CSD01060E-TR

CSD01060 VRRM = Silicon Carbide Schottky Diode Zero R Features • • • • • • • IF (TC=135˚C) = 2 A Rectifier ecovery® 600 V Qc = 3.3 nC Package 600-Volt Schottky Rectifier Zero Reverse Recovery Current Zero Forward Recovery Voltage High-Frequency Operation Temperature-Independent Switching Behavior Extremely Fast Switching Positive Temperature Coefficient on VF TO-252-2 TO-220-2 Benefits • • • • • PIN 1 Replace Bipolar with Unipolar Rectifiers Essentially No Switching Losses Higher Efficiency Reduction of Rectifier Heat Sink Parallel Devices Without Thermal Runaway CASE PIN 2 Applications • • • Switch Mode Power Supplies Power Factor Correction - Typical PFC Pout : 100W-200W Motor Drives - Typical Power : 0.25HP-0.5HP Part Number Package Marking CSD01060A TO-220-2 CSD01060 CSD01060E TO-252-2 CSD01060 Maximum Ratings (TC = 25 ˚C unless otherwise specified) Symbol Parameter Unit Test Conditions VRRM Repetitive Peak Reverse Voltage 600 V VRSM Surge Peak Reverse Voltage 600 V VDC DC Blocking Voltage 600 V 4 2 1 A TC=25˚C TC=135˚C TC=158˚C 7 5.5 A TC=25˚C, tP=10 ms, Half Sine Wave TC=125˚C, tP=10 ms, Half Sine Wave IF Continuous Forward Current IFRM Repetitive Peak Forward Surge Current IFSM Non-Repetitive Peak Forward Surge Current 9 A TC=25˚C, tP=1.5 ms, Half Sine Wave IFSM Non-Repetitive Peak Forward Surge Current 32 A TC=25˚C, tP=10 µs, Pulse Ptot Power Dissipation 21.4 7.1 W TC=25˚C TC=125˚C -55 to +175 ˚C 1 8.8 Nm lbf-in TJ , Tstg Operating Junction and Storage Temperature TO-220 Mounting Torque 1 Value CSD01060 Rev. P M3 Screw 6-32 Screw Note Electrical Characteristics Symbol Parameter Typ. Max. Unit Test Conditions VF Forward Voltage 1.6 2.0 1.8 2.4 V IF = 1 A TJ=25°C IF = 1 A TJ=175°C IR Reverse Current 20 40 100 500 μA VR = 600 V TJ=25°C VR = 600 V TJ=150°C QC Total Capacitive Charge 3.3 nC VR = 600 V, IF = 1 A di/dt = 500 A/μs TJ = 25°C C Total Capacitance 80 11 8.5 pF VR = 0 V, TJ = 25°C, f = 1 MHz VR = 200 V, TJ = 25˚C, f = 1 MHz VR = 400 V, TJ = 25˚C, f = 1 MHz Note Note: 1. This is a majority carrier diode, so there is no reverse recovery charge. Thermal Characteristics Symbol Parameter RθJC Thermal Resistance from Junction to Case RθJA Thermal Resistance from Junction to Ambient Typ. Unit 7 °C/W 60 ˚C/W Typical Performance 2.0 IF Forward Current (A) 1.4 25°C 50°C 100°C 150°C TTJ = =25°C 200°C 40 40 40 J TJ = 100°C TJ = 200°C IR Reverse Current (µA) 1.6 TJ = TJ = TJ = TJ = TJ 25 ° C TJ = 25°C TJ 100 ° C TJ = 100°C TJ 200 ° C IR Reverse Current (μA) IR Reverse Current (µA) 1.8 50 50 50 1.2 1.0 0.8 0.6 30 30 30 20 20 20 10 10 10 0.4 0.2 00 0.0 0.0 0.5 1.0 1.5 2.0 2.5 VF Forward Voltage (V) Figure 1. Forward Characteristics 2 CSD01060 Rev. P 3.0 3.5 0 0 0 200 400 600 800 200 400 600 800 200 400 600 800 VR Reverse Voltage (V) Voltage (V) VR Reverse VR Reverse Voltage (V) Figure 2. Reverse Characteristics 1000 1000 1000 Current Derating Typical Performance 15.00 50 50 14 45 45 40 40 9.00 8 10% 30% 50% 70% DC 6.00 6 Duty* Duty* Duty* Duty* 4 3.00 35 35 C Capacitance (pF) 10 C Capacitance (pF) Peak Forward Forward Current Current (A) IF(PEAK) Peak 12.00 12 30 30 25 25 20 20 15 15 10 10 2 55 0.00 0 25 25 DC 50 50 70% Duty 75 100 