WM9705_06

w Multimedia AC’97 CODEC with Integrated Touch Screen Controller DESCRIPTION The WM9705 is a high-quality stereo audio codec with an integrated touch screen controller. The audio section is compliant with the Intel AC’97 Rev 2.2 specification. It performs full-duplex 18-bit codec functions and supports variable sample rates from 8 to 48k samples/s with high signal to noise ratio. Optional AC’97 features include 3D sound enhancement, line-level outputs, stereo buffered headphone outputs, hardware sample rate conversion, primary/secondary mode operation and S/PDIF output. Headphone auto-detect, I2S output and headphone buffer on the mono output are included. Additionally, the WM9705 integrates a complete 4-wire touch screen controller, including on-chip screen drivers, pen-down detection feature, and pressure measurement capability. A 5-pin digital bi-directional AC-Link serial interface allows transfer of control data and DAC and ADC words to and from the AC’97 controller. The WM9705 is fully operable on 3V or 5V or mixed 3/5V supplies, and is packaged in the industry standard 48-pin TQFP package with 7mm body size, or in a smaller 7 × 7 × 0.9mm QFN. WM9705 FEATURES • • • • • • • • • • • AC’97 rev2.2 compliant codec with pen digitiser 18-bit stereo audio codecs On-chip sample rate conversion Multiple channel input mixer S/PDIF digital audio output Headphone drivers on AUX and MONO outputs 4-wire touch screen interface with co-ordinate and pressure measurement, and pen-down detection W ake-up from sleep mode on pen down 3V to 5V operation Extensive power management features including hardware power down option Standard AC’97 pinout in 48-lead TQFP package or 48-lead QFN package. APPLICATIONS • • Personal Digital Assistants and ‘Smartphones’ PocketPC systems BLOCK DIAGRAM DGND1 DVDD1 DGND2 DVDD2 CX3D1 CX3D2 HPGND HPVDD LINEINVOL (Reg 10h) CDVOL (Reg 12h) MICVOL (Reg 0Eh) MUX ADCNDAC (Reg 5Ch) HPVOL (Reg 04h) M U X 16 / 32Ohm headphone HPOUTL HPOUTR HPGND 3D MPM (Reg 5Ah) VID MIXVOL (Reg 72h) AUX HPND (Reg 5Ch) LINEINL LINEINR CDL CDGND CDR MIC2 MIC1 PHONE M U X RECORD GAIN (Reg 1Ch) ADC L DIGITAL FILTERS Σ∆ MODULATION DAC L MIC BOOST MIC SELECT (Reg 0Eh) (Reg 20h) M 0/20 U dB X M U X headset autodetect HPOUTL PHONE VID AUX RECORD SELECT (Reg 1Ah) ADC R VARIABLE RATE AUDIO DAC R DACVOL (Reg 18h) LINEOUTL LINEOUTR POP (Reg 20h) MASTER VOL (Reg 02h) MIX (Reg 20h) W PCBEEP ADCSEL (Reg 0Ah) (Reg 0Ch) M U X AUXADC BMON SAR ADC WM9705 PSEL (Reg 5Ch) M U X MONO VOL (Reg 06h) MONO_OUT (TX) PEN DOWN TOUCH PANEL SWITCH MATRIX CONTROL LOGIC VID AUX AC'97 INTERFACE VREF VREFOUT CLOCK OSC X+/AUXL X-/AUXR XTLOUT Y+/VIDL Y-/VIDR XTLIN PDRES AVDD1 AGND1 PENDET EAPD/BUSY MASK/LRC SPEN/I2S SPDIF CID BITCLK SYNC SDATAIN SDATAOUT RESETB PCBEEP PHONE (RX) 24.576MHz 4-wire resistive touchpanel WOLFSON MICROELECTRONICS plc To receive regular email updates, sign up at http://www.wolfsonmicro.com/enews/ Production Data, August 2006, Rev 4.4 Copyright ©2006 Wolfson Microelectronics plc AGND2 VREF AVDD2 CAP2 WM9705 Production Data TABLE OF CONTENTS DESCRIPTION ............................................................................................................1 FEATURES..................................................................................................................1 APPLICATIONS ..........................................................................................................1 BLOCK DIAGRAM ......................................................................................................1 TABLE OF CONTENTS ..............................................................................................2 ORDERING INFORMATION .......................................................................................4 ABSOLUTE MAXIMUM RATINGS..............................................................................4 RECOMMENDED OPERATING CONDITIONS ..........................................................5 PIN CONFIGURATION................................................................................................6 PIN DESCRIPTION .....................................................................................................7 POWER CONSUMPTION .........................................................................................12 DETAILED TIMING DIAGRAMS ...............................................................................13 AC-LINK LOW POWER MODE .........................................................................................13 COLD RESET....................................................................................................................13 W ARM RESET ..................................................................................................................14 CLOCK SPECIFICATIONS ...............................................................................................14 DATA SETUP AND HOLD (50PF