5001HAC25M00000BBIR

AS5001 Arcadium™ Low Jitter Fixed Frequency Oscillator, 10 kHz to 350 MHz The AS5001 Arcadium™ all-silicon oscillator utilizes proprietary frequency synthesis and sensor technologies to provide a quartz-free, MEMS-free, low jitter clock at any output frequency. The device is factory-programmed to a fixed frequency ranging from 10 kHz to 350 MHz with < 0.026 ppb resolution and maintains low jitter across its operating range. It uses on-chip temperature and strain sensors, and an advanced LC tank architecture to achieve excellent reliabilities even in high impact shock scenarios. AS5001’s on-chip power supply filtering provides industry-leading power supply noise rejection, simplifying the task of generating low jitter clocks in noisy systems that use switched- mode power supplies. Offered in a variety of industrystandard packages, the AS5001 has a dramatically simplified supply chain that enables Aeonsemi to ship samples shortly after receipt of order. The AS5001 is factory-configurable for a wide variety of user specifications, including frequency, output format, and OE pin location. Specific configurations are factory programmed at time of shipment, eliminating the long lead times associated with custom oscillators. This process also guarantees 100% electrical testing of every device before shipment. KEY FEATURES • Quartz-free and MEMS-free without mechanical moving parts • Available with frequencies from 10 kHz to 350 MHz • Differential: 10 kHz to 350 MHz • LVCMOS: 10 kHz to 212.5 MHz • Low jitter: 350 fs Typ RMS (12 kHz – 20 MHz bandwidth) • Compliant to PCIe Gen 1/2/3/4/5 jitter requirements • 50 ppm stability (-40 to 105ºC) • Integrated LDO for on-chip power supply noise filtering • Support continuous 1.8V to 3.3V VDD supply operation Flexible Output Frequency All Silicon Oscillator • LVPECL, LVDS, CML, HCSL, CMOS, and Flexible Output Format Dual CMOS output options • Industrial standard 3.2 x 5, 2.5 x 3.2 mm package footprints APPLICATIONS • 1G/10G/40G/100G Ethernet Freq / Temp Comp • Servers, switches, storage, NICs, search acceleration • Test and measurement • Clock and data recovery • FPGA/ASIC clocking Pin Assignments (LVPECL/LVDS/HCSL/CML/Dual CMOS) Pin # 1, 2 OE/ACT/NC 1 6 VDD NC/OE/ACT 2 5 CLK- GND 3 4 CLK+ (Top View) Descriptions Selectable via ordering option OE = Output enable. Active High ACT = Device active. Active High NC = No connect 3 GND = Ground 4 5 CLK+ = Clock output CLK- = Complementary clock output 6 VDD = Power supply 3.2 x 5 mm and 2.5 x 3.2 mm aeonsemi.com | Enabling Edge Computing Network This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Rev. 0.9 AS5001 Datasheet 1. Ordering Guide The AS5001 Oscillator supports a variety of options including frequency, output format, and OE/ACT pin location, as shown in the chart below. Specific device configurations are programmed into the part at time of shipment, and samples are available in 2 weeks. XO Series Description 5001 I2C Programmable 5001 Temp Stability Total Stability + 25 ppm + 50 ppm A A A A - Signal Format VDD Range Coupling Order Option LVPECL 2.5, 3.3 V DC A LVPECL 2.5, 3.3 V AC B LVDS 1.8 V DC - - 1 - Package - A 3.2 x 5 mm I -40 to 85 °C B 2.5 x 3.2 mm E -40 to 105 °C - Description Pin # A OE 1 B OE 2 C ACT 1 D ACT 2 Temperature Grade - - A B I R Device Revision Tape and Reel Package Qty T 250 C LVDS 2.5, 3.3 V DC D R 2500 CML 1.8, 2.5, 3.3 V AC E Bulk 1.8, 2.5, 3.3 V DC F 1.8, 2.5, 