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C1206X5R106K500NT

C1206X5R106K500NT

  • 厂商:

    SANYEAR(叁叶源)

  • 封装:

    1206

  • 描述:

    贴片电容(MLCC) 1206 10µF ±10% 50V X5R

  • 详情介绍
  • 数据手册
  • 价格&库存
C1206X5R106K500NT 数据手册
多层片式陶瓷电容器规格书 MULTILAYER CHIP CERAMIC CAPACITOR CATALOG 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 一、概述 ●电容器及介质种类: ※高频类: 此类介质材料的电容器为Ⅰ类电容器,包括通用型高频 COG(NPO)电容器。其中 COG(NPO) 电容器电性能最稳定,几乎不随温度、电压和时间的变化而变化,适用于低损耗,稳定性要求高的高频电路 。 ※ X7R、X5R、X7S、X6S:此类介质材料的电容器为Ⅱ类电容器,具有较高的介电常数,容量比Ⅰ类电容 器高,具有较稳定的温度特性,适用于容量范围广,稳定性要求不高的电路中,如隔直、耦合、旁路、鉴频 等电路中。 ※Y5V:此类介质材料的电容器为Ⅱ类电容器,是所有电容器中介电常数最大的电容器,但其容量稳定性较 差,对温度、电压等条件较敏感,适用于要求大容量,温度变化不大的电路中。 SUMMARY ●Types of Dielectric Material and Capacitor ※HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as ClassⅠcapacitor, including high frequency COG(NPO) capacitor. The electrical properties of COG(NPO) capacitor are the most stable one and change invariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required. ※X7R、X5R、 X7S、 X6S: X7R、 X5R、X7S、 X6S material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class Ⅱ capacitor whose capacitance is higher than that of class Ⅰ. These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc. ※Y5V:The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc. www.sanyear.cn PAGE 1 多层片式陶瓷电容器 二、尺寸及结构 Multilayer Chip Ceramic Capacitor DIMENSIONS AND STRUCTURE ※ 尺寸 DIMENSIONS L L W T WB WB 型号 Type 尺寸 Dimensions (mm) 英制表示 British expression 0201 0402 0603 公制表示 Metric expression 0603 1005 1608 L W T WB 0.6±0.03 1.00±0.05 1.60±0.10 0.3±0.03 0.50±0.05 0.80±0.10 0.15±0.10 0.25±0.10 0.30±0.10 0805 2012 2.00±0.20 1.25±0.20 1206 3216 3.20±0.30 1.60±0.30 1210 1808 1812 2220 3225 4520 4532 5750 3.20±0.30 4.50±0.40 4.50±0.40 5.70±0.40 2.50±0.30 2.00±0.20 3.20±0.30 5.00±0.40 0.3±0.03 0.50±0.05 0.80±0.10 ≤0.55 0.80±0.20 1.00±0.20 1.25±0.20 0.80±0.20 1.00±0.20 1.25±0.20 1.60±0.30 ≤2.80 ≤2.20 ≤3.50 ≤3.50 0.50±0.20 0.60±0.30 0.60±0.30 0.60±0.30 0.60±0.30 0.60±0.30 备注:可根据客户的特殊要求设计符合客户需求的产品。 Note:We can design according to customer special requirements 序号 NO ※ 结构 STRUCTURE W L ① ② T ③ ① ② ③ ④ ④ ⑤ ⑤ www.sanyear.cn 名称 Name 陶瓷介质 Ceramic dielectric 内电极 Inner electrode 外电极 Substrate electrode 镍层 Nickel Layer 锡层 Tin Layer PAGE 2 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 三、型号规格表示方法 HOW TO ORDER C 0603 X7R 102 产品类型 TYPE 电容值 尺寸 温度系数 Size 温度特性 Capacitance Tolerance PRODUCT 额定电压 端头类型 