WJA1035-PCB

WJA1035 Product Features • • • • • • • • 50 – 4000 MHz 15 dB Gain +16 dBm P1dB +36 dBm OIP3 +5V Single Voltage Supply Internal Active Bias Supply Internally matched to 50 Ω Lead-free / RoHS-compliant / Green SOT-89 package +5V Active-Bias InGaP HBT Gain Block Product Description The WJA1035 is a cascadable gain block that offers high linearity in a low-cost surface-mount package. At 1.9 GHz, the WJA1035 typically provides 15 dB gain, +36 dBm OIP3, and +16 dBm P1dB. The device is housed in a leadfree/green/RoHS-compliant SOT-89 industry-standard SMT package using a NiPdAu plating to eliminate the possibility of tin whiskering. Functional Diagram GND 4 1 2 GND 3 RF OUT Applications • • • • GSM, PCS, CDMA, WCDMA WiMAX, WiBro Repeaters, BTS Transceivers RFID The WJA1035 consists of Darlington pair amplifiers using a high reliability InGaP/GaAs HBT process technology. The MMIC amplifier is internally matched to 50Ω and only requires DC-blocking capacitors and a bias inductor for operation. An internal active bias is designed to enable stable performance over temperature. A dropping bias resistor is not required allowing the device to be biased directly from a +5V supply voltage. The broadband amplifier can be directly applied to various current and next generation wireless technologies such as GSM, CDMA, W-CDMA, WiBro, and WiMAX. The WJA1035 is ideal for general purpose applications such as LO buffering, IF amplification and pre-driver stages within the 50 to 4000 MHz frequency range. RF IN Function Input Output/Bias Ground Pin No. 1 3 2, 4 Specifications Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Typical Performance Units MHz MHz dB dB dB dBm dBm dB V mA Min 50 Typ 1900 14.8 19 16 +16.1 +35.6 6.2 5 65 Max 4000 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB 500 14.3 -14 -19 +18.4 +36.9 5.3 Typical 900 14.2 -17 -19 +17.6 +35.6 5.7 1900 14 -19 -10 +16.1 +34.6 6.2 2100 14 -19 -10 +15.5 +34.5 6.8 1. Listed typical performance parameters measured on evaluation board. 1. Test conditions: 25 ºC, Supply Voltage = +5.00 V, 50 Ω System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. S-parameters and 3OIP measured at device pins. All other specifications measured on evaluation board. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature Supply Voltage Input Power -40 to +85 °C -55 to +150 °C +6.5 V +24 dBm Rating Ordering Information Part No. WJA1035 WJA1035-PCB Description +5V Active Bias InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Package) 50 – 4000 MHz Fully Assembled Eval. Board Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 1 of 4 Aug 2007 WJA1035 +5V Active-Bias InGaP HBT Gain Block Typical Evaluation Board RF Performance Supply Bias = +5.00 V, Icc = 65 mA 1. Test conditions: T = 25 ºC, Supply Voltage = +5.00 V, Icc = 65 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Gain vs. Frequency 22 20 T=25°C Return Loss 0 -5 40 T=25°C OIP3 vs. Frequency 50 45 Pout=0 dBm/tone S11, S22 (dB) 18 OIP3 (dBm) Gain (dB) 16 14 12 10 -10 -15 -20 35 30 25 20 S11 8 0 1000 2000 Frequency (MHz) 3000 4000 S22 3000 4000 15 10 -25 0 1000 2000 Frequency (MHz) -40C 0 1000 +25C +85C 3000 4000 2000 Frequency (MHz) Icc vs. Temperature 68 Vcc = +5V Noise Figure vs. Frequency 14 13 12 11 10 9 8 7 6 5 4 3 2 0 18 Gain vs. Pout f=1900 MHz 66 16 64 62 -40C 