74LVC2G66GM

74LVC2G66 Bilateral switch Rev. 8 — 2 April 2013 Product data sheet 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals (nY and nZ) and an active HIGH enable input (nE). When nE is LOW, the analog switch is turned off. Schmitt trigger action at the enable inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 1.65 V to 5.5 V. 2. Features and benefits  Wide supply voltage range from 1.65 V to 5.5 V  Very low ON resistance:  7.5  (typical) at VCC = 2.7 V  6.5  (typical) at VCC = 3.3 V  6  (typical) at VCC = 5 V  Switch current capability of 32 mA  High noise immunity  CMOS low power consumption  TTL interface compatibility at 3.3 V  Latch-up performance meets requirements of JESD78 Class I  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  Enable input accepts voltages up to 5.5 V  Multiple package options  Specified from 40 C to +85 C and 40 C to +125 C 74LVC2G66 NXP Semiconductors Bilateral switch 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC2G66DP 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC2G66DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74LVC2G66GT 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 1  1.95  0.5 mm SOT833-1 74LVC2G66GD 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 3  2  0.5 mm SOT996-2 74LVC2G66GM 40 C to +125 C XQFN8 plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6  1.6  0.5 mm SOT902-2 4. Marking Table 2. Marking codes Type number Marking code[1] 74LVC2G66DP V66 74LVC2G66DC V66 74LVC2G66GT V66 74LVC2G66GD V66 74LVC2G66GM V66 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 1 # 1 X1 1 # 1 X1 001aah808 001aah807 Fig 1. Logic symbol 74LVC2G66 Product data sheet Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 2 of 26 74LVC2G66 NXP Semiconductors Bilateral switch nZ nY nE VCC Fig 3. mna658 Logic diagram (one switch) 6. Pinning information 6.1 Pinning 74LVC2G66 1Y 1 8 VCC 1Z 2 7 1E 2E 3 6 2Z GND 4 5 2Y 74LVC2G66 1Y 1 8 VCC 1Z 2 7 1E 2E 3 6 2Z GND 4 5 2Y 001aaf567 Transparent top view 001aaa529 Fig 4. Pin configuration SOT505-2 and SOT765-1 Fig 5. Pin configuration SOT833-1 74LVC2G66 1 8 VCC 1Z 2 7 1E 2E 3 6 2Z GND 4 5 2Y 2Z 2Y 001aai248 Pin configuration SOT996-2 74LVC2G66 Product data sheet 7 1Y 2 6 1Z 3 5 2E 001aaf568 Transparent top view Transparent top view Fig 6. 8 1 GND 1Y 1E 4 74LVC2G66 VCC terminal 1 index area Fig 7. Pin configuration SOT902-2 All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 3 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 6.2 Pin description Table 3. Symbol Pin description Pin Description SOT505-2, SOT765-1, SOT996-2 and SOT833-1 SOT902-2 1Y 1 7 independent input or output 1Z 2 6 independent input or output 2E 3 5 enable input (active HIGH) GND 4 4 ground (0 V) 2Y 5 3 independent input or output 2Z 6 2 independent input or output 1E 7 1 enable input (active HIGH) VCC 8 8 supply voltage 7. Functional description Table 4. Function table[1] Input nE Switch L OFF-state H ON-state [1] H = HIGH voltage level; L = LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions [1] VI input voltage IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V ISK switch clamping current VI < 0.5 V or VI > VCC + 0.5 V [2] Min Max Unit 0.5 +6.5 V 0.5 +6.5 V 50 - mA - 50 mA 0.5 VCC + 0.5 V - 50 mA VSW switch voltage enable and disable mode ISW switch current VSW > 0.5 V or VSW < VCC + 0.5 V ICC supply current - 100 mA IGND ground current 100 - mA Tstg storage temperature Ptot total power