SMD0805B110TF

SMD0805 SERIES Positive Temperature Coefficient (PTC) Data Sheet Description The 0805 series provides miniature surface mount resettable overcurrent protection with holding current from 0.1A to 1.1A. This series is suitable for ultra portable applications where space is at a premium and the device current is low. Features ■ RoHS compliant and lead-free ■ Halogen-free ■ Compact design saves board space ■ Low profile ■ Fast response to fault current ■ Compatible with high temperature solders Applications ■ Mobile phones and PDAs ■ Portable MP3 and media player ■ Mobile internet Device (MID) ■ USB peripherals ■ IC VCC protection ■ Set-top-box and HDMI ■ Game console port protection Agency Approval and Environmental Compliance Agency File Number Regulation Standard UL/CUL E482628 RoHS 2011/65/EU TUV B160696048001 Halogen Free EN 14582:2007 Electrical Characteristics Part Number Ihold (A) Itrip (A) Vmax (Vdc) Imax (A) Pd typ. (W) SMD0805B010TF 0.10 0.30 15 100 SMD0805B020TF 0.20 0.50 9 SMD0805B035TF 0.35 0.75 SMD0805B050TF 0.50 SMD0805B075TF Maximum Time To Trip Resistance Time (Sec.) Current (A) Rmin (Ω) R1max (Ω) 0.5 1.50 0.50 1.000 6.000 100 0.5 0.02 8.00 0.650 3.500 6 100 0.5 0.10 8.00 0.250 1.200 1.00 6 100 0.5 0.10 8.00 0.150 0.850 0.75 1.50 6 40 0.6 0.20 8.00 0.090 0.350 SMD0805B100TFT 1.00 1.95 6 40 0.6 0.30 8.00 0.040 0.230 SMD0805B110TF 1.10 2.00 6 100 0.8 0.30 8.00 0.035 0.210 ： Revision 26-Sep-17 1/7 www.brightking.com SMD0805 SERIES Note on Electrical Characteristics ■ Vocabulary ·I ·I ·V ·I ·P ·R ·R ℃ = Hold current: maximum current device will pass without tripping in 23 still air. still air. trip = Trip current: minimum current at which the device will trip in 23 max = Maximum voltage device can withstand without damage at rated current (Imax) max = Maximum fault current device can withstand without damage at rated voltage (Vmax) still air. d typ. = Typical power dissipated from device when in the tripped state at 23 min = Minimum resistance of device in initial (un-soldered) state. measured one hour after tripping or reflow soldering of 260 1max = Maximum resistance of device at 23 ℃ hold ℃ ℃ ℃ for 20 sec. ■ Value specified is determined by using the PWB with 0.020”*1.5oz copper traces. ■ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. ■ Specifications are subject to change without notice. Polymeric PTC Selecting Guide ■ Determine the following operating parameters for the circuits: ·Normal operating current (I ) ·Maximum interrupt current (I ) ·Maximum circuit voltage (V ) ·Normal operating temperature surrounding device (min℃/max℃) ■ Select the device from factor and dimension suitable for the application ■ Compare the maximum rating for V and I of the PPTC device with the circuit in application and make sure the circuit’s requirement does not exceed the device rating. ■ Check that PPTC device’s trip time (time-to-trip) will protect the circuit. ■ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range. ■ Verify that performance and suitability of the chosen PPTC device in the application. hold max max max max ! WARNING ■ Mechanical Stress ·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. ■ Chemical Pollutants ·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. ■ Electronic and Thermal Effect ·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. · · · · ■ General ·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. ·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. ·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. ·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. ： Revision 26-Sep-17 2/7 www.brightking.com SMD0805 SERIES