VL-COMM-33ED

Product Data Sheet VL-COMm-33 COM Express Mini CPU Module 55 x 84 mm (2.17 x 3.31”) Overview Highlights The VL-COMm-33 is an extremely small and rugged Computer on Module (COM) based on the industry-standard COM Express mini form factor. Roughly the size of a credit card, the VL-COMm-33 has been engineered to meet the requirements of aviation, defense, industrial control, and medical applications while adhering to stringent regulatory standards. The VL-COMm-33 is manufactured to IPC-A-610 Class 2 standards. Equipped with an Intel Atom “Bay Trail” E38xx processor, it is designed to withstand extreme temperature, impact, and vibration. ƒƒ Intel® Atom™ Bay Trail E38xx processor ƒƒ Extremely small COM Express™ mini form factor ƒƒ Industrial temp. (-40º to +85ºC) ƒƒ Wide input voltage (4.75V–20V) ƒƒ On-board RAM ƒƒ On-board eMMC Flash storage (optional) Available in single, dual, and quad core versions, the COMm-33 provides extreme performance for its size. It does so at moderate power consumption (3.5 to 7.25W typical), in a very small package. The COMm-33 provides compatibility with a broad range of standard x86 application development tools for reduced development time. The VL-COMm-33 utilizes advanced Intel technologies to maximize performance. Intel Virtualization Technology allows one VL-COMm-33 system to function as multiple “virtual” platforms. This enables computing activities to be isolated into separate partitions for increased application flexibility and reliability. Intel 64 architecture delivers 64-bit computing when combined with supporting software. C O R P O R A T I O N Product Data Sheet Overview ...continued The integrated Intel Gen-7 graphics core provides hardware-accelerated MPEG4/H.264 and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI. Designed and tested for industrial temperature (-40º to +85ºC) operation, the rugged VL-COMm-33 also meets MIL-STD-202G specifications for shock and vibration. Soldered-down RAM provides additional ruggedization for use in extremely harsh environments. The standard COM Type 10 pin-out provides industry-standard system interfaces that include Gigabit Ethernet with network boot capability, a single USB 3.0/2.0 and six USB 2.0 ports, two serial ports, Intel High-Definition Audio (HDA), LPC, I2C, SPI, and SMBus to the carrier board. A dual SATA 3 Gb/s interface supports high-capacity storage. Optional on-board eMMC memory supports up to 8 GB of Flash. The VL-COMm-33 is supported by a variety of thermal heat dissipation solutions, including a standard heat plate, heat sink, fan for heat sink, heat pipe, and other cooling / mounting solutions. A wide input voltage range of 4.75 to 20 volts simplifies system power supply requirements. It is fully compatible with 12V automotive-type power systems. The VL-COMm-33 is backed by a five-year warranty, 5+ year off-the-shelf availability guarantee, and expert US-based technical support. Product Life Extension options support availability through the year 2025. The VL-COMm-33 is compatible with a variety of popular x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks. Product customization is available, even in low quantities. Options include conformal coating, splash screen configuration, application-specific testing, BOM revision locks, special labeling, etc. A compatible carrier card is required for operation of this COM module. Contact VersaLogic for custom designed carrier boards that meet your exact requirements. Please contact a VersaLogic Sales Engineer for more information.  Features 1 Intel Atom “Bay Trail” Processor High performance CPU in quad-, dual- or singlecore versions. Low power consumption. 2 RAM Up to 4 GB soldered-down RAM. Wide Input Voltage Range Flash Memory Accepts 4.75 to 20 volts (nominal 12V input) Up to 8 GB of on-board eMMC flash storage. I/O Interfaces SATA, PCIe, USB 3.0, USB 2.0, GPIO, serial, HD audio, LPC, SMBus SPI, and I2C. COM Express Mini Form Factor Extremely small (55 mm x 84 mm) with Type 10 pin-out. Industrial Temperature Operation Rated -40° to +85°C for harsh environments. 