WSK180N04
N-Ch MOSFET
General Description
Product Summery
The WSK180N04 is the highest performance
trench N-Ch MOSFET with extreme high cell
density , which provide excellent RDSON
and gate charge for most of the
synchronous buck converter applications .
BVDSS
RDSON
ID
40V
3.0mΩ
180A
Applications
The WSK180N04 meet the RoHS and
Green Product requirement , 100%
EAS guaranteed with full function
reliability approved.
z Switching application
z Power Management for Inverter Systems.
Features
TO-263-2L Pin Configuration
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TC=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
40
VGSS
Gate-Source Voltage
±20
Maximum Junction Temperature
175
°C
-55 to 175
°C
TC=25°C
176
A
TC=25°C
6481,2
A
TC=25°C
180
TC=100°C
120
TC=25°C
192
TC=100°C
96
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
V
Mounted on Large Heat Sink
IDM
Pulsed Drain Current *
ID
Continuous Drain Current
PD
Maximum Power Dissipation
RθJC
Thermal Resistance-Junction to Case
0.78
RθJA
Thermal Resistance-Junction to Ambient
62.5
A
W
°C/W
Avalanche Ratings
EAS
NOTE:
Avalanche Energy, Single Pulsed
L=0.5mH
1.091,2
J
1,Repetitive rating ; pulse width limiited by junction temperatur
2,Drain current is limited by junction temperature
www.winsok.tw
Page 1
Rev 1: May.2019
WSK180N04
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
40
-
-
V
-
-
1
-
-
10
Static Characteristics
BVDSS
IDSS
VGS(th)
IGSS
RDS(ON) *
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
VGS=0V, IDS=250µA
VDS=40V, VGS=0V
TJ=85°C
µA
Gate Threshold Voltage
VDS=VGS, IDS=250µA
2.0
3.0
4.0
V
Gate Leakage Current
VGS=±20V, VDS=0V
-
-
±100
nA
Drain-Source On-state Resistance
VGS=10V, IDS=88A
-
3.0
3.6
mΩ
Diode Characteristics
VSD *
Diode Forward Voltage
ISD=88A, VGS=0V
-
0.8
1.2
V
trr
Reverse Recovery Time
ISD=88A, dlSD/
-
27
-
ns
Qrr
Reverse Recovery Charge
dt=100A/µs
-
50
-
nC
VGS=0V,VDS=0V,F=1MHz
-
1.1
-
Ω
-
4426
-
-
1027
-
-
537
-
-
27
-
-
18
-
Dynamic Characteristics
RG
Gate Resistance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
Tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
-
41
-
Turn-off Fall Time
-
53
-
-
121
-
-
28
-
-
34
-
Tf
VGS=0V,
VDS=25V,
Frequency=1.0MHz
VDD=20V, RG=6 Ω,
IDS =88A, VGS=10V ,
pF
ns
Gate Charge Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=32V,
VGS=10V, IDS=88A
nC
Note * : Pulse test ; pulse width ≤300µs, duty cycle≤2%.
www.winsok.tw
Page 2
Rev 1: May.2019
WSK180N04
N-Ch MOSFET
Typical Characteristics
Drain-Source On Resistance
Output Characteristics
400
3.9
VGS= 5.5,6,7,8,9,10V
RDS(ON) - On - Resistance (mW)
350
ID - Drain Current (A)
300
5V
250
200
150
100
4.5V
3.5
VGS=10V
3.0
50
0
0.0
4V
1.0
2.0
3.0
4.0
5.0
2.5
6.0
0
40
VDS - Drain - Source Voltage (V)
80
120
Gate-Source On Resistance
1.6
IDS =250mA
IDS=88A
12
1.4
Normalized Threshold Voltage
RDS(ON) - On - Resistance (mW)
200
Gate Threshold Voltage
14
10
8
6
4
2
0
160
ID - Drain Current (A)
3
4
5
6
7
8
9
1.0
0.8
0.6
0.4
0.2
-50 -25
10
VGS - Gate - Source Voltage (V)
www.winsok.tw
1.2
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
Page 3
Rev 1: May.2019
WSK180N04
N-Ch MOSFET
Typical Characteristics
Drain-Source On Resistance
2.0
200
VGS = 10V
100
IDS = 88A
1.8
1.6
o
IS - Source Current (A)
Normalized On Resistance
Source-Drain Diode Forward
1.4
1.2
1.0
0.8
Tj=175 C
10
o
Tj=25 C
1
0.6
o
RON@Tj=25 C: 3.0mW
0.4
-50 -25
0
25
50
75
0.1
0.0
100 125 150
0.8
1.0
1.2
Capacitance
Gate Charge
VDS= 32V
9
VGS - Gate-source Voltage (V)
9000
7500
6000
Ciss
4500
3000
Coss
1500
16
24
32
7
6
5
4
3
2
0
40
VDS - Drain - Source Voltage (V)
www.winsok.tw
IDS= 88A
8
1
Crss
8
1.4
10
10500
C - Capacitance (pF)
0.6
VSD - Source - Drain Voltage (V)
Frequency=1MHz
0
0.4
Tj - Junction Temperature (°C)