Thermal Derating Curve Thermal Derating Chart ℃ Recommended Hold Current (A) at Ambient Temperature ( ) Part Number -40 ℃ -20 ℃ 0 ℃ Ambient Operation Temperature 23 ℃ 40 ℃ 50 ℃ 60 ℃ 70 ℃ 85 ℃ SMD0805B010TF 0.14 0.12 0.11 0.10 0.08 0.07 0.06 0.05 0.03 SMD0805B020TF 0.28 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 SMD0805B035TF 0.47 0.44 0.39 0.35 0.30 0.27 0.24 0.20 0.14 SMD0805B050TF 0.68 0.62 0.55 0.50 0.40 0.37 0.33 0.29 0.23 SMD0805B075TF 1.00 0.90 0.79 0.75 0.63 0.57 0.53 0.41 0.34 SMD0805B100TFT 1.35 1.25 1.10 1.00 0.82 0.74 0.65 0.55 0.42 SMD0805B110TF 1.45 1.35 1.20 1.10 0.92 0.84 0.75 0.65 0.52 Average Time-Current Curve ： Revision 26-Sep-17 3/7 www.brightking.com SMD0805 SERIES Soldering Parameters Critical Zone TL to TP tP TP Ramp-up TL tL TS max TS min Ramp-down tS Preheat 25 t 25 ℃ to Peak Time Profile Feature Pb-Free Assembly ℃/second max. Average ramp-up rate (TS max to TP) 3 Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (TS min to TS max) 150 200 60-180 seconds Time maintained above: -Temperature (TL) -Time (tL) 217 60-150 seconds ℃ ℃ ℃ Peak Temperature (TP) Time within 5 260 ℃ of actual Peak Temperature (t ) ℃ 20-40 seconds P Ramp-down Rate 6 ℃ to Peak Temperature Time 25 ℃/second max. 8 minutes max. Storage Condition 0 ℃~35℃, ≤70%RH ·Recommended reflow methods: IR, vapor phase oven, hot air oven, N environment for lead-free ·Recommended maximum paste thickness is 0.25mm (0.010 inch) ·Device can be cleaned using standard industry methods and solvents. 2 Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. ： Revision 26-Sep-17 4/7 www.brightking.com SMD0805 SERIES Physical Dimensions (mm) A B C D E Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD0805B010TF 2.00 2.20 1.20 1.50 0.55 1.00 0.20 0.55 0.05 0.45 SMD0805B020TF 2.00 2.20 1.20 1.50 0.55 1.00 0.20 0.55 0.05 0.45 SMD0805B035TF 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.55 0.05 0.45 SMD0805B050TF 2.00 2.20 1.20 1.50 0.35 1.25 0.20 0.55 0.05 0.45 SMD0805B075TF 2.00 2.20 1.20 1.50 0.75 1.25 0.20 0.55 0.05 0.45 SMD0805B100TFT 2.00 2.20 1.20 1.50 0.50 1.50 0.20 0.55 0.05 0.45 SMD0805B110TF 2.00 2.20 1.20 1.50 0.80 1.50 0.20 0.55 0.05 0.45 Environmental Specifications Operating / Storage temperature -40 Maximum Device Surface Temperature in Tripped State Passive Aging ℃ to +85℃ ℃ +85℃, 1000 hours 125 ±50% typical resistance change ℃ Humidity Aging +85 , 85%R.H. 1000 hours ±50% typical resistance change Thermal Shock MIL-STD-202, Method 107G +85 /-40 20 times -50% typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change Vibration MIL-STD-883C, Method 2007.1, Condition A No change Moisture Level Sensitivity Level 1, J-STD-020C ： Revision 26-Sep-17 ℃ ℃ 5/7 www.brightking.com SMD0805 SERIES Packaging Quantity and Marking Recommended Pad Layout (mm) Part Number Marking Quantity SMD0805B010TF 1 4000 SMD0805B020TF 2 4000 SMD0805B035TF 3 4000 SMD0805B050TF 5 4000 SMD0805B075TF 7 4000 SMD0805B100TFT I 3000 SMD0805B110TF E 3000 ◎ 8mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3) Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3. ： Revision 26-Sep-17 6/7 www.brightking.com SMD0805 SERIES Packaging Tape Dimensions (mm) Reel Symbol B010TF B050TF B020TF B075TF B035TF B100TFT B110TF W 8.00±0.30 8.00±0.30 F 3.50±0.05 3.50±0.05 E 1.75±0.10 1.75±0.10 D0 1.55±0.05 1.55±0.05 D1 1.00(MIN) 1.00±0.10 P0 4.00±0.10 4.00±0.10 P1 4.00±0.10 4.00±0.10 P2 2.00±0.05 2.00±0.05 A0 1.60±0.10 1.65±0.10 B0 2.30±0.10 2.35±0.10 T 0.25±0.10 0.25±0.10 K0 0.90±0.10 1.50±0.10 Leader min. 390 390 Trailer min. 160 160 C Φ178.0±1.0 D Φ60.2±0.5 H 11.0±0.5 W 9.0±1.5 Part Number System ： Revision 26-Sep-17 7/7 www.brightking.com