3.3 V DC G 1.8, 2.5, 3.3 V DC H 1.8, 2.5, 3.3 V DC I 1.8, 2.5, 3.3 V DC J HCSL Termination) HCSL Termination) CMOS Dual CMOS (In-Phase) Dual CMOS (Complementary) Frequency Code Mxxxxxxx 2 3 Description FCLK < 1 MHz xMxxxxxx 1 MHz xxMxxxxx 10 MHz xxxMxxxx 100 MHz FCLK < 10 MHz FCLK < 100 MHz FCLK MHz Notes: 1. Total stability includes temp stability, initial accuracy, load pulling, VDD variation, and 10 years aging at 40 °C. 2. Device supports extended industrial temperature range of -40 to 105°C only with VDD = 1.8V (+/- 5%). 3. For example: 156.25 MHz = 156M250; 25 MHz = 25M0000. aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 2 AS5001 Datasheet 2. Electrical Specifications Table 2.1. Electrical Specifications VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC; VDD = 1.8 V ± 5%, TA = –40 to 105 ºC Parameter Temperature Range Frequency Range Symbol Test Condition/Comment Min Typ Max Unit –40 — 105 ºC LVPECL, LVDS, CML, HCSL 0.01 — 350 MHz CMOS, Dual CMOS 0.01 — 212.5 MHz 3.47 V TA FCLK Supply Voltage VDD Supply Current (FCLK = 50 MHz) IDD 1.71 Tristate Hi-Z (OE = 0, output disabled) — 40 50 mA Ready State (ACT = 0, standby mode) — 1 2 mA LVPECL (DC-Coupled) — 70 80 mA LVPECL (AC-Coupled) — 60 70 mA LVDS — 45 55 mA HCSL — 60 70 mA CML — 60 70 mA CMOS — 40 55 mA Dual CMOS — 50 60 mA Total Stability1 FSTAB Frequency stability –50 — 50 ppm Rise/Fall Time (20% to 80% VPP) TR/TF LVPECL/LVDS/CML — — 350 ps CMOS / Dual CMOS (CL = 5 pF) — 0.5 1.5 ns HCSL, FCLK >50 MHz — — 550 ps All formats 45 — 55 % Duty Cycle DC Output Enable (OE)2 VIH 0.7 × VDD — — V VIL — — 0.3 × VDD V Powerup Time TD Output Disable Time, FCLK >10 MHz — — 3 µs TE Output Enable Time, FCLK >10 MHz — — 20 µs — — 4 ms tOSC Time from 0.9 × VDD until output frequency (FCLK) within spec LVPECL Output Option3 VOC Mid-level VDD – 1.55 — VDD – 1.25 V (DC-Coupled) VO Swing (diff) 1.4 — 1.85 VPP LVPECL Output Option3 VO Swing (diff) 1.4 — 1.85 VPP VOC Mid-level (2.5 V, 3.3 V VDD) 1.125 1.20 1.275 V Mid-level (1.8 V VDD) 0.795 0.85 0.905 V Swing (diff) 0.5 0.82 0.96 VPP (AC-Coupled) LVDS Output Option3 (DC-Coupled) VO aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 3 AS5001 Datasheet Parameter Symbol Test Condition/Comment Min Typ Max Unit VOH Output voltage high 695 815 935 mV VOL Output voltage low 0 5 10 mV VOH Output voltage high 695 820 945 mV VOL Output voltage low 0 5 10 mV CML Output Option4 (AC-Coupled) VO Swing (diff) 0.725 0.8 0.89 VPP CMOS Output Option VOH IOH = 8/6/4 mA for 3.3/2.5/1.8V VDD 0.83 × VDD — — V VOL IOL = 8/6/4 mA for 3.3/2.5/1.8V VDD — 0.17 × VDD V HCSL Output Option5 (Rterm = Ω; DC-Coupled) HCSL Output Option5 (Rterm = Ω; DC-Coupled) — Notes: 1. Total Stability includes temperature stability, initial accuracy, load pulling, VDD variation, and aging for 10 years at 40 ºC. 2. OE includes a k pull-up to VDD for OE active high Includes a pins include a kΩ pull-down to GND. 3. Rterm = Ω to VDD – 2.0 V (see Figure 4.1). 