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SP8610

SP8610

  • 厂商:

    ZARLINK

  • 封装:

  • 描述:

    SP8610 - asynchronous ECL divide - Zarlink Semiconductor Inc

  • 数据手册
  • 价格&库存
SP8610 数据手册
Obsolescence Notice This product is obsolete. This information is available for your convenience only. For more information on Zarlink’s obsolete products and replacement product lists, please visit http://products.zarlink.com/obsolete_products/ THIS DOCUMENT IS FOR MAINTENANCE PURPOSES ONLY AND IS NOT RECOMMENDED FOR NEW DESIGNS ADVANCE INFORMATION DS3661-1·2 SP8610 1000MHz44 SP8611 1300/1500MHz44 The SP8610 and SP8611 are asynchronous ECL divide by four circuits with ECL compatible outputs which can also be used to drive 100Ω lines. They feature input sensitivities of 600mV p-p (800mV p-p above 1300MHz). NC NC NC CLOCK INPUT NC 1 2 3 4 5 6 7 14 13 12 VCC (0V) NC NC OUTPUT OUTPUT NC NC FEATURES s ECL Compatible Outputs s AC-Coupled Inputs (Internal Bias) QUICK REFERENCE DATA s Supply Voltage: 25·2V SP8610 SP8611 11 10 INTERNAL BIAS DECOUPLING VEE 9 8 s Power Consumption: 380mW s Max. Input Frequency: 1500MHz (SP8611B) s Temperature Range: A Grade: 255°C to 1110°C (1125°C with suitable heat sink) B Grade: 0°C to 170°C DG14 Fig. 1 Pin connections - top view ABSOLUTE MAXIMUM RATINGS Supply voltage, VEE Output current Storage temperature range Max. junction temperature Max. clock input voltage 28V 15mA 265°C to 1150°C 1175°C 2·5V p-p ORDERING INFORMATION SP8610 A DG SP8610 B DG SP8610 AA DG SP8610 NA 1C SP8611 A DG SP8611 B DG SP8611 AA DG SP8611 NA 1C VCC (0V) 14 11 CLOCK INPUT 4 DIVIDE BY 2 DIVIDE BY 2 10 OUTPUT OUTPUT 6 INTERNAL BIAS DECOUPLING 7 VEE Fig. 2 Functional diagram SP8610/11 ELECTRICAL CHARACTERISTICS Unless otherwise stated, the Electrical Characteristics are guaranteed over specified supply, frequency and temperature range Supply voltage, VCC = 0V, VEE = 25·2V 6 0·25V Temperature, TAMB = 255°C to 1125°C (A Grade) (Note 1), 0°C to 170°C (B Grade) Value Characteristic Maximum frequency (sinewave input) Symbol fMAX Min. 1·0 1·3 1·5 Max. Units Type Conditions Notes Minimum frequency (sinewave input) Current consumption Output low voltage Output high voltage Minimum output swing fMIN IEE VOL VOH VOUT 21·92 20·93 500 GHz SP8605A,B Input = 400-1200mV p-p GHz SP8606A Input = 800-1200mV p-p GHz SP8606B Input = 400-1200mV p-p Input = 600-1200mV p-p All 150 MHz VEE = 25·45V, outputs All 100 mA unloaded All VEE = 25·2V, RL = 430Ω 21·62 V (25°C) VEE = 25·2V, RL = 430Ω All 20·75 V (25°C) VEE = 25·2V, RL = 430Ω All mV 6 6 6 4 5 5 NOTES 1. The A Grade devices must be used with a heat sink to maintain chip temperature below 1150°C when operating in a TAMB of 1125°C. 2. The temperature coefficients of VOH = 11·2mV/°C, and VOL = 10·24mV/°C but these are not tested. 3. The test configuration for dynamic testing is shown in Fig.5. 4. Tested at 25°C and 1125°C only (170°C for B grade). 5. Tested at 25°C only 6. Tested at 1125°C only (170°C for B grade). SP8611A 1400 INPUT AMPLITUDE (mV p-p) 1200 1000 800 600 400 TCASE = 1125°C 200 0 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 INPUT FREQUENCY (MHz) TCASE = 255°C SP8611B GUARANTEED * OPERATING WINDOW TCASE = 170°C * Tested as specified in table of Electrical Characteristics Fig. 3 Typical input characteristic of SP8611 THERMAL CHARACTERISTICS uJC approximately 30°C/W uJA approximately 110°C/W OPERATING NOTES 1. The clock input (pin 4) should be capacitively coupled to the signal source. The input signal path is completed by connecting a capacitor from the internal bias decoupling, pin 6, to ground. 