CV111-3A_07

CV111-3A UMTS-band High Linearity Downconverter Product Features • High dynamic range downconverter with integrated LO, IF, & RF amps Product Description The CV111-3A is a high linearity downconverter designed to meet the demanding issues for performance, functionality, and cost goals of current and next generation mobile infrastructure basestations. It provides high dynamic range performance in a low profile surface-mount leadless package that measures 6 x 6 mm square. Functionality includes RF amplification, frequency conversion and IF amplification, while an integrated LO driver amplifier powers the passive mixer. The MCM is implemented with reliable and mature GaAs MESFET and InGaP HBT technology. Typical applications include frequency down conversion, modulation and demodulation for receivers used in CDMA, CDMA2000, W-CDMA / IMT2000, GPRS, and EDGE 2.5G mobile infrastructure technologies for UMTS frequency bands. Functional Diagram RF IN GND GND MIXIF GND 28 RF OUT 1 GND 2 GND 3 GND 4 GND 5 GND 6 MIXRF 7 8 G ND 9 GND 10 GND 11 MIXLO 27 26 25 24 23 22 21 IF OUT GND 19 GND 18 GND 17 BIAS 16 GND 15 LO IN 13 LO OUT 14 GND IF IN • • • • • • • • • RF: 1900 – 2200 MHz IF: 65 – 300 MHz +38 dBm Output IP3 +21 dBm Output P1dB 5.3 dB Noise Figure +5V Single supply operation Pb-free 6mm 28-pin QFN package Low-side LO configuration Common footprint with other PCS/ cellular versions IF RF Amp IF Amp 20 GND LO Driver Amp RF LO 12 GND Top View Specifications (1) Parameters RF Frequency Range LO Frequency Range IF Center Frequency Range % Bandwidth around IF center frequency IF Test Frequency SSB Conversion Gain Gain Drift over Temp (-40 to 85 °C) Output IP3 Output IP2 Output 1dB Compression Point Noise Figure LO Input Drive Level LO-RF Isolation LO-IF Isolation Return Loss: RF Port Return Loss: LO Port Return Loss: IF Port Operating Supply Voltage Supply Current FIT Rating Thermal Resistance Junction Temperature Units MHz MHz MHz % MHz dB dB dBm dBm dBm dB dBm dB dB dB dB dB V mA failures /1E9 hrs °C / W °C Min Typ 1900 – 2200 1600 – 2135 65 – 300 ±7.5 240 20 ±0.5 +38 +48 +21 5.3 0 40 25 14 14 14 +5 360 Max Comments See note 2 See note 3 Temp = 25 °C Referenced to +25 °C See note 4 See note 4 See note 5 -2.5 +2.5 See note 6 PLO = 0 dBm +4.9 290 +5.1 480 72.1 27 160 @ 70o C ambient, 90% confidence See note 7 1. Specifications when using the application specific circuit (shown on page 3) with a low side LO = 0 dBm in a downconverting application over the operating case temperature range. 2. IF matching components affect the center IF frequency. Proper component values for other IF center frequencies than shown can be provided by emailing to applications.engineering@wj.com. 3. The IF bandwidth of the converter is defined as 15% around any center frequency in its operating IF frequency range. The bandwidth is determined with external components. Specifications are valid around the total ±7.5% bandwidth. ie. with a center frequency of 80 MHz, the specifications are valid from 80 ± 6 MHz. 4. Assumes the supply voltage = +5 V. OIP3 is measured with ∆f = 1 MHz with IFout = 5 dBm / tone. 5. Assumes LO injection noise is filtered at the thermal noise floor, -174 dBm/Hz, at the RF, IF, and Image frequencies. 6. L-R Isolation is referenced to an LO injection of 0 dBm. The L-R performance shown also includes the isolation due to an external SAW filter between the RF amplifier and mixer. 7. The maximum junction temperature ensures a minimum MTTF rating of 1 million hours of usage. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage Junction Temperature RF Input (continuous) Rating -40 to +85° C -55 to +125° C +6 V +220 °C +2 dBm Ordering Information Part No. CV111-3AF Description UMTS-band High Linearity Downconverter (lead-free/RoHS-compliant 6x6mm QFN package) CV111-3APCB75 Fully Assembled Eval. Board, IF = 75MHz CV111-3APCB240 Fully Assembled Eval. Board, IF = 240MHz Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 1 of 5 April 2007 CV111-3A UMTS-band High Linearity Downconverter Device Architecture / Application Circuit Information RF IN GND GND MIXIF GND 28 RF OUT 1 GND 2 N/C 3 GND 4 N/C 5 GND 6 MIXRF 7 8 GND 9 N/C 10 GND 11 MIXLO 27 26 25 24 23 22 21 IF OUT GND IF IN IF RF Amp Typical Downconverter Performance Chain Analysis Stage RF Amplifier RF Filter LO Amp / MMIC Mixer IF Amplifier CV111-3A Gain (dB) Output P1dB (dBm) Output IP3 (dBm) NF (dB) Current (mA) 140 --80 140 360 Gain (dB) Cumulative Performance Output Output NF P1dB IP3 (dB) (dBm) (dBm) 12 21.0 41.0 3.5 10 19.0 39.0 3.6 1.5 6.1 22.2 4.8 20 20.7 37.9 5.4 20 20.7 37.9 5.4 IF Amp 20 GND 19 N/C 18 GND LO Driver Amp 17 BIAS 16 GND RF LO 12 GND 13 LO OUT 14 GND 15 LO IN 12 21 41 3.5 -2 ----2.0 -8.5 8 23 9.1 18.5 23 41 2.1 Cumulative Performance RF Amp Matching RF Amp Bias IF Amp Matching IF Amp Bias RF