包装 允许偏差 Packaging Rate 式陶瓷 电容器 MLCC 01005 0201 0402 0603 0805 1206 1210 1808 1812 2220       Terminal     Voltage T.C. C=多层 T K 500 N  COG (NPO)  X7R  X7S  X6S  X5R  Y5V 1R5=1.5pF 100=10pF 222=2.2nF 105=1uF 475=4.7uF 107=10uF             A=±0.05pF B=±0.1pF C=±0.25pF D=±0.5pF F=±1% G=±2% J=±5% K=±10% M=±20% Z=+80% -20%         4R0=4V 6R3=6.3V 100=10V 160=16V 250=25V 500=50V 101=100V 251=250V 102=1KV 202=2KV Type   N:银 T= (或铜) 常规包装 /镍/锡 Routine   N:Ag B= (or Cu) 超薄包装 /Ni/Sn Ultra thin        S= 特殊包装 Special 四、温度系数/特性 Temperature Coefficient /Characteristics 介质物种 Dielectric 标称温度系数 参考温度点 Reference Temperature Point Temperature Coefficient 0+30 ppm/℃ 工作温度范围 Operation Temperature Range COG(NPO) 20℃ X7R 20℃ ±15% -55℃~125℃ 20℃ ±22% -55℃~125℃ 20℃ ±22% -55℃~105℃ 20℃ ±15% -55℃~85℃   -55℃~125℃   X7S     X6S     X5R     Y5V 20℃ -80%~+30% -25℃~85℃ 备注:Ⅰ类电容器标称温度系数和允许偏差是采用温度在20℃和85℃之间的电容量变化来确定的,而Ⅱ类 电容器标称温度系数是按照工作范围之间的电容量相对20℃的电容量变化来确定的。 NOTE:Nominal  temperature  coefficient  and  allowed  tolerance  of  class  Ⅰare  decided  by  th e  changing  of  the capacitance between 20℃ and 85℃. Nominal temperature coefficient of cl ass Ⅱare decided by the temperature of 20℃ www.sanyear.cn PAGE 3 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 五、容量范围及其电压 Capacitance Range and Operating Voltage 尺寸规格 额定电压 Size Code Rated Voltage 容量范围 Capacitance COG(NPO) Y5V 4V —— —— 6.3V —— 10,000~100,000 10V —— —— 16V —— 10,000 25V —— —— 50V 0.5~100 —— 4V —— —— 6.3V —— 1,000~1,000,000 10V —— 1,000~1,000,000 16V —— 1,000~220,000 25V —— 1,000~220,000 50V 0.1~1,000 1,000~100,000 4V —— —— 6.3V —— 1,000~10,000,000 10V —— 1,000~10,000,000 16V —— 1,000~2,200,000 25V —— 1,000~2,200,000 50V 0.1~6,800 1,000~1,000,000 4V —— —— 6.3V —— 1,000~22,000,000 10V —— 1,000~22,000,000 16V —— 1,000~22,000,000 25V —— 1,000~10,000,000 50V 0.3~22,000 1,000~4,700,000 0201 0402 0603 0805 www.sanyear.cn PAGE 4 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 尺寸规格 额定电压 Size Code Rated Voltage 容量范围 Capacitance COG(NPO) Y5V 4V —— —— 6.3V —— 1,000~47,000,000 10V —— 1,000~47,000,000 16V —— 1,000~47,000,000 25V —— 1,000~10,000,000 50V 0.3~100,000 1,000~10,000,000 6.3V —— 4,700~100,000,000 10V —— 4,700~47,000,000 16V —— 4,700~22,000,000 25V —— 4,700~10,000,000 50V 10~100,000 4,700~10,000,000 6.3V —— —— 10V —— —— 16V —— —— 25V —— —— 50V 10~100,000 —— 6.3V —— 10,000~100,000,000 10V —— 10,000~100,000,000 16V —— 10,000~22,000,000 