NP383-18010-P

NP383 Series (Open Top) Chip Scale Package -TH Specifications 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –40°C to +150°C 10gf per pin approx. Contact Force: 2.2kg ±0.5 Operating Force: (CSP, 0.50mm Pitch) Part Number (Details) NP383 - *** Series No. No. of Contact Pins Design Number 09 * Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features µ Open top socket for BGA µ Through hole 0.5mm pitch µ 2-point Tweezer Contacts Positioning Pin: N = Without P = With Example Socket Dimensions Contact Details Recommended PC Board Layout Top View from Socket 2-point Tweezer Style Contact Free Open Test Part Number NP383-18010-* NP383-28804-* NP383-84107-* Grid Size 10x18 18x18 29x29 Body size 11.0x12.5 10.0x10.0 15.0x15.0 Socket Dimensions 19.5x26.0 36.0x36.0 33.0x33 Centre Grid size no grid centre 6x6 7x7 Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Arrays