2 MIL-STD-202G Qualified for high shock / vibration environments. High-performance Video Integrated Intel Gen 7 graphics core supports DirectX 11, OpenGL 4.0, and H.264, MPEG-2 encoding/decoding. LVDS video output. 1 Network Gigabit Ethernet (GbE) with remote boot support. VersaLogic Corporation, 12100 SW Tualatin Rd., Tualatin, OR 97062 | (503) 747-2261 | Info@VersaLogic.com | www.VersaLogic.com VL-COMm-33 COM Express Mini CPU Module Specifications General Video Form Factor COM Express mini (Type 10) General Board Size Weight Processor 55 mm x 84 mm (2.17” x 3.31”) 31 grams (1.09 oz.) Intel Atom E38xx platform. 512K 8-way L2 cache per core. Intel 64-bit instructions, Virtualization Technology (VT), and new AES instructions. Model Idle Typical Max. S3 VRAM Desktop Display Interface ∆ Power Requirements  (@ +12V) § VL-COMm-33EAP 2.5W 3.5W 4.5W 0.4W VL-COMm-33EBP 3.5W 5.6W 8.0W 0.4W VL-COMm-33EDP 3.5W 7.3W 11.0W 0.4W Input Voltage 4.75V–20V (nominal 12V operation) System Reset & Hardware Monitors Manufacturing Standards Regulatory Compliance Voltage rails monitored. Watchdog timer with programmable timeout (1 µS to 10 min.). IPC-A-610 Class 2 RoHS (2002/95/CE) Storage Temperature Cooling -40° to +85°C. Derate -1.1°C per 305m (1,000 ft.) above 2,300m (7,500 ft.). ¤ CPU die must be kept below 90°C -40° to +85°C Airflow Altitude ¤ Operating To 4,570m (15,000 ft.) Storage To 12,000m (40,000 ft.) Thermal Shock 5°C/min. over operating temperature Humidity Less than 95%, noncondensing Vibration, Sinusoidal Sweep ¥ Vibration, Random ¥ MIL-STD-202G, Method 204, Modified Condition A: 2g constant acceleration from 5 to 500 Hz, 20 min. per axis LFM = Linear Feet per Minute LMM = Linear Meters per Minute MIL-STD-202G, Method 214A, Condition A: 5.35g rms, 5 min. per axis MIL-STD-202G, Method 213B, Condition G: 20g half-sine, 11 ms duration per axis Memory System RAM Rotating Drive / Flash Two SATA 3 Gb/s ports ∆ / Solid-State Drives ‡ Optional eMMC 4.5 onboard flash up to 8 GB MLC Ethernet † ∆ Thermal solution required. CPU die must be kept below 90°C. See heat plate, heat sink, fan, and heat pipe options. All models: 100 LFM (30 LMM) Mechanical Shock ¥ Mass Storage Network Interface Environmental Operating Temperature OEM Flat Panel Interface ∆ Integrated high-performance video. Intel Gen-7 graphics core with 4 Execution Units and Turbo Boost. Supports DirectX 11, OpenGL 4.0, VP8, MPEG2, H.264, and VC1. Up to 224 MB shared DRAM 1x DDI (Digital Display Interface) with support for ƒƒ1.1. Multiplexed with HDMI/DVI ports. Supports Hot-Plug detect. ƒƒMultiplexed with DisplayPort (DP)/DVI. Supports Hot-Plug detect ƒƒMultiplexed with HDMI/DP ports. Supports Hot-Plug detect. Single-channel LVDS interface. 18/24-bit. Up to 1920 x 1200 (60 Hz). One autodetect 10BaseT/100BaseTX/1000BaseT port. Network boot option. Type 10 I/O Interfaces USB 3.0/2.0 ‡ ∆ USB 2.0 ‡ ∆ COM 1 / 2 ∆ GPIO ∆ Audio ∆ PCIe ∆ SMBus ∆ LPC ∆ SPI ∆ I2C ∆ Control ∆ One host port Six host ports Two-wire, CMOS levels. 16C550 compatible. 4 lines multiplexed with the SD card interface High Definition Audio (HDA)/digital audio interface with support for multiple codecs. Three PCIe (Gen 2) lanes 1 MHz 33 MHz Supports alternative BIOS flash device only. Fast mode multi-master I²C Bus Wake, reset, and power Software BIOS Sleep Mode Operating Systems AMI Aptio UEFI BIOS with OEM enhancements. Field reprogrammable. ACPI 3.0. Support for S3 suspend state. Compatible with most x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks 2 GB or 4 GB of soldered-on DDR3L SDRAM. 