NP178 Series (Open Top) Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
Specifications
1,000MW min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m W max. at 10mA/20mV max. Operating Temperature Range: –55°C to +170°C Contact Force: 30g min. per pin at minimun displacement of 0.45mm 90g max. per pin at maximum displacement of 0.8mm
Part Number (Details)
NP178 - 644 01 Series No. No. of Contact Pins Design Number
*
- **
Materials and Finish
Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Beryllium Copper (BeCu) Gold over Nickel
Matching IC Diameter /Socket Pin Length 1: L = 3.3 1 : Æ0.35±0.05 2: L = 3.8 2 : Æ0.45±0.05 MF =Flanged Unmarked = Not Flanged
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
NP178-64401-*-**
A B C
1.27
22.86±0.05 1.27x36=45.72±0.1 1.27±0.05
78.00±0.1 26.0±0.05 24.0±0.05 3-Æ1.5
+0.1 0
22.45±0.05 23.05±0.05
27.1
45.5
26.5
D
644-Æ0.7 4- Æ2.2
+0.1 0
1.27±0.05 1.27x36=45.72±0.1 14.3±0.05
+0.1 0
NP178-72002-*-**
1.27±0.05
Æ3.0 Depth 3.0 4- Æ2.2 79.00±0.1 52.0±0.1 1.27±0.05
23.70±0.05 24.30±0.05
+0.1 0
3-Æ1.5
+0.1 0
24.5
Initial Position of Cover
1.27x38=48.26±0.1
1.5
Æ1.45
720-Æ0.7 4- Æ2.2 1.27x38=48.26±0.1
+0.1 0
1.30±0.05 14.75±0.05
18.5
Outline IC Dimensions
Pressed Down Position of Cover
T 0.2 x W 0.5 L: 1 = 3.3 2 = 3.8
E
G
H F
Part Number
NP178-64401-*-** NP178-72002-*-**
Test & Burn-In Test
Grid Size
19 x 19 20 x 20
Pin Count
644 720
Socket Dimensions C D B A
78.0 79.0 74.0 1.27x36=45.72 75.0 1.27x38=48.26 67.0 69.5
E max.
IC Dimensions F G H
2.54~5.9 2.54~5.9 1.27 1.27
50.0 45.72 52.8 48.26
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
27.75±0.05
28.35±0.05
26.5±0.05
27.1±0.05
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