25V —— 10,000~10,000,000 50V 10~100,000 10,000~10,000,000 1206 1210 1808 1812 www.sanyear.cn PAGE 5 多层片式陶瓷电容器 尺寸规格 Size Code Multilayer Chip Ceramic Capacitor 额定电压 容量范围 Capacitance Rated Voltage X7R X7S 4V —— 6.3V X5R X6S —— 0.015 uF~1uF —— —— —— 0.015 uF~1uF —— 10V 100~10,000 —— 0.015 uF~0.1 uF —— 16V 100~10,000 —— —— —— 25V 100~10,000 —— —— —— 50V —— —— —— —— 4V —— —— 0.1uF~10uF 0.1~2.2 uF 6.3V 100~470,000 100,000~470,000 0.1uF~4.7uF 0.1~2.2 uF 10V 100~470,000 100,000~470,000 0.1uF~4.7uF 0.1~1 uF 16V 100~220,000 47,000~220,000 0.1uF~2.2 uF —— 25V 100~100,000 22,000~100,000 0.1uF~2.2 uF —— 50V 100~100,000 4,700~100,000 0.047uF~0.1 uF —— 4V —— —— 0.47uF~22uF 0.1~10 uF 6.3V 150~2,200,000 470,000~2,200,000 0.47uF~22uF 0.1~10 uF 10V 150~2,200,000 470,000~2,200,000 0.47uF~10uF 0.1~10 uF 16V 150~1,000,000 470,000~1,000,000 0.47uF~10uF 0.1~4.7 uF 25V 150~1,000,000 470,000~1,000,000 0.47uF~10uF 0.1~4.7 uF 50V 150~470,000 —— 0.47uF~1uF —— 4V —— —— 1uF~47uF 0.1~47 uF 6.3V 150~10,000,000 1,000,000~10,000,000 1uF~47uF 0.1~22 uF 10V 150~10,000,000 1,000,000~10,000,000 1uF~22uF 0.1~10 uF 16V 150~4,700,000 1,000,000~4,700,000 1uF~22uF 0.1~10 uF 25V 150~4,700,000 1,000,000~4,700,000 1uF~10uF 0.1~10 uF 50V 150~1,000,000 —— —— —— 0201 0402 0603 0805 www.sanyear.cn PAGE 6 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 尺寸规格 额定电压 Size Code Rated Voltage 容量范围 Capacitance X7R X7S X5R X6S 4V —— —— 2.2uF ~100uF —— 6.3V 200~22,000,000 2,200,000~22,000,000 2.2uF~100uF 0.1~100 uF 10V 200~22,000,000 2,200,000~22,000,000 2.2uF~47uF 0.1~22 uF 16V 200~10,000,000 2,200,000~10,000,000 2.2uF~22uF 0.1~22 uF 25V 200~10,000,000 1,500,000~10,000,000 2.2uF~22uF 0.1~10 uF 50V 200~4,700,000 1,000,000~4,700,000 2.2uF~10uF —— 6.3V 220~47,000,000 —— 47uF~100uF 0.1~100 uF 10V 220~47,000,000 —— 4.7uF~100uF 0.1~47 uF 16V 220~22,000,000 3,300,000~22,000,000 4.7uF~47uF 0.1~22 uF 25V 220~22,000,000 2,200,000~22,000,000 4.7uF~22uF 0.1~22 uF 50V 220~10,000,000 1,000,000~10,000,000 —— —— 6.3V 220~4,700,000 —— 4.7uF~100uF —— 10V 220~4,700,000 —— 4.7uF~47uF —— 16V 220~4,700,000 —— 4.7uF~22uF —— 25V 220~4,700,000 —— 4.7uF~10uF —— 50V 220~4,700,000 —— —— —— 6.3V —— —— 10uF~100uF —— 10V —— —— 10uF~47uF —— 16V 470~6,800,000 —— 4.7uF~22uF —— 25V 470~6,800,000 —— 4.7uF~10uF —— 50V 470~4,700,000 —— —— —— 1206 1210 1808 1812 备注:可根据客户的特殊要求设计符合客户需求的产品。 