12000
0
0.2
0
25
50
75
100
125
QG - Gate Charge (nC)
Page 4
Rev 1: May.2019
WSK180N04
N-Ch MOSFET
Power Dissipation
Drain Current
275
187
175
ID - Drain Current (A)
Ptot - Power (W)
250
200
150
100
limited by package
150
125
100
75
50
50
25
o
TC=25 C
0
0
o
0
20 40 60 80 100 120 140 160 180 200
TC=25 C,VG=10V
0
20 40 60 80 100 120 140 160 180 200
Tc - Case Temperature (°C)
Tc - Case Temperature (°C)
Safe Operation Area
Lim
it
100
100us
Rd
s(o
n)
ID - Drain Current (A)
1000
10ms
1ms
10
DC
1
0.1
10
1
100
400
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
1
Normalized Effective Transient
Duty = 0.5
0.2
0.1
0.1
0.05
0.01
0.02
0.01
0.001
Single
Mounted on minimum pad
o
RθJA : 62.5 C/W
0.0001
0.0001
0.001
0.1
0.01
1
10
Square Wave Pulse Duration (sec)
www.winsok.tw
Page 5
Rev 1: May.2019
Attention
1,AnyandallWinsokpowerproductsdescribedorcontainedhereindonothavespecificationsthatcanhandle
applicationsthatrequireextremelyhighlevelsofreliability,suchaslifeͲsupportsystems,aircraft'scontrolsystems,or
otherapplicationswhosefailurecanbereasonablyexpectedtoresultinseriousphysicaland/ormaterialdamage.
ConsultwithyourWinsokpowerrepresentativenearestyoubeforeusinganyWinsokpowerproductsdescribedor
containedhereininsuchapplications.
2,Winsokpowerassumesnoresponsibilityforequipmentfailuresthatresultfromusingproductsatvaluesthatexceed,
evenmomentarily,ratedvalues(suchasmaximumratings,operatingconditionranges,orotherparameters)listedin
productsspecificationsofanyandallWinsokpowerproductsdescribedorcontainedherein.
3,SpecificationsofanyandallWinsokpowerproductsdescribedorcontainedhereinstipulatetheperformance,
characteristics,andfunctionsofthedescribedproductsintheindependentstate,andarenotguaranteesofthe
performance,characteristics,andfunctionsofthedescribedproductsasmountedinthecustomer’sproductsor
equipment.Toverifysymptomsandstatesthatcannotbeevaluatedinanindependentdevice,thecustomershouldalways
evaluateandtestdevicesmountedinthecustomer’sproductsorequipment.
4,WinsokpowerSemiconductorCO.,LTD.strivestosupplyhighͲqualityhighͲreliabilityproducts.However,anyandall
semiconductorproductsfailwithsomeprobability.Itispossiblethattheseprobabilisticfailurescouldgiverisetoaccidents
oreventsthatcouldendangerhumanlivesthatcouldgiverisetosmokeorfire,orthatcouldcausedamagetoother
property.Whendesigningequipment,adoptsafetymeasuressothatthesekindsofaccidentsoreventscannotoccur.Such
measuresincludebutarenotlimitedtoprotectivecircuitsanderrorpreventioncircuitsforsafedesign,redundantdesign,
andstructuraldesign.
5,IntheeventthatanyorallWinsokpowerproducts(includingtechnicaldata,services)describedorcontainedhereinare
controlledunderanyofapplicablelocalexportcontrollawsandregulations,suchproductsmustnotbeexportedwithout
obtainingtheexportlicensefromtheauthoritiesconcernedinaccordancewiththeabovelaw.
6,Nopartofthispublicationmaybereproducedortransmittedinanyformorbyanymeans,electronicormechanical,
includingphotocopyingandrecording,oranyinformationstorageorretrievalsystem,orotherwise,withouttheprior
writtenpermissionofWinsokpowerSemiconductorCO.,LTD.
7,Information(includingcircuitdiagramsandcircuitparameters)hereinisforexampleonly;itisnotguaranteedfor
volumeproduction. Winsokpowerbelievesinformationhereinisaccurateandreliable,butnoguaranteesaremadeor
impliedregardingitsuseoranyinfringementsofintellectualpropertyrightsorotherrightsofthirdparties.
8,Anyandallinformationdescribedorcontainedhereinaresubjecttochangewithoutnoticeduetoproduct/technology
improvement,etc.Whendesigningequipment,refertothe"DeliverySpecification"fortheWinsokpowerproductthatyou
Intendtouse.
9,thiscatalogprovidesinformationasofSep.2014. Specificationsandinformationhereinaresubjecttochangewithout
notice.