Reflexlichtschranke mit Schmitt-Trigger Reflective Interrupter with Schmitt-Trigger Lead (Pb) Free Product - RoHS Compliant SFH 9240
Wesentliche Merkmale • IR-GaAs-Lumineszenzdiode in Kombination mit einem Schmitt-Trigger IC • SFH 9240: Output active low • Tageslichtsperrfilter • Einschaltstrom: typ. 3 mA • Sender und Empfänger galvanisch getrennt • Vorbehandlung nach JEDEC Level 4 Anwendungen • Optischer Schalter • Pulsformer • Zähler Typ Type SFH 9240 Bestellnummer Ordering Code Q65110A2714
Features • IR-GaAs-emitter in combination with a Schmitt-Trigger IC • SFH 9240: Output active low • Daylight cut-off filter • Threshold current: typ. 3 mA • Emitter and detector electrically isolated • Preconditioning acc. to JEDEC Level 4 Applications • Optical threshold switch • Pulseformer • Counter IF,ON [mA] (VCC = 5 V, d = 1 mm Kodak neutral white test card with 90% reflection) 3 (< 10)
2007-04-02
1
SFH 9240
Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Sperrspannung Reverse voltage Vorwärtsgleichstrom Forward current Stoßstrom (tP ≤ 10 μs) Surge current (tP ≤ 10 μs) Verlustleistung Power dissipation Empfänger (Schmitt-Trigger IC) Detector (Schmitt-Trigger IC) Versorgungsspannung Supply voltage Ausgangsspannung Output voltage Ausgangsstrom Output current (TA = 25 °C) Verlustleistung Power dissipation Reflexlichtschranke Light Reflection Switch Betriebs- und Lagertemperatur Operating and storage temperature range Verlustleistung Power dissipation Symbol Symbol Wert Value Einheit Unit
VR IF IFSM Ptot
5 50 1.5 80
V mA A mW
VCC VO IO Ptot
– 0.5 … + 20 – 0.5 … + 20 50 175
V V mA mW
Top, Tstg Ptot
– 40 … + 100 150
°C mW
2007-04-02
2
SFH 9240
Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Durchlassspannung Forward voltage IF = 50 mA Sperrstrom Reverse current VR = 5 V Kapazität Capacitance VR = 0 V, f = 1 MHz Symbol Symbol Wert Value Einheit Unit
VF
1.25 (≤ 1.65)
V
IR
0.01 (≤ 1)
μA
CO
25
pF
Wärmewiderstand (Montage auf PC-Board mit RthJA > 5 mm2 Padgröße) Thermal resistance (mounting on pcb with > 5 mm2 pad size)
270
K/W
Empfänger (Schmitt-Trigger IC) (wenn nicht anders angegeben, VCC = 5 V) Detector (Schmitt-Trigger IC) (unless otherwise specified, VCC = 5 V) Ausgangsspannung „high“ Output voltage “high” IO = 0 Ausgangsspannung „low“ Output voltage “low” IO = 16 mA Stromaufnahme Supply current VCC = 5 V VCC = 18 V Anstiegszeit 10% bis 90% Rise time 10% to 90% RL = 280 Ω, IF = 20 mA Abfallzeit 90% bis 10% Fall time 90% to 10% RL = 280 Ω, IF = 20 mA
VOH
VCC (> 4.0)
V
VOL
0.15 (< 0.4)
V
ICC
3.3 (< 5) 5.0
mA
tr
20 ns
tf
10 ns
2007-04-02
3
SFH 9240
Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Ausgangsverzögerungszeit Propagation delay time ”ON” RL = 280 Ω, IF = 20 mA Ausgangsverzögerungszeit Propagation delay time “OFF” RL = 280 Ω, IF = 20 mA Reflexlichtschranke Light Reflection Switch Schaltschwelle Threshold current, Kodak neutral white test card with 90% reflection VCC = 5 V, d = 1 mm Hysterese Hysteresis Symbol Symbol Wert Value 1 Einheit Unit μs
tON
tOFF
2
μs
IF, ON
3 (< 10)
mA
IF, OFF / IF, ON
0.6 (0.5 … 0.9)
–
d Reflector with 90% reflexion (Kodak neutral white test card)
OHM02257
Zulässiger Arbeitsbereich Operating Conditions Bezeichnung Parameter Versorgungsspannung Supply voltage Ausgangsstrom Output current Symbol Symbol Wert Value 4 … 18 < 16 Einheit Unit V mA
VCC IO
Zur Stabilisierung der Versorgung wird ein Stützkondensator (angeschlossen zwischen VCC und GND) von typ. 0.1 μF empfohlen. A bypass capacitor, 0.1 μF typical, connected between VCC and GND is recommended in order to stabilize power supply line.
