ORH-W46A-X

PLCC LED Series Datasheet ORH-W46A-J(IF=15mA) 1.Features:  Emitted Color : White.        Lens Appearance : Water Clear. Mono-color type. 1.6x0.8x0.6mm(0603) standard package. Suitable for all SMT assembly methods. Compatible with infrared and vapor phase reflow solder process. Compatible with automatic placement. This product doesn’t contain restriction substance, comply ROHS standard. 2.Applications:     Automotive : Dashboards, stop lamps, turn signals. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. General use. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 3.Package Dimensions: mark cathode mark 0.6 0.8 cathode 0.8 for reflow soldering 0.8 1.6 0.7 0.8 NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ± 0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. 4.Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 120 mW Forward Current IF 30 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol 260℃ - ＊1 Condition for IFp is pulse of 1/10 duty and 0.1msec width. 5.Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=15mA 2.9 3.2 V Luminous Intensity Iv IF=15mA 600 900 mcd Reverse Current IR VR=7V - - 1 μA Chromaticity x IF=15mA - 0.24 0.28 - Coordinates y IF=15mA - 0.23 0.29 - 2θ1/2 IF=15mA - 120 - deg Half of the viewing angle Copyright© 2018 Orient Tech Corporation. All rights Reserved 2 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 6.Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve vs. ambient temperature Fig.1 Relative intensity vs. wavelength 60 50 Fo rw a rd c u rrent (mA) R elat iv e ra dian t in te nsity 1.0 0.5 0 350 400 450 500 550 600 650 700 750 40 30 20 10 800 0 Wavelength (nm) 60 80 100 3.0 2.5 30 20 10 ( N or m aliz ed @20mA) R elativ e Lum inous intensity 40 Fo rw a rd c u rrent (mA) 40 Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 50 0 20 Ambient temperature Ta( C) 2.0 1.5 1.0 0.5 1 2 3 4 0 -40 5 -20 Forward voltage(V) 0 20 40 60 Ambient temperature Ta( C) Fig.5 Relative luminous intensity Fig.6 Radiation diagram vs. forward current 0 2.0 10 20 1.5 R elat iv e ra dian t in te nsity R elat iv e lu mino us int en sity (@20mA) 30 1.0 0.5 1.0 40 0.9 50 0.8 60 70 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Copyright© 2018 Orient Tech Corporation. All rights Reserved 3 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 7.Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=15mA VR=5V IF=15mA Judgement criteria for failure Initial Level*1.1 Over Ux2 Initial Level*0.7 Note: 1).U means the upper limit of specified characteristics. S means initial value. 2).Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. 8.Bin Limits In t e n s i t y Bi n Li m i t s (A t 15 mA ) BI N CO D E Mi n . ( MC D ) Ma x . ( MC D ) Q 600 700 W 700 800 E 800 900 Tol e r a n c e fo r ea c h Bi n li m i t is ± 15 % V F Bi n Li m i t s (A t 15 mA ) BI N CO D E Mi n . ( v ) Ma x . ( v ) S 2.9 3 D 3 3.1 F 3.1 3.2 Tol e r a n c e fo r ea c h Bi n li m i t is ± 0. 0 5 V Co l o r Bi n Li m i t s (A t 15 mA ) BIN 1 2 3 4 5 6 X1 Y1 X2 Y2 X3 Y3 X4 Y4 0.24 0.23 0.2448 0.24 0.2597 0.24 0.2545 0.23 0.2448 0.24 0.2496 0.25 0.2649 0.25 0.2597 0.24 0.2496 0.25 0.2547 0.26 0.27 0.26 0.2649 0.25 0.2547 0.26 0.2595 0.27 0.2753 0.27 0.27 0.26 0.2595 0.27 0.2645 0.28 0.2805 0.28 0.2753 0.27 0.2645 0.28 0.2695 0.29 0.2858 0.29 0.2805 0.28 Copyright© 2018 Orient Tech Corporation. All rights Reserved 4 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 9. BI N ： x x x VF BIN CO DE Co lor BIN CODE Intensity BIN CODE Remarks： Quality standard: to carry out according to Q/SZOR standard factory Copyright© 2018 Orient Tech Corporation. All rights Reserved 5 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 10.apping and packaging specifications(Units: mm) USER DIRECTION OF FEED 13.0∮ 0.5 0.5 ∮ 0.05 1.5!O0.1 4.0∮ 0.1 2.0!O0.05 LEADER 0.3 FIXING TAPE NOTE: 3000 pcs PER REEL 11.Package Method:(unit:mm) Vacuum Copyright© 2018 Orient Tech Corporation. All rights Reserved 179∮ 1 71.0∮ 1 TRAILER 13.0∮ 0.5 8.0∮ 0.3 3.5∮ 0.05 CATHODE 4.0∮ 0.1 1.75∮ 0.05 END 5.3∮ 0.05 START 1.75∮ 0.1 ANODE 0.9 ∮0.05 6 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 12.Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: ORIENT LOGO Part No. Quantity BIN Sealing Date x xx xx xx Year Month Day Manufacture Location Copyright© 2018 Orient Tech Corporation. All rights Reserved 7 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 13.Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750D:1026 MIL-STD-883D:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202F:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-11 Storage Temperature MIL-STD-202F:107D Cycling MIL-STD-750D:1051 MIL-STD-883D:1010 JIS-C-7021 :A-2 Thermal Shock MIL-STD-202F:107D Environmental MIL-STD-750D:1051 Test MIL-STD-883D:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions Result Connect with a power If=15mA Ta=Under room temperature Test time=1,000hrs Ta=+85℃±5℃ RH=90%-95% Test time=240hrs 0/20 0/20 High Ta=+100℃±5℃ Test time=1,000hrs 0/20 Low Ta=-40℃±5℃ Test time=1,000hrs 0/20 -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 30min 5min 30min 5min Test Time=10cycle 0/20 -40℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 14.Soldering : 1). Manual Of Soldering The temperature of the iron tip should not be higher than 300 ℃ (572 ℉ ) and Soldering within 3 seconds per solder-land is to be observed. 2). Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). Copyright© 2018 Orient Tech Corporation. All rights Reserved 8 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 10 SEC. MAX. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3). DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec. 120~150℃ Preheat 120~180 sec. Time 15.Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. 16.Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Copyright© 2018 Orient Tech Corporation. All rights Reserved 9 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-W46A-J 17.Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a....Completed within 168 hours. b....Stored at less than 30% RH. (3) Devices require baking before mounting, if:(2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48hours at 60℃±3℃ Copyright© 2018 Orient Tech Corporation. All rights Reserved 10 Ver, A0