4. Rterm = 1 5. Rterm = k pull-down to GND for OE active low. NC (No Connect) Ω differential) see Figure 4.2). Ω to GND see Figure 4.2). aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 4 AS5001 Datasheet Table 2.2. Clock Output Phase Jitter and PSRR VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC; VDD = 1.8 V ± 5%, TA = –40 to 105 ºC Parameter Symbol Test Condition/Comment Min Typ Max Unit Phase Jitter (RMS, 12 kHz - 20 MHz)1,2 FCLK ≥ 1 MHz ϕJ Differential Formats — 350 750 fs CMOS, Dual CMOS — 350 — fs Phase Jitter (RMS, 50 kHz - 20 MHz) ϕJ Differential Formats — 150 250 fs CMOS, Dual CMOS — 100 — fs 100 kHz sine wave — -76 — 200 kHz sine wave — -75 — 500 kHz sine wave — -75 — 1 MHz sine wave — -75 — 100 kHz sine wave — -83 — 200 kHz sine wave — -83 — 500 kHz sine wave — -83 — 1 MHz sine wave — -82 — FCLK ≥ 1 6 MHz Spurs Induced by External Power Supply Noise, 50 mVpp Ripple. PSRR LVDS 156.25 MHz Output VDD = 1.8 V Spurs Induced by External Power Supply Noise, 50 mVpp Ripple. PSRR LVDS 156.25 MHz Output VDD = 2.5 or 3.3 V dBc dBc Note: 1. Applies to output frequency: 50, 100, 156.25, 212.5, 350 MHz 2. Guaranteed by characterization. Jitter inclusive of any spurs Figure 2.1: Phase Noise at 156.25 MHz aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 5 AS5001 Datasheet Table 2.3. Environmental Compliance and Package Information Parameter Test Condition Moisture Sensitivity Level 1 Note: For additional product information not listed in the data sheet (e.g. RoHS Certifications, MSDS data, qualification data, REACH Declarations, ECCN codes, etc.), contact aeonsemi.com/contact-us/ Table 2.4. Thermal Conditions Package Parameter Symbol Test Condition Value Unit Thermal Resistance Junction to Ambient ΘJA Still Air 105 ºC/W Thermal Resistance Junction to Board ΘJB Still Air 81 ºC/W Max Junction Temperature TJ Still Air 125 ºC Thermal Resistance Junction to Ambient ΘJA Still Air 108 ºC/W Thermal Resistance Junction to Board ΘJB Still Air 84 ºC/W Max Junction Temperature TJ Still Air 125 ºC 3.2 x 5 mm, 6-pin DFN 2.5 x 3.2 mm, 6-pin DFN Table 2.5. Absolute Maximum Ratings1 Parameter Symbol Rating Unit TAMAX 105 ºC TS -55 to 125 ºC Supply Voltage VDD -0.5 to 3.8 V Input Voltage VIN -0.5 to VDD + 0.3 V ESD HBM (JESD22-A114) HBM 4.0 kV Solder Temperature3 TPEAK 260 ºC Solder Time at TPEAK3 TP 20 - 40 sec Maximum Operating Temperature2 Storage Temperature Notes: 1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. For VDD = 1.8V only; otherwise 85ºC. 3. The device is compliant with JEDEC J-STD-020. aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 6 AS5001 Datasheet 3. CMOS Buffer and Output Terminations Dual CMOS output format ordering options support either complementary or in-phase signals for two identical frequency outputs. This feature enables replacement of multiple XOs with a single AS5001 device. Figure Error! No text of specified style in document..1: Integrated 1:2 CMOS Buffer Supports In-Phase or Complementary Outputs AS50xx AS50xx VDD VDD CLK+ CLK CLK- CMOS Receiver NC CMOS Receiver Single CMOS Termination Dual CMOS Termination Figure Error! No text of specified style in document..2: CMOS Output Terminations aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 7 AS5001 Datasheet 4. Recommended Output Terminations The output drivers support AC-coupled or DC-coupled terminations as shown in figures below. AS50xx AS50xx VDD (3.3V, 2.5V) VDD (3.3V, 2.5V) R1 CLK+ 0.1 µF CLK- 0.1 µF R1 R1 R1 R2 R2 CLK+ CLK- R2 R2 LVPECL Receiver AC-Coupled LVPECL – Thevenin Termination LVPECL Receiver DC-Coupled LVPECL – 50 Ω w/ VTT Bias AS50xx AS50xx VDD (3.3V, 2.5V) VDD (3.3V, 2.5V) CLK+ VDD CLK- VDD (3.3V, 2.5V) VDD (3.3V, 2.5V) R1 CLK+ 0.1 µF VDD R2 0.1 µF CLK- R1 R2 LVPECL Receiver LVPECL Receiver DC-Coupled LVPECL – Thevenin Termination AC-Coupled LVPECL – 50 Ω w/ VTT Bias Termination Resistor Values VDD 3.3 V 2.5 V R1 1 7 R2 8 6 Figure Error! No text of specified