MMBD3004SE RFG

MMBD3004/CA/CC/SE Taiwan Semiconductor Small Signal Product 350mW, SMD Switching Diode FEATURES - Fast switching speed - Surface mount device type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOT-23 MECHANICAL DATA - Case: SOT-23 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Weight: 8 ± 0.5 mg MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) SYMBOL VALUE UNIT PD 350 mW Repetitive Peak Reverse Voltage VRRM 350 V Repetitive Peak Forward Current IFRM 625 mA IO 225 mA PARAMETER Power Dissipation Mean Forward Current Pulse Width=1μs Non-Repetitive Peak Forward Surge Current Pulse Width=1s 4 IFSM Thermal Resistance (Junction to Ambient) RθJA 357 Junction and Storage Temperature Range TJ , TSTG -65 to +150 PARAMETER Reverse Breakdown Voltage Forward Voltage Reverse Leakage Current IR=100μA IF=100mA VR=240V o o C/W o C SYMBOL MIN MAX UNIT V(BR) 350 - V - 1.00 - 1.25 - 0.1 - 100 VF IF=200mA A 1 IR V μA Junction Capacitance VR=240V, TJ=150 C f=1.0MHz VR=1V, CJ - 5 pF Reverse Recovery Time IF=IR=30mA, RL=100Ω, IRR=0.1IR trr - 50 ns Document Number: DS_S1501010 Version: B15 MMBD3004/CA/CC/SE Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Typical Reverse Characteristics Fig. 1 Typical Forward Characteristics 1000 Instantaneous Reverse Current (mA) Instantaneous Forward Current (mA) 1000 100 10 1 0.1 100 10 1 0.1 0.01 0.001 0.01 0 0.3 0.6 0.9 1.2 1.5 1.8 0 2.1 0.5 1 1.5 2 2.5 3 3.5 Instantaneous Reverse Voltage (V) Instantaneous Forward Voltage (V) Fig. 4 Typical Capacitance VS. Reverse Voltage Fig. 3 Admissible Power Dissipation Curve 1.1 400 300 CT, Total Capacitance (pF) Power Dissipation (mW) 350 250 200 150 100 50 0 1.0 0.9 0.8 0.7 0 25 50 75 100 125 150 Ambient Temperature (oC) Document Number: DS_S1501010 175 200 0.01 0.1 1 10 100 Reverse Voltage (V) Version: B15 MMBD3004/CA/CC/SE Taiwan Semiconductor Small Signal Product ORDER INFORMATION (EXAMPLE) MMBD3004 RFG Green compound code Packing code Part no. PACKAGE OUTLINE DIMENSIONS SOT-23 DIM. Unit (mm) Unit (inch) Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF Unit (mm) Unit (inch) Typ. Typ. Z 2.8 0.110 X 0.7 0.028 Y 0.9 0.035 C 1.9 0.075 E 1.0 0.039 SUGGEST PAD LAYOUT DIM. PIN CONFIGURATION MARKING Part No. Marking MMBD3004 HC MMBD3004CA RA MMBD3004CC PZ MMBD3004SE PY Document Number: DS_S1501010 Version: B15 MMBD3004/CA/CC/SE Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1501010 Version: B15