2007-04-02
4
SFH 9240
Active "Low" Anode Voltage Regulator 10 k Ω OUT
+ -
VCC
Cathode
OHF03902
GND
Figure 1
Block Diagram
VCC R L = 280 Ω
Input
VCC = 5 V
SFH 9240
OUT
OUT
C = 0.1 μF R = 47 Ω
Figure 2
GND GND
OHF00520
Test Circuit for Switching and Response Time
SFH 9240 (Active "Low") Input 50%
t PHL
Output
t PLH
90% 50% 10%
tf
Figure 3
2007-04-02
tr
OHF03903
Switching Time Definitions
5
SFH 9240
Threshold Current vs. Distance IF = f (d)
ΙF
60 mA 50
OHF00684
Relative Threshold Ee, ON/Ee, ON VCC = 5 V = f (VCC)
E e, ON 1.5 E e, ON_5 V 1.3 1.2 1.1
OHF00507
Supply Current ICC = f (VCC)
I CC
6 mA
OHF00510
Ι F, ON (SFH 9240 H
L; SFH 9241 L
H) L)
Ι F, OFF (SFH 9240 L H; SFH 9241 H
40
4
30
1 0.9
3
20
0.8 0.7 0.6
2
10
1
0 0 1 2 3 4 5 6 7 mm 9
0.5
0
5
10
15
V
20
0
0
5
10
15
V
20
d
VCC
VCC
Output Voltage VOL = f (IOUT, VCC)
3.5 VOL V 3 2.5 2 1.5 5V 10 V 15 V 20 V
OHF00512
Supply Current vs. Ambient Temperature ICC = f (TA, VCC)
I CC
6 mA 5
OHF00514
VCC = 20 V VCC = 15 V VCC = 10 V VCC = 5 V
4
3
2
1 0.5 0
1
0
10
20
30
40 mA 50
0 -25
0
25
50
75 ˚C 100
I OUT
TA
Perm. Pulse Handling Capability IF = f (tp), Duty cycle D = parameter, TA = 25 °C
IF
104 mA
OHF02623
Perm. Pulse Handling Capability IF = f (tp), Duty cycle D = parameter, TA = 85 °C
IF
104 mA
OHF02622
D = TP
t
tP
IF T
D = TP
t
tP
IF T
103
D=
0.005 0.01 0.02 0.05 0.1
103
D=
0.005 0.01 0.02 0.05 0.1 0.2
0.2 102 0.5 1
102 0.5 1
101 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
101 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
2007-04-02
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SFH 9240
Maßzeichnung Package Outlines
0.15 (0.006) 0.13 (0.005)
(0.05 (0.002) typ.)
5.8 (0.228) 3.4 (0.134) 3.0 (0.118)
(5˚)
0...0.1 (0...0.004)
0.2 M A
6.2 (0.244) 4.2 (0.165) 3.8 (0.150) B
A
(1.2 (0.047) typ.)
0.5 (0.020) 0.3 (0.012)
(0.4 (0.016) typ.)
1 2 3 6 5 4
Chip Positionen 0.1 M B Empfänger/Receiver
GPLY0504
Type SFH 9240
1 Anode
2 OUT
(0.1 (0.004) typ.)
Sender/Emitter
3 Vcc
1.27 (0.050) Raster (spacing)
2.54 (0.100) Raster (spacing)
4 -
5
GND Cathode
Maße in mm (inch) / Dimensions in mm (inch).
2007-04-02
7
2.1 (0.083) 1.7 (0.067)
6
SFH 9240
Empfohlenes Lötpaddesign Recommended Solder Pad Reflow Löten Reflow Soldering
1.27 (0.050)
0.6 (0.024)
1.2 (0.047)
Padgeometrie für verbesserte Wärmeableitung Paddesign for improved Heat dissipation
1.27 (0.050)
Cu-Fläche >5 mm 2 Cu-area >5 mm 2 Lötstopplack Solder resist
3.9 (0.154)
OHPY0030
Maße in mm (inch) / Dimensions in mm (inch).
2007-04-02
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SFH 9240
Lötbedingungen Soldering Conditions Bauform Type Drypack Level acc. to JEDEC A112-A 4 Tauch-, Schwalllötung Dip, Wave Soldering Reflowlötung Reflow Soldering Max. Time in Peak Zone 20 sec. Kolbenlötung Iron Soldering (Iron temp.)
Peak Temp. Max. Time in Peak Temp. (solderbath) Peak Zone (package temp.) n. a. – 260 °C
SFH 9240
n.a.
Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 (nach J-STD-020C) (acc. to J-STD-020C)
300 ˚C 255 ˚C 240 ˚C 217 ˚C 200
OHLA0687
T
250
Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile
˚C 260 ˚C +0˚C -5 245 ˚C ±5 ˚C ˚C 235 ˚C +5˚C -0
10 s min 30 s max
150 120 s max 100 Ramp Up 3 K/s (max) 25 ˚C 0 0 50 100 150 200 100 s max
Ramp Down 6 K/s (max)
50
250
s
300
t
2007-04-02
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SFH 9240
Gurtung / Polarität und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehäuse:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel SMT-Components - Package: SMT-RLS
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered 2007-04-02 10
2
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