Bandpass Filter / Attenuator Pad Printed Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness LO Amp Bias LO Amp Bias RF / IF Diplexer (used for cellular versions only) CV111-3A: The application circuit can be broken up into four main functions as denoted in the colored dotted areas above: RF/IF diplexing (purple; this is only used with the cellular-band CV products), amplifier matching (green), filtering (red), and dc biasing (blue). There are various placeholders for chip components in the circuit schematic so that a common PCB can be used for all WJ single-branch converters. Additional placeholders for other optional functions such as filtering are also included. RF / IF Amplifier Matching: The RF amplifier requires a shunt matching element for optimal gain and input return loss performance. The IF amplifier requires matching elements to optimize the performance of the amplifier to the desired IF center frequency. Since IF bandwidths are typically on the order of 5 to 10%, a simple two element matching network, in the form of either a high-pass or low-pass filter structure, is sufficient to match the MMIC IF amplifier over these narrow bandwidths. Proper component values for other IF center frequencies can be provided by emailing to applications.engineering@wj.com. RF Bandpass Filtering: Bandpass filtering is recommended to achieve the best noise figure performance with the downconverter. The bandpass filter, implemented with a SAW filter on the application circuit, allows for the suppression of noise from the image frequency. It is permissible to not use a filter and use a 2 dB pad with R6, R7, and R16 instead with slightly degraded noise figure performance. External Diplexer: This is only used with the cellular-band CV products. The mixer performs the diplexing internally for the CV111-3A; therefore the components shown in the diplexer section should be loaded as follows: C2 = C14 = 0 Ω. DC biasing: DC bias must be provided for the RF, LO and IF amplifiers in the converter. R1 sets the operating current for the last stage of the LO amplifier and is chosen to optimize the mixer LO drive level. Proper RF chokes and bypass capacitors are chosen for proper amplifier biasing at the intended frequency of operation. The “+5 V” dc bias should be supplied directly from a voltage regulator. IF Amplifier Matching Frequency (MHz) L7 (nH) C17 (pF) R8 (ohms) L4 (nH) 40 470 24 4.7 470 50 430 15 4.7 240 75 150 22 3.3 330 100 150 10 2.2 330 125 120 8.2 2.2 330 130 120 6.8 2.2 330 155 100 5.6 2.2 330 180 82 4.7 2.2 330 210 82 3.3 2.2 220 240 56 3.9 2.2 220 Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 2 of 5 April 2007 CV111-3A UMTS-band High Linearity Downconverter Downconverting Application Circuit: CV111-3APCB75 RF = 1900 – 2200 MHz, IF = 75 MHz PCB Layout Bill of Materials Ref. Desig. R1 R2, R3, R4, R5, C2, C14 R6, R7, R9, R10 R8 R11, R16 C1, C3, C4, C5, C6 C7, C9, C16 C8, C10 C11, C12, C13, C15, C21, F1, L5, L6, L8, L10 C17 C18 L2 L3 L4 L7 U1 Component 13 Ω chip resistor, size 0805 0 Ω chip resistor 470 Ω chip resistor 3.3 Ω chip resistor 10 Ω chip resistor 100 pF chip capacitor 0.018 µF chip capacitor 1000 pF chip capacitor Shown in silkscreen, but not used in actual circuit. 22 pF chip capacitor 1.5 pF chip capacitor 18 nH chip inductor 120 nH chip inductor 220 nH chip inductor, size 0805 22 nH chip inductor CV111-3A WJ Converter Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness All components are of size 0603 unless otherwise specified. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 3 of 5 April 2007 CV111-3A UMTS-band High Linearity Downconverter Downconverting Application Circuit: CV111-3APCB240 RF = 1900 – 2200 MHz, IF = 240 MHz PCB Layout Bill of Materials Ref. Desig. R1 R2, R3, R4, R5, C2, C14 R6, R7, R9, R10 R8 R11, R16 C1, C3, C4, C5, C6 C7, C9, C16 C8, C10 C11, C12, C13, C15, C21, F1, L5, L6, L8, L10 C17 C18 L2 L3 L4 L7 U1 Component 13 Ω chip resistor, size 0805 0 Ω chip resistor 470 Ω chip resistor 2.2 Ω chip resistor 10 Ω chip resistor 100 pF chip capacitor 0.018 µF chip capacitor 1000 pF chip capacitor Shown in silkscreen, but not used in actual circuit. 3.9 pF chip capacitor 1.5 pF chip capacitor 18 nH chip inductor 120 nH chip inductor 220 nH chip inductor, size 0805 56 nH chip inductor CV111-3A WJ Converter Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness All components are of size 0603 unless otherwise specified. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 4 of 5 April 2007 CV111-3A UMTS-band High Linearity Downconverter Mechanical Information This package is lead-free/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be lasermarked with a “CV111-3AF” product label with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part will be located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1B Passes 500V to