dissipation Tamb = 40 C to +125 C [3] 65 +150 C - 250 mW [1] The minimum input voltage rating may be exceeded if the input current rating is observed. [2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed. [3] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K. For XSON8 and XQFN8 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 4 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter Conditions VCC supply voltage VI input voltage VSW switch voltage Tamb ambient temperature t/V Min Max Unit 1.65 5.5 V 0 5.5 V 0 VCC V 40 +125 C VCC = 1.65 V to 2.7 V [3] - 20 ns/V VCC = 2.7 V to 5.5 V [3] - 10 ns/V [1][2] input transition rise and fall rate [1] To avoid sinking GND current from terminal nZ when switch current flows in terminal nY, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal nZ, no GND current will flow from terminal nY. In this case, there is no limit for the voltage drop across the switch. [2] For overvoltage tolerant switch voltage capability, refer to 74LVCV2G66. [3] Applies to control signal levels. 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH VIL HIGH-level input voltage LOW-level input voltage 40 C to +85 C Conditions VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 40 C to +125 C Unit Min Typ[1] Max Min Max 0.65  VCC - - 0.65  VCC - V 1.7 - - 1.7 - V VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V VCC = 4.5 V to 5.5 V 0.7  VCC - - 0.7  VCC - V VCC = 1.65 V to 1.95 V - - 0.35  VCC - VCC = 2.3 V to 2.7 V - - 0.7 - VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3  VCC - 0.3  VCC V 0.35  VCC V 0.7 V II input leakage current pin nE; VI = 5.5 V or GND; VCC = 0 V to 5.5 V [2] - 0.1 5 - 100 A IS(OFF) OFF-state leakage current VCC = 5.5 V; see Figure 8 [2] - 0.1 5 - 200 A IS(ON) ON-state leakage current VCC = 5.5 V; see Figure 9 [2] - 0.1 5 - 200 A ICC supply current VI = 5.5 V or GND; VSW = GND or VCC; VCC = 1.65 V to 5.5 V [2] - 0.1 10 - 200 A ICC additional supply current pin nE; VI = VCC  0.6 V; VSW = GND or VCC; VCC = 5.5 V [2] - 5 500 - 5000 A 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 5 of 26 74LVC2G66 NXP Semiconductors Bilateral switch Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 40 C to +85 C Conditions 40 C to +125 C Min Typ[1] Max Min Max Unit CI input capacitance - 2.0 - - - pF CS(OFF) OFF-state capacitance - 5.0 - - - pF CS(ON) ON-state capacitance - 9.5 - - - pF [1] All typical values are measured at Tamb = 25 C. [2] These typical values are measured at VCC = 3.3 V. 10.1 Test circuits VCC VCC nE VIL nZ VI nE VIH nY IS GND IS VI VO 001aag488 Product data sheet GND VO VI = VCC or GND and VO = open circuit. Test circuit for measuring OFF-state leakage current 74LVC2G66 nY 001aag489 VI = VCC or GND and VO = GND or VCC. Fig 8. nZ Fig 9. Test circuit for measuring ON-state leakage current All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 6 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 10.2 ON resistance Table 8. ON resistance At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 11 to Figure 16. Symbol Parameter RON(peak) ON resistance (peak) RON(rail) ON resistance (rail) 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ[1] Max Min Max ISW = 4 mA; VCC = 1.65 V to 1.95 V - 34.0 130 - 195  ISW = 8 mA; VCC = 2.3 V to 2.7 V - 12.0 30 - 45  VI = GND to VCC; see Figure 10 ISW = 12 mA; VCC = 2.7 V - 10.4 25 - 38  ISW = 24 mA; VCC = 3.0 V to 3.6 V - 7.8 20 - 30  ISW = 32 mA; VCC = 4.5 V to 5.5 V - 6.2 15 - 23  ISW = 4 mA; VCC = 1.65 V to 1.95 V - 8.2 18 - 27  ISW = 8 mA; VCC = 2.3 V to 2.7 V - 7.1 16 - 24  ISW = 12 mA; VCC = 2.7 V - 6.9 14 - 21  ISW = 24 mA; VCC = 3.0 V to 3.6 V - 6.5 12 - 18  ISW = 32 mA; VCC = 4.5 V to 5.5 V - 5.8 10 - 15  ISW = 4 mA; VCC = 1.65 V to 1.95 V - 10.4 30 - 45  ISW = 8 mA; VCC = 2.3 V to 2.7 V - 7.6 20 - 30  ISW = 12 mA; VCC = 2.7 V - 7.0 18 - 27  ISW = 24 mA; VCC = 3.0 V to 3.6 V - 6.1 15 - 23  - 4.9 10 - 15  ISW = 4 mA; VCC = 1.65 V to 1.95 V - 26.0 - - -  VI = GND; see Figure 10 VI = VCC; see Figure 10 ISW = 32 mA; VCC = 4.5 V to 5.5 V RON(flat) ON resistance (flatness) [2] VI = GND to VCC ISW = 8 mA; VCC = 2.3 V to 2.7 V - 5.0 - - -  ISW = 12 mA; VCC = 2.7 V - 3.5 - - -  ISW = 24 mA; VCC = 3.0 V to 3.6 V - 2.0 - - -  ISW = 32 mA; VCC = 4.5 V to 5.5 V - 1.5 - - -  [1] Typical values are measured at Tamb = 25 C and nominal VCC. [2] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature. 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 7 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 10.3 ON resistance test circuit and graphs mna673 40 RON (Ω) 30 VSW (1) 20 VCC nE VIH (2) (3) nY 10 nZ (4) GND VI (5) ISW 0 0 1 2 3 4 5 VI (V) 001aag490 RON = VSW/ISW. (1) VCC = 1.8 V. (2) VCC = 2.5 V. (3) VCC = 2.7 V. (4) VCC = 3.3 V. (5) VCC = 5.0 V. Fig 10. Test circuit for measuring ON resistance 001aaa712 55 Fig 11. Typical ON resistance as a function of input voltage; Tamb = 25 C 001aaa708 15 RON (Ω) RON (Ω) 45 13 35 11 (4) (3) (2) (1) (1) (2) 25 9 (3) (4) 15 7 5 5 0 0.4 0.8 1.2 1.6 2.0 0 0.5 VI (V) (1) Tamb = 125 C. (2) Tamb = 85 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (3) Tamb = 25 C. (4) Tamb = 40 C. (4) Tamb = 40 C. Fig 12. ON resistance as a function of input voltage; VCC = 1.8 V Product data sheet 1.5 2.0 2.5 VI (V) (1) Tamb = 125 C. 74LVC2G66 1.0 Fig 13. ON resistance as a function of input voltage; VCC = 2.5 V All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 8 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 001aaa709 13 001aaa710 10 RON (Ω) RON (Ω) 11 8 (1) (1) 9 (2) (2) 6 (3) (3) 7 (4) (4) 5 4 0 0.5 1.0 1.5 2.0 2.5 3.0 VI (V) 0 1 2 3 4 VI (V) (1) Tamb = 125 C. (1) Tamb = 125 C. (2) Tamb = 85 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (3) Tamb = 25 C. (4) Tamb = 40 C. (4) Tamb = 40 C. Fig 14. ON resistance as a function of input voltage; VCC = 2.7 V Fig 15. ON resistance as a function of input voltage; VCC = 3.3 V 001aaa711 7 RON (Ω) 6 5 (1) (2) (3) 4 (4) 3 0 1 2 3 4 5 VI (V) (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = 40 C. Fig 16. ON resistance as a function of input voltage; VCC = 5.0 V 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 9 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 11. Dynamic characteristics Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 19. Symbol Parameter 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V - 0.8 2.0 - 3.0 ns VCC = 2.3 V to 2.7 V - 0.4 1.2 - 2.0 ns VCC = 2.7 V - 0.4 1.0 - 1.5 ns VCC = 3.0 V to 3.6 V - 0.3 0.8 - 1.5 ns - 0.2 0.6 - 1.0 ns VCC = 1.65 V to 1.95 V 1.0 4.6 10 1.0 13.0 ns VCC = 2.3 V to 2.7 V 1.0 2.7 5.6 1.0 7.5 ns VCC = 2.7 V 1.0 2.7 5.0 1.0 6.5 ns VCC = 3.0 V to 3.6 V 1.0 2.4 4.4 1.0 6.0 ns VCC = 4.5 V to 5.5 V 1.0 1.8 3.9 1.0 5.0 ns VCC = 4.5 V to 5.5 V enable time ten disable time tdis [4] nE to nY or nZ; see Figure 18 [5] nE to nY or nZ; see Figure 18 VCC = 1.65 V to 1.95 V 1.0 3.8 9.0 1.0 11.5 ns VCC = 2.3 V to 2.7 V 1.0 2.1 5.5 1.0 7.0 ns VCC = 2.7 