2. In the absence of a signal the device will self-oscillate. If this is undesirable, it may be prevented by connecting a 10kΩ resistor from the unused input to VEE i.e. from pin 4 to pin 7. This will reduce the input sensitivity by approximately 100mV. 3. The circuit will operate at very low input frequencies but slew rate must be better than 200V/µs. 4. The input impedance of the SP8610/11 is a function of frequency, see Fig. 4. 5. The emitter follower outputs require external load resistors. These should not be less than 330Ω and a value of 430Ω is recommended. Interfacing to ECLlll/10K is shown in Fig. 7. 6. These devices may be used with split suopply lines and ground referenced input; a suitable configuration is shown in Fig. 6. 7. All components should be suitable for the frequency in use. 2 SP8610/11 j1 j 0.5 j2 j 0.2 1300 1400 1500 1200 1100 1000 0.2 0.5 1 2 5 j5 0 900 2j 5 2j 0.2 800 700 600 500 2j 0.5 2j 1 2j 2 Fig. 4 Typical input impedance. Test conditions: supply voltage = 25·2V, ambient temperature = 25°C, frequencies in MHz, Impedances normalised to 50Ω VCC = 0V 50Ω SIGNAL SOURCE 33 MONITOR 1n 20 10n 4 33 6 14 11 50 50 1n 1n 50Ω LINE TO SCOPE DUT 7 10 430 430 VEE = 25·2V60·25V 25dB ATTENUATOR NETWORK 10n Fig. 5 Toggle frequency test circuit 13V 10n 50Ω SIGNAL SOURCE 50 6 7 430 430 VEE = 22·2V 10n 4 14 11 50 50 1n OUTPUT 1n OUTPUT DUT 10 Fig. 6 Circuit for using the input signal about ground potential 3 SP8610/11 VCC = 0V 47 Q 0V SP8610/11 Q 430 430 ECLlll ECL10K SP8610/11 ECLlll ECL10K 1·5k 25·2V 25·2V LOW POWER INTERFACING Fig. 7 Interfacing SP8610/11 to ECL10K and ECLlll 14 1n INPUT 4 11 ECL OUTPUT 400 DIVIDE BY 4 10 6 1n BIAS 430 7 25·2V 1n 430 Fig. 8 Typical application showing interfacing 4 SP8610/11 NOTES 5 SP8610/11 PACKAGE DETAILS Dimensions are shown thus: mm (in). 1 5·59/7·87 (0·220/0·310) 14 0·20/0·36 (0·008/0·014) PIN 1 REF NOTCH 7·62 (0·3) NOM CTRS 1·14/1·65 (0·045/0·065) 20·32 (0·800) MAX SEATING PLANE 5·08/(0·20) MAX 0·51 (0·02) 3·18/4·06 MIN (0·125/0·160) 0·36/0·58 (0·014/0·23) 14 LEADS AT 2·54 (0·10) NOM. SPACING NOTES 1. Controlling dimensions are inches. 2. This package outline diagram is for guidance only. Please contact your GPS Customer Service Centre for further information. 14-LEAD CERAMIC DIL – DG14 HEADQUARTERS OPERATIONS GEC PLESSEY SEMICONDUCTORS Cheney Manor, Swindon, Wiltshire SN2 2QW, United Kingdom. Tel: (0793) 518000 Fax: (0793) 518411 GEC PLESSEY SEMICONDUCTORS P.O. Box 660017 1500 Green Hills Road, Scotts Valley, CA95067-0017 United States of America. Tel (408) 438 2900 Fax: (408) 438 5576 CUSTOMER SERVICE CENTRES q FRANCE & BENELUX Les Ulis Cedex Tel: (1) 64 46 23 45 Fax : (1) 64 46 06 07 q GERMANY Munich Tel: (089) 3609 06-0 Fax : (089) 3609 06-55 q ITALY Milan Tel: (02) 66040867 Fax: (02) 66040993 q JAPAN Tokyo Tel: (3) 5276-5501 Fax: (3) 5276-5510 q NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 7023. q SOUTH EAST ASIA Singapore Tel: (65) 3827708 Fax: (65) 3828872 q SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36 q UK, EIRE, DENMARK, FINLAND & NORWAY Swindon Tel: (0793) 518510 Fax : (0793) 518582 These are supported by Agents and Distributors in major countries world-wide. © GEC Plessey Semiconductors 1994 Publication No. DS3661 Issue No. 1.2 March 1994 This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior knowledge the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. 6 For more information about all Zarlink products visit our Web Site at w ww.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE
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