style in document..3: LVPECL Output Terminations aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 8 AS5001 Datasheet DC-Coupled LVDS AC-Coupled CML Figure Error! No text of specified style in document..4: LVDS / CML Output Terminations AS50xx AS50xx VDD VDD CLK+ CLK+ CLK- CLKHCSL Receiver HCSL Receiver Source Terminated HCSL Destination Terminated HCSL Figure Error! No text of specified style in document..5: HCSL Output Terminations aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 9 AS5001 Datasheet 5. Package Outline 5.1 Package Outline (3.2 x 5 mm) The figure below illustrates the package details for the 3.2 x 5 mm AS5001. The table below lists the values for the dimensions shown in the illustration. Figure 5.1. AS5001 (3.2 x 5 mm) Outline Diagram Table 5.1. Package Diagram Dimensions (mm) Dimension Min Nom Max A 0.8 0.85 0.9 A1 0 0.035 0.05 A2 -- 0.65 -- A3 b 0.203 REF 0.59 0.64 D 3.2 BSC E 4 BSC e 1.27 BSC L 0.7 0.75 L1 0.85 REF aaa 0.1 bbb 0.1 ccc 0.08 ddd 0.1 0.69 0.8 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 10 AS5001 Datasheet 5.2 Package Outline (2.5 x 3.2 mm) The figure below illustrates the package details for the 2.5 x 3.2 mm AS5001. The table below lists the values for the dimensions shown in the illustration. Figure 5.2. AS5001 (2.5 x 3.2 mm) Outline Diagram Table 5.2. Package Diagram Dimensions (mm) Dimension Min Nom Max A 0.8 0.85 0.9 A1 0 0.035 0.05 A2 --- 0.65 --- A3 0.203 REF b 0.85 0.9 0.95 b1 0.45 0.5 0.55 D 2.5 BSC E 3.2 BSC e 1.05 BSC L 0.65 0.7 aaa 0.1 bbb 0.1 ccc 0.08 ddd 0.1 0.75 Notes: 1. The dimensions in parentheses are reference. 2. All dimensions in millimeters (mm). 3. Dimensioning and Tolerancing per ANSI Y14.5M-1994. aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 11 AS5001 Datasheet 6. PCB Land Pattern (3.2 x 5 mm and 2.5 x 3.2 mm) The figure below illustrates the 3.2 x 5 mm PCB land pattern for the AS5001. The table below lists the values for the dimensions shown in the illustration. Figure 6.1. AS5001 (3.2 x 5 mm and 2.5 x 3.2 mm) PCB Land Pattern Table 6.1. PCB Land Pattern Dimensions (mm) Dimension Description 3.2 x 5 mm Package 2.5 x 3.2 mm Package Value (mm) Value (mm) X1 Width - leads on long sides 0.75 0.7 Y1 Height - leads on long sides 0.64 0.9, 0.5 D1 Pitch in X directions of XLY1 leads 2.25 1.6 E1 Lead pitch XLY1 leads 1.27 1.05 Notes: The following notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine-tune their SMT process as required for their application and tooling. General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 0.8:1 for the pads. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 12 AS5001 Datasheet 7. Top Marking (3.2 x 5 mm and 2.5 x 3.2 mm) The figure below illustrates the mark specification for the AS5001. The table below lists the line information. AS 5 0 0 1 F F F FF F Y Y W W Figure 7.1. AS5001 Top Mark Table 7.1. AS5001 Top Mark Description Line Position 1 1–6 Description A = AS5001, CCCCC = Custom Mark Code 2 Trace Code 1–6 3 Position 1 6 digits trace code per assembly release instructions Pin 1 orientation mark (dot) Position 2–3 Year (last two digits of the year), to be assigned by assembly site (ex: 2017 = 17) Position 4–5 Calendar Work Week number (1–53), to be assigned by assembly site aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 13 AS5001 Datasheet 8. Revision History Revision 0.9 Sept 2020 Initial release aeonsemi.com | Enabling Edge Computing Network Rev. 0.9 | 14