V 1.0 3.5 6.5 1.0 8.5 ns VCC = 3.0 V to 3.6 V 1.0 3.0 6.0 1.0 8.0 ns 1.0 2.2 5.0 1.0 6.5 ns VCC = 2.5 V - 9.0 - - - pF VCC = 3.3 V - 11.0 - - - pF VCC = 5.0 V - 15.7 - - - pF VCC = 4.5 V to 5.5 V power dissipation capacitance CPD Unit [2][3] propagation delay nY to nZ or nZ to nY; see Figure 17 tpd 40 C to +125 C Typ[1] CL = 50 pF; fi = 10 MHz; VI = GND to VCC [1] Typical values are measured at Tamb = 25 C and nominal VCC. [6] [2] tpd is the same as tPLH and tPHL. [3] Propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified capacitance when driven by an ideal voltage source (zero output impedance). [4] ten is the same as tPZH and tPZL. [5] tdis is the same as tPLZ and tPHZ. [6] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi  N + {(CL + CS(ON)) VCC2  fo} where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; CS(ON) = maximum ON-state switch capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 10 of 26 74LVC2G66 NXP Semiconductors Bilateral switch {(CL + CS(ON)) VCC2  fo} = sum of the outputs. 11.1 Waveforms and test circuit VI nY or nZ input VM VM GND t PLH t PHL VOH nZ or nY output VM VM VOL 001aaa541 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 17. Input (nY or nZ) to output (nZ or nY) propagation delays VI nE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW nY or nZ VM VX VOL t PZH t PHZ nY or nZ output HIGH-to-OFF OFF-to-HIGH VOH VY VM GND switch enabled switch disabled switch enabled 001aaa542 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 18. Enable and disable times Table 10. Measurement points Supply voltage Input Output VCC VM VM VX VY 1.65 V to 1.95 V 0.5  VCC 0.5  VCC VOL + 0.15 V VOH  0.15 V 2.3 V to 2.7 V 0.5  VCC 0.5  VCC VOL + 0.15 V VOH  0.15 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOH  0.3 V 3.0 V to 3.6 V 1.5 V 1.5 V VOL + 0.3 V VOH  0.3 V 4.5 V to 5.5 V 0.5  VCC 0.5  VCC VOL + 0.3 V VOH  0.3 V 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 11 of 26 74LVC2G66 NXP Semiconductors Bilateral switch tW VI 90 % negative pulse VM VM 10 % 0V tf tr tr tf VI 90 % positive pulse VM VM 10 % 0V tW VEXT VCC PULSE GENERATOR VI RL VO DUT RT CL RL 001aae235 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = Test voltage for switching times. Fig 19. Test circuit for measuring switching times Table 11. Test data Supply voltage Input VCC VI tr, tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 1.65 V to 1.95 V VCC  2.0 ns 30 pF 1 k open GND 2  VCC 2.3 V to 2.7 V VCC  2.0 ns 30 pF 500  open GND 2  VCC 2.7 V 2.7 V  2.5 ns 50 pF 500  open GND 6V 3.0 V to 3.6 V 2.7 V  2.5 ns 50 pF 500  open GND 6V 4.5 V to 5.5 V VCC  2.5 ns 50 pF 500  open GND 2  VCC 74LVC2G66 Product data sheet Load VEXT All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 12 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 11.2 Additional dynamic characteristics Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C. Symbol Parameter Conditions THD RL = 10 k; CL = 50 pF; fi = 1 kHz; see Figure 20 total harmonic distortion Min Typ Max Unit VCC = 1.65 V - 0.032 - % VCC = 2.3 V - 0.008 - % VCC = 3.0 V - 0.006 - % VCC = 4.5 V - 0.005 - % VCC = 1.65 V - 0.068 - % VCC = 2.3 V - 0.009 - % VCC = 3.0 V - 0.008 - % VCC = 4.5 V - 0.006 - % VCC = 1.65 V - 135 - MHz VCC = 2.3 V - 145 - MHz VCC = 3.0 V - 150 - MHz VCC = 4.5 V - 155 - MHz VCC = 1.65 V - 200 - MHz VCC = 2.3 V - 350 - MHz VCC = 3.0 V - 410 - MHz VCC = 4.5 V - 440 - MHz RL = 10 k; CL = 50 pF; fi = 10 kHz; see Figure 