EXTERNAL LOAD).......................................................15 SIGNAL RISE AND FALL TIMES ......................................................................................15 DEVICE DESCRIPTION............................................................................................16 INTRODUCTION ...............................................................................................................16 AC’97 FEATURES.............................................................................................................16 NON - AC’97 FEATURES..................................................................................................17 PEN DIGITIZER AND AUXILIARY ADC ............................................................................19 3-D STEREO ENHANCEMENT.........................................................................................19 VARIABLE SAMPLE RATE SUPPORT .............................................................................20 2 SPDIF OR I S DIGITAL AUDIO DATA OUTPUT...............................................................20 PRIMARY/SECONDARY ID SUPPORT ............................................................................21 HEADPHONE DRIVE AND HEADSET AUTODETECT .....................................................21 DATA SLOT MAPPING .....................................................................................................23 AC-LINK DIGITAL SERIAL INTERFACE PROTOCOL ......................................................23 AC-LINK AUDIO OUTPUT FRAME (SDATAOUT) ............................................................25 AC-LINK AUDIO INPUT FRAME (SDATAIN) ....................................................................27 AC-LINK LOW POWER MODE .........................................................................................29 W AKING UP THE AC-LINK...............................................................................................29 SERIAL INTERFACE REGISTER MAP DESCRIPTION....................................................30 REGISTER 28H – EXTENDED AUDIO ID.........................................................................34 REGISTER 2AH – EXTENDED AUDIO STATUS AND CONTROL REGISTER ................35 REGISTER 2CH AND 32H – AUDIO SAMPLE RATE CONTROL REGISTERS................35 REGISTERS 3AH – SPDIF CONTROL REGISTER ..........................................................36 VENDOR SPECIFIC REGISTERS (INDEX 5AH - 7AH) ....................................................36 SERIAL INTERFACE REGISTER MAP ....................................................................39 PEN DIGITISER OPERATION ..................................................................................40 TIMING OF PEN DIGITISER OPERATIONS.....................................................................41 CONTROL OF PEN DIGITISER FUNCTIONS ..................................................................41 READBACK OF PEN DIGITISER RESULTS.....................................................................42 CONVERSION CONTROL ................................................................................................43 PRESSURE MEASUREMENT ..........................................................................................48 MASK FUNCTION .............................................................................................................49 w PD Rev 4.4 August 2006 2 WM9705 Production Data STANDBY OPERATION AND WAKE-UP..........................................................................50 AUXILIARY CONVERSIONS.............................................................................................51 RECOMMENDED EXTERNAL COMPONENTS .......................................................52 PACKAGE DIMENSIONS - TQFP.............................................................................53 PACKAGE DIMENSIONS - QFN...............................................................................54 IMPORTANT NOTICE ...............................................................................................55 ADDRESS: ........................................................................................................................55 REVISION HISTORY.................................................................................................56 w PD Rev 4.4 August 2006 3 WM9705 Production Data ORDERING INFORMATION DEVICE W M9705SEFT/V W M9705SEFT/RV TEMPERATURE RANGE -25 to 85oC -25 to 85oC PACKAGE 48-lead TQFP (Pb-free) 48-lead TQFP (Pb-free, tape and reel) MOISTURE SENSITIVITY LEVEL MSL1 MSL1 PEAK SOLDERING TEMPERATURE 260oC 260oC DEVICE W M9705SEFL/V W M9705SEFL/RV Note: Reel quantity = 2,200 TEMPERATURE RANGE -25 to 85 C -25 to 85oC o PACKAGE 48-lead QFN (Pb-free) 48-lead QFN (Pb-free, tape and reel) MOISTURE SENSITIVITY LEVEL MSL3 MSL3 PEAK SOLDERING TEMPERATURE 260 C 260oC o ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at