OTP area is protected, Status Register Bit7 (I/O7) will equal “0”; otherwise it is a “1”. After the device is in the ready state, Status Register Bit0 (I/O0) indicates whether the operation passed or failed. 40 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Figure 9-20 OTP Data Program 41 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.7.2 OTP DATA PROTECT (A5h-10h) To protect the data in OTP area used the OTP DATA PROTECT (A5h-10h) command. After the OTP area is protected, the OTP area cannot be unprotected and no additional data can be programmed to the OTP area. To use this command, A5h is written to the Command Register. Then issues the four address cycles with the following address code: 00h-00h-01h-00h. Finalized by writing the protect confirmation command (10h) to the Command Register. The RY/#BY signal will go LOW during this protection process, a period similar with page program time (tPROG). READ STATUS (70h) command is valid during the OTP protect operation. For this operation, Status Register Bit5 and Bit6 (I/O5 and I/O6, respectively) will indicate same state as the RY/#BY. After the device go to the ready state, Status Register Bit0 (I/O0) indicates whether the operation passed or failed. Figure 9-21 OTP Data Protect 42 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.7.3 OTP DATA READ (AFh-30h) This command can read the data from OTP pages. The read capability from OTP area is available with or without OTP area protection. To use this command sequence, AFh command is written to Command Register. Then issue four address cycles comprised of the column address (first two cycles) and the range page address [0B:02] for the remaining two cycles. Once the address is written, perform the read confirmation command (30h) to the Command Register. The RY/#BY signal will go LOW while the OTP data is transferred from OTP area to Data Register during the period of (tR). The RANDOM DATA OUTPUT command can use during OTP data read operations. Read timing of OTP data read is the same as the typical PAGE READ timing. READ STATUS and RESET command are valid during OTP data read operation. For this operation, Status Register Bit5 and Bit6 (I/O5 and I/O6, respectively) indicate the same as the RY/#BY signal. Additional OTP pages can be read by repeating OTP DATA READ command. If OTP DATA READ command is followed by CACHE READ operation, the RESET command has to be executed prior to issuing the CACHE READ commands. RESET time can be up to 5µs. Figure 9-22 OTP Data Read 43 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.8 WRITE PROTECT #WP pin can enable or disable program and erase commands preventing or allowing program and erase operations. Figure 9-23 to 9-28 shows the enabling or disabling timing with #WP setup time (tWW) that is from rising or falling edge of #WP to latch the first commands. After first command is latched, #WP pin must not toggle until the command operation is complete and the device is in the ready state. (Status Register Bit5 (I/O5) equal 1. Figure 9-23 Erase Enable Figure 9-24 Erase Disable Figure 9-25 Program Enable 44 Release Date: February 1st, 2016 – Revision G W29N01GZ/W Figure 9-26 Program Disable Figure 9-27 Program for Copy Back Enable Figure 9-28 Program for Copy Back Disable 45 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 9.9 BLOCK LOCK The device has block lock feature that can protect the entire device or user can indicate a ranges of blocks from program and erase operations. Using this feature offers increased functionality and flexibility data protection to prevent unexpected program and erase operations. Contact to Winbond for using this feature. 46 Release Date: February 1st, 2016 – Revision G W29N01GZ/W 10. ELECTRICAL CHARACTERISTICS 10.1 Absolute Maximum Ratings PARAMETERS SYMBOL Supply Voltage CONDITIONS VCC Voltage Applied to Any Pin VIN Storage Temperature Relative to Ground TSTG RANGE UNIT –0.6 to +2.4 V –0.6 to +2.4 V –65 to +150 °C 5 mA Short circuit output current, I/Os Table 10-1 Absolute Maximum Ratings Notes: 1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods
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