125 150 75 100 125 150 TC Case Temperature (°C) Case Temperature * Frequency > 1KHz 50% Duty 30% Duty 175 175 00 200 200 11 10 10 100 100 1000 1000 VRVReverse Voltage (V) R Reverse Voltage (V) 10% Duty Figure 3. Current Derating Figure 4. Capacitance vs. Reverse Voltage 1.0E+01 Zth (°C/W) 1.0E+00 1.0E-01 1.0E-02 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 Tim e (s) Figure 5. Transient Thermal Impedance 3 CSD01060 Rev. P 1.E-02 1.E-01 1.E+00 Typical Performance 30 30.000 Power Dissipation (W) 25 25.000 20.000 20 15.000 15 10.000 10 5.0005 0.0000 25 25 50 50 75 75 100 100 125 125 150 150 175 175 TC Case Temperature (°C) Figure 6. Power Derating Diode Model Diode Model CSD01060 Vf T = VT + If*RT VT= 0.94 + (Tj * -1.2*10-3) RT= 0.015 + (Tj * 6.4*10-3) Note: Tj = Diode Junction Temperature In Degrees Celsius VT 4 CSD01060 Rev. P RT Package Dimensions Package TO-220-2 Inches POS A B A F J C P B D X S E Y 1 2 G T Z U L M W N PIN 1 CASE PIN 2 Max .381 .410 9.677 10.414 E B .235 5.969 .590 .255 .615 6.477 14.986 15.621 F C D G E H F .102 .143 .337 1.105 .590 .500 .149 2.845 3.632 8.560 28.067 15.494 12.700 3.886 29.134 J G 1.127 L H J P N .530 .025 .550 R 0.010 .045 .028 .036 .195 .045 .055 .165 .205 .195 13.462 13.970 .036 .635 R 0.254 .055 1.143 .711 .914 .205 4.953 1.143 1.397 .185 4.191 4.953 5.207 Q P .170 .048 .180 4.318 .054 4.572 1.219 1.372 S Q S T T U U .0483° 3° 3° 3° 3°3° .054 1.371 3° 5° 3° 5° 3° 5° 6° 5° 6°1.219 3° 6° 3° 6° 3° V V .094 .100 .110 .110 2.54 2.388 2.794 2.794 W W X X Y Y Z .014 .014 3° 3° .395 .385 .130 .130 .021 .025 .356 5° 3° 5.5° .410 10.033 .410 .150 3.302 .150 .533 .356 5° 3° 10.414 9.779 3.810 3.302 .635 N V Min D A M H Max .235 .255 5.969 Inc hes M illim eters .100 .120 2.540 M in M ax M in M ax .223 .410 .337 5.664 .395 10.033 10.414 CP OS Q Millimeters Min z L M .112 2.591 .153 8.560 1.147 .610 14.986 .153 .550 3.785 R 1.147 0.197 28.626 .337 5° 5° 6.477 3.048 8.560 3.886 13.970 29.134 R 0.197 .914 1.397 5.207 4.699 6° 6° 5.5° 10.414 3.810 NOTE: 1. Dimension L, M, W apply for Solder Dip Finish Package Dimensions POS Package TO-252-2 * Inches Min Max Min Max A .255 .265 6.477 6.731 B .197 .205 5.004 5.207 C .027 .033 .686 .838 D* .270 .322 6.858 8.179 E .178 .182 4.521 4.623 .889 F .025 .035 .635 G 44˚ 46˚ 44˚ 46˚ H .382 .397 9.703 10.084 J CASE PIN 2 .090 TYP 2.286 TYP K 6˚ 8˚ 6˚ 8˚ L .086 .094 2.184 2.388 M .030 .034 .762 .864 N .040 .044 1.016 1.118 P .235 .245 5.969 6.223 Q 0.00 .004 0.00 .102 R PIN 1 Millimeters R0.01 TYP S .017 .023 .428 .588 T .040 .044 1.016 1.118 U .021 .027 .534 1.118 Note: * Tab “D” may not be present 5 CSD01060 Rev. P R0.31 TYP Recommended Solder Pad Layout .08 .26 TO-252-2 TO-220-2 Part Number Package Marking CSD01060A TO-220-2 CSD01060 CSD01060E TO-252-2 CSD01060 Note: Recommended soldering profiles can be found in the applications note here: http://www.cree.com/power_app_notes/soldering Notes • RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. • REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. • This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc. 6 CSD01060 Rev. P Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Fax: +1.919.313.5451 www.cree.com/power