1333 MT/s. § Represents operation at +25°C and +12V supply running Windows XP with LVDS display, SATA, GbE, COM, and USB keyboard/mouse. Typical power computed as the mean value of Idle and Maximum power specifications. Maximum power measured with 95% CPU utilization. † IEEE 1588 Precision Time Protocol (PTP) compatible ‡ Bootable storage device Tailor COMm-33 to Your Exact Requirements Customization options are available in quantities as low as 100 pieces. ƒƒ Conformal Coating ƒƒ Revision Locks ƒƒ Custom Testing ƒƒ Environmental Screening ƒƒ Custom Labeling ƒƒ Application-Specific Testing ƒƒ BIOS Modifications ƒƒ And more – ∆ Available via Type 10 I/O connector ¤ Extended altitude specifications available upon request ¥ MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this product in general. Testing to higher levels and/or different types of shock or vibration methods can be accommodated per the specific requirements of the application. Contact a VersaLogic Sales Engineer for further information. Specifications are subject to change without notification. Intel and Atom are trademarks of Intel Corp. microSD is a trademark of SD-3C, LLC. Embedded Processing Unit is a trademark of VersaLogic Corp. All other trademarks are the property of their respective owners. ƒƒ Software and Drivers C O R P O R A T I O N VL-COMm-33 Product Data Sheet COM Express Mini CPU Module Ordering Information Model VL-COMm-33EA VL-COMm-33EB VL-COMm-33ED Processor CPU Cores Atom E3815 1 Atom E3827 2 Atom E3845 4 Speed 1.46 GHz 1.75 GHz 1.91 GHz RAM 2 GB 2 GB 4 GB eMMC Flash None 4 GB 8 GB Bay Trail Computer A Complete Embedded Processing Solution – Available Off-the-Shelf! – Accessories Part Number Hardware VL-HDW-410A VL-HDW-410B VL-HDW-406 VL-HDW-411 VL-HDW-405 VL-HDW-408 VL-HDW-401 Description 55 x 84 x 6 mm Heat plate to mount to VL-COMM-33 module. Includes thermal interface material, mounting screws (4), and thermal compound paste (Arctic Silver). 55 x 84 x 6 mm Heat plate that mounts to VL-COMM-33 module. Includes thermal interface material. Does not include thermal paste or mounting screws. 55 x 84 x 15.5 mm Passive heat sink. Mounts to HDW-410 heat plate. 12V Cooling fan for optional use with HDW-406 heat sink. 75 x 84 x 2 mm Mounting adaptor plate, flat. Simplifies installation in many situations. Attaches to HDW-410 heat plate. Heat pipe connector plate. Mounts to HDW-410 heat plate. Thermal compound paste (Arctic Alumina) Call VersaLogic Sales at (503) 747-2261 for more information! Based on the VL-COMm-33, the Hawk is an extremely small and rugged complete embedded computer—available fully assembled and tested off-the-shelf! Roughly the size of a credit card and less than one inch thick, the Hawk is the embedded industry’s smallest, lightest, ultra-rugged embedded x86 computer. This complete embedded computer is designed to withstand extreme temperature, impact, and vibration. CPU Model Processor Cores Speed VL-EPU-3310-EAP Atom E3815 1 1.46 GHz VL-EPU-3310-EBP Atom E3827 2 1.75 GHz VL-EPU-3310-EDP Atom E3845 4 1.91 GHz eMMC Flash None 4 GB 8 GB RAM 2 GB 2 GB 4 GB Cooling Heat plate Heat plate Heat plate Highlights Take the Risk out of Embedded Computing Whether it’s selecting the optimum solution for your application, sharing expertise during development, or on-time delivery of defect-free products, VersaLogic is here to make sure your project goes smoothly from initial concept through the extended life of your program. Contact us today to learn more. ƒƒ A complete x86 embedded computer ƒƒ -40° to +85°C Operating Temperature ƒƒ Extremely small (55 x 84 x 22 mm) ƒƒ Shock & vibration per MIL-STD-202G ƒƒ 4th Generation Intel ® Atom™ processor (“Bay Trail”) - E3845 (quad core) or - E3827 (dual core) or - E3815 (single core) ƒƒ Up to 4GB DDR3L soldered-on RAM ƒƒ Gigabit Ethernet ƒƒ LVDS video output ƒƒ Mini PCIe Socket / with mSATA support ƒƒ USB 2.0 ports ƒƒ Serial I/O ƒƒ SATA ƒƒ Wide Input Voltage Range - 8 to 17 volts ƒƒ Fanless operation For more information, visit: www.versalogic.com/hawk ISO 9001:2008 Certified 7/27/16 12100 SW Tualatin Rd., Tualatin, OR 97062 | (503) 747-2261 | Info@VersaLogic.com | www.VersaLogic.com C O R P O R A T I O N