20 f(3dB) 3 dB frequency response RL = 600 ; CL = 50 pF; see Figure 21 RL = 50 ; CL = 10 pF; see Figure 21 RL = 50 ; CL = 5 pF; see Figure 21 iso isolation (OFF-state) VCC = 1.65 V - > 500 - MHz VCC = 2.3 V - > 500 - MHz VCC = 3.0 V - > 500 - MHz VCC = 4.5 V - > 500 - MHz VCC = 1.65 V - 46 - dB VCC = 2.3 V - 46 - dB VCC = 3.0 V - 46 - dB VCC = 4.5 V - 46 - dB VCC = 1.65 V - 37 - dB VCC = 2.3 V - 37 - dB VCC = 3.0 V - 37 - dB VCC = 4.5 V - 37 - dB RL = 600 ; CL = 50 pF; fi = 1 MHz; see Figure 22 RL = 50 ; CL = 5 pF; fi = 1 MHz; see Figure 22 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 13 of 26 74LVC2G66 NXP Semiconductors Bilateral switch Table 12. Additional dynamic characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C. Symbol Parameter Conditions Vct between digital inputs and switch; RL = 600 ; CL = 50 pF; fi = 1 MHz; tr = tf = 2 ns; see Figure 23 Xtalk crosstalk voltage crosstalk Min Typ Max Unit VCC = 1.65 V - - - mV VCC = 2.3 V - 91 - mV VCC = 3.0 V - 119 - mV VCC = 4.5 V - 205 - mV VCC = 1.65 V - - - dB VCC = 2.3 V - 56 - dB VCC = 3 V - 56 - dB VCC = 4.5 V - 56 - dB between switches; RL = 600 ; CL = 50 pF; fi = 1 MHz; see Figure 24 between switches; RL = 50 ; CL = 5 pF; fi = 1 MHz; see Figure 24 Qinj charge injection 74LVC2G66 Product data sheet VCC = 1.65 V - - - dB VCC = 2.3 V - 29 - dB VCC = 3 V - 28 - dB VCC = 4.5 V - 28 - dB VCC = 1.8 V - 3.3 - pC VCC = 2.5 V - 4.1 - pC VCC = 3.3 V - 5.0 - pC VCC = 4.5 V - 6.4 - pC VCC = 5.5 V - 7.5 - pC CL = 0.1 nF; Vgen = 0 V; Rgen = 0 ; fi = 1 MHz; RL = 1 M; see Figure 25 All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 14 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 11.3 Test circuits VCC 0.5VCC nE VIH RL nY/nZ 10 μF nZ/nY VO 600 Ω fi D CL 001aag492 Test conditions: VCC = 1.65 V: Vi = 1.4 V (p-p). VCC = 2.3 V: Vi = 2 V (p-p). VCC = 3 V: Vi = 2.5 V (p-p). VCC = 4.5 V: Vi = 4 V (p-p). Fig 20. Test circuit for measuring total harmonic distortion VCC nE VIH 0.1 μF fi 0.5VCC RL nY/nZ nZ/nY VO 50 Ω CL dB 001aag491 Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads 3 dB. Fig 21. Test circuit for measuring the frequency response when switch is in ON-state 0.5VCC VCC RL VIL 0.1 μF fi 0.5VCC nE nY/nZ RL nZ/nY 50 Ω VO CL dB 001aag493 Adjust fi voltage to obtain 0 dBm level at input. Fig 22. Test circuit for measuring isolation (OFF-state) 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 15 of 26 74LVC2G66 NXP Semiconductors Bilateral switch VCC nE nY/nZ G logic input 50 Ω nZ/nY 600 Ω VO RL 0.5VCC CL 0.5VCC 001aag494 Fig 23. Test circuit for measuring crosstalk voltage (between digital inputs and switch) 0.5VCC 1E VIH 0.1 μF Ri 1Y or 1Z 600 Ω fi RL 1Z or 1Y CHANNEL ON 50 Ω CL 50 pF VO1 0.5VCC 2E VIL RL 2Y or 2Z 2Z or 2Y CHANNEL OFF Ri 600 Ω CL 50 pF VO2 001aag496 20 log10 (VO2 / VO1) or 20 log10 (VO1 / VO2). Fig 24. Test circuit for measuring crosstalk between switches 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 16 of 26 74LVC2G66 NXP Semiconductors Bilateral switch VCC nE Rgen G logic input nY/nZ nZ/nY VO RL 1 MΩ Vgen CL 0.1 nF 001aag495 a. Test circuit logic input (nE) off on off ΔVO VO mna675 b. Input and output pulse definitions Qinj = VO  CL. VO = output voltage variation. Rgen = generator resistance. Vgen = generator voltage. Fig 25. Test circuit for measuring charge injection 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 17 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 12. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 26. Package outline SOT505-2 (TSSOP8) 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 18 of 26 74LVC2G66 NXP Semiconductors Bilateral switch VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 27. Package outline SOT765-1 (VSSOP8) 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 19 of 26 74LVC2G66 NXP Semiconductors Bilateral switch XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 28. Package outline SOT833-1 (XSON8) 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 20 of 26 74LVC2G66 NXP Semiconductors Bilateral switch XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit(1) mm max nom min A A1 b 0.05 0.35 D E 2.1 3.1 0.5 0.00 0.15 1.9 e e1 0.5 1.5 2.9 L L1 L2 0.5 0.15 0.6 0.3 0.05 0.4 v 0.1 w y 0.05 0.05 y1 0.1 sot996-2_po Outline version References IEC JEDEC JEITA European projection Issue date 07-12-21 12-11-20 SOT996-2 Fig 29. Package outline SOT996-2 (XSON8) 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 21 of 26 74LVC2G66 NXP Semiconductors Bilateral switch XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT902-2 X A B D terminal 1 index area E A A1 detail X e v w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L metal area not for soldering L1 0 1 Dimensions Unit(1) mm max nom min 2 mm scale A 0.5 A1 b D E e e1 0.05 0.25 1.65 1.65 0.20 1.60 1.60 0.55 0.00 0.15 1.55 1.55 0.5 L L1 v 0.35 0.15 0.30 0.10 0.25 0.05 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT902-2 --- MO-255 --- sot902-2_po European projection Issue date 10-11-02 11-03-31 Fig 30. Package outline SOT902-2 (XQFN8) 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 22 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 13. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor TTL Transistor-Transistor Logic HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model DUT Device Under Test 14. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC2G66 v.8 20130402 Product data sheet - 74LVC2G66 v.7 Modifications: 74LVC2G66 v.7 Modifications: 74LVC2G66 v.6 Modifications: • For type number 74LVC2G66GD XSON8U has changed to XSON8. 20120622 • - 74LVC2G66 v.6 For type number 74LVC2G66GM the SOT code has changed to SOT902-2. 20111129 • Product data sheet Product data sheet - 74LVC2G66 v.5 Legal pages updated. 74LVC2G66 v.5 20100616 Product data sheet - 74LVC2G66 v.4 74LVC2G66 v.4 20080701 Product data sheet - 74LVC2G66 v.3 74LVC2G66 v.3 20080310 Product data sheet - 74LVC2G66 v.2 74LVC2G66 v.2 20070828 Product data sheet - 74LVC2G66 v.1 74LVC2G66 v.1 20040629 Product data sheet - - 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 23 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74LVC2G66 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 24 of 26 74LVC2G66 NXP Semiconductors Bilateral switch Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74LVC2G66 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 April 2013 © NXP B.V. 2013. All rights reserved. 25 of 26 74LVC2G66 NXP Semiconductors Bilateral switch 17. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 10.1 10.2 10.3 11 11.1 11.2 11.3 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ON resistance test circuit and graphs. . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms and test circuit . . . . . . . . . . . . . . . 11 Additional dynamic characteristics . . . . . . . . . 13 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 April 2013 Document identifier: 74LVC2G66