SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988
Copyright 1988, Texas Instruments Incorporated
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
76017012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
-55 to 125
76017012A
SNJ54LS
253FK
7601701EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Call TI
-55 to 125
7601701EA
SNJ54LS253J
7601701EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Call TI
-55 to 125
7601701EA
SNJ54LS253J
7601701FA
NRND
CFP
W
16
1
TBD
Call TI
Call TI
-55 to 125
7601701FA
SNJ54LS253W
7601701FA
NRND
CFP
W
16
1
TBD
Call TI
Call TI
-55 to 125
7601701FA
SNJ54LS253W
JM38510/30908B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30908B2A
JM38510/30908B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30908B2A
JM38510/30908BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BEA
JM38510/30908BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BEA
JM38510/30908BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BFA
JM38510/30908BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BFA
M38510/30908B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30908B2A
M38510/30908B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30908B2A
M38510/30908BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BEA
M38510/30908BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BEA
M38510/30908BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30908BFA
M38510/30908BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
30908BFA
SN54LS253J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS253J
SN54LS253J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS253J
SN74LS253D
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
LS253
SN74LS253D
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
LS253
SN74LS253DE4
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
LS253
SN74LS253DE4
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
LS253
SN74LS253DG4
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
LS253
SN74LS253DG4
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
LS253
SN74LS253DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS253
SN74LS253DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS253
SN74LS253DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS253
SN74LS253DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS253
SN74LS253DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS253
SN74LS253DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS253
SN74LS253J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
0 to 70
SN74LS253J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
0 to 70
SN74LS253N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS253N
SN74LS253N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS253N
SN74LS253N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74LS253N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74LS253NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS253N
SN74LS253NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS253N
SN74LS253NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS253
SN74LS253NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS253
SN74LS253NSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS253
SN74LS253NSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS253
SN74LS253NSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS253
SN74LS253NSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS253
SN74S253N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74S253N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SNJ54LS253FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
76017012A
SNJ54LS
253FK
SNJ54LS253FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
76017012A
SNJ54LS
253FK
SNJ54LS253J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601701EA
SNJ54LS253J
SNJ54LS253J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601701EA
SNJ54LS253J
SNJ54LS253W
NRND
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601701FA
SNJ54LS253W
SNJ54LS253W
NRND
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601701FA
SNJ54LS253W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS253, SN74LS253 :
• Catalog: SN74LS253
• Military: SN54LS253
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS253DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LS253NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS253DR
SN74LS253NSR
SOIC
D
16
2500
333.2
345.9
28.6
SO
NS
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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