1000 +25C 2000 +85C 10 60 -50 -25 0 25 50 Temperature (°C) 75 100 3000 4000 Gain (dB) Icc (mA) NF (dB) 14 12 6 8 Frequency (MHz) Device Current vs. Voltage 10 12 Pout (dBm) 14 16 P Bvs. F u cy 1d req en 30 25 110 100 90 80 70 60 50 40 30 20 4.0 P1dB (dBm) 20 15 10 5 -40°C 4.5 +25°C 5.0 +85°C 0 5.5 6.0 -40°C 0 1000 +25°C +85°C 3000 4000 2000 F u cy(M z) req en H Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 2 of 4 Aug 2007 WJA1035 Vcc = 5.00V Icc = 65 mA R4 0Ω +5V Active-Bias InGaP HBT Gain Block Application Circuit C3 Bypass Capacitor RF IN R1 0Ω L1 RF Choke RF OUT WJA1035 C1 Blocking Capacitor R2 0Ω C2 Blocking Capacitor Recommended Component Values(1) Ref. Name Value / Type L1 470 nH ferrite core wire wound inductor(2) C1, C2 1000 pF NPO chip capacitor C3 0.018 μF chip capacitor R1, R2, R4 0 Ω(3) C4, C5, C6, Do Not Place(3) R3, R5, R6, R7, R8 1. 2. 3. Size 0805 0603 0603 0603 The listed values are contained on the evaluation board to achieve optimal broadband performance For lower cost and performance (500 – 4000 MHz) option use 18 nH air core wire wound inductor. Place holders for the 0Ω resistors and “Do Not Place” references are not needed for final design. Typical Device Data S-Parameters (Vdevice = +5.00 V, ICC = 64 mA, T = 25 °C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 10 50 100 300 500 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 2900 3100 3300 3500 3700 3900 4100 4300 4500 -10.17 -12.26 -12.52 -12.54 -12.50 -12.62 -13.08 -13.58 -14.52 -15.46 -16.75 -19.42 -25.75 -26.52 -17.99 -13.57 -10.56 -8.37 -6.60 -5.39 -4.69 -4.14 -3.67 -3.13 -2.77 -62.05 -143.28 -162.17 -177.90 177.96 175.16 170.88 163.68 156.10 149.91 146.80 146.77 160.04 -105.22 -91.58 -98.92 -108.76 -119.89 -130.10 -139.36 -149.24 -160.46 -171.17 -179.86 175.28 19.42 15.43 14.83 14.56 14.56 14.54 14.50 14.54 14.63 14.66 14.69 14.77 14.82 14.67 14.54 14.26 13.76 13.29 12.41 11.46 10.43 9.53 8.50 7.44 6.36 162.82 162.81 166.27 159.56 148.45 136.92 125.59 113.73 101.06 89.00 76.10 62.82 49.54 35.08 19.31 4.52 -10.36 -26.30 -40.96 -54.49 -67.28 -79.14 -90.54 -101.60 -111.29 -22.42 -19.09 -18.88 -18.78 -18.69 -18.76 -18.64 -18.59 -18.50 -18.49 -18.35 -18.31 -18.30 -18.40 -18.45 -18.70 -18.96 -19.33 -19.69 -20.18 -20.55 -20.80 -20.98 -21.23 -21.55 25.76 8.25 3.06 -4.07 -8.32 -12.86 -17.42 -22.37 -26.52 -31.10 -36.02 -41.17 -46.76 -52.76 -58.43 -64.51 -70.20 -75.81 -80.92 -84.47 -88.49 -91.02 -94.42 -97.85 -100.66 -6.92 -13.97 -15.94 -17.23 -18.02 -18.75 -19.49 -19.55 -18.79 -17.99 -16.95 -15.71 -13.77 -11.78 -9.93 -8.64 -7.77 -7.10 -6.57 -6.12 -5.88 -5.83 -5.94 -6.32 -6.32 -45.51 -117.48 -143.89 -169.98 -178.40 178.73 -179.14 -169.53 -158.21 -148.44 -140.24 -136.15 -136.39 -142.64 -150.42 -157.92 -166.68 -177.36 170.51 160.46 152.12 145.87 138.78 129.66 118.08 Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 3 of 4 Aug 2007 WJA1035 +5V Active-Bias InGaP HBT Gain Block This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Mechanical Information Outline Drawing Product Marking The WJA1035 will be marked with an “A1035” designator with an alphanumeric lot code marked below the part designator. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1C Passes ≥ 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes ≥ 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 4 of 4 Aug 2007