Note:We can design according to customer special requirements. www.sanyear.cn PAGE 7 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 七、中高压电容器 HIGH VOLTAGE MLCC 中高压多层片状陶瓷电容器是在多层片状陶瓷电容器的工艺技术、设备基础上,通过采用特殊工艺制 作的一种具有良好高压可靠性的产品,该产品适合于表面贴装,适合于多种直流高压线路,可以有效的改 善电子线路的性能。 ●应用范围 ※模拟或数字调制解调器 。 ※局域网/广域网接口界面。 ※日光灯启动辉器照明电路。 ※倍压电器。 ※直流变送器。 ※背光源驱动电路。 Middle & high voltage MLCC is a kind of special design 、special technology MLCC that bases on the technology of general MLCC. This kind of MLCC has stable high voltage reliability and suitable to SMT. Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the performance of the circuit. ●APPLICATIONS ※Analog & Digital Modems ※LAN/WAN Interface ※Lighting Ballast Circuits ※Voltage Multipliers ※DC-DC Converters ※Back-lighting Inverters 容量范围及其电压 单位/unit: pF 尺寸规格 工作电压 Size Code Rated Voltage NPO X7R Y5V 100V 0.5~1,000 150~100,000 200V 0.5~470 150~10,000 2,200~100,000 —— 250V 0.5~470 150~10,000 —— 100V 0.5~3,300 150~100,000 10,000~100,000 200V 0.1~1,500 150~22,000 10,000~47,000 250V 0.1~1,500 150~22,000 10,000~47,000 500V 0.1~470 150~10,000 —— 630V 0.1~470 150~10,000 —— 1000V 0.1~100 —— —— 100V 0.5~3,300 150~1,000,000 15,000~470,000 200V 0.1~2,700 150~220,000 10,000~220,000 250V 0.1~2,700 150~220,000 10,000~220,000 500V 0.1~1,500 150~33,000 —— 630V 0.1~1,500 150~33,000 —— 1000V 0.1~1,000 150~10,000 —— 2000V 0.1~270 150~2,700 —— 0603 0805 1206 www.sanyear.cn 容量范围 Capacitance PAGE 8 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 容量范围及其电压 尺寸规格 Size Code 1210 1808 1812 www.sanyear.cn 单位/unit: pF 工作电压 Rated Voltage 容量范围 Capacitance NPO X7R Y5V 100V 1.0~6,800 150~2,200,000 15,000~1,000,000 200V 250V 500V 630V 1000V 1.0~3,300 1.0~3,300 1.0~2,200 1.0~2,200 1.0~1,000 150~220,000 150~220,000 150~68,000 150~68,000 150~22,000 15,000~470,000 15,000~470,000 —— —— —— 2000V 3000V 1.0~470 —— 150~10,000 150~680 —— —— 4000V 100V 200V 250V 500V 630V 1000V 2000V 3000V 4000V —— 2.0~4,700 2.0~3,900 2.0~3,900 2.0~2,700 2.0~2,700 2.0~1,000 2.0~470 2.0~330 2.0~33 150~680 220~2,200,000 220~220,000 220~220,000 220~68,000 220~68,000 150~22,000 150~10,000 150~4,700 150~2,200 —— 150,000~1,000,000 10,000~390,000 10,000~390,000 —— —— —— —— —— —— 5000V 100V 200V 250V 500V 630V 1000V 2000V 3000V 4000V 5000V 2.0~33 3.0~10,000 3.0~6,800 3.0~6,800 3.0~4,700 3.0~4,700 3.0~1,200 3.0~1,000 3.0~560 3.0~220 3.0~68 —— 270~1,000,000 270~560,000 270~560,000 270~150,000 270~150,000 270~56,000 270~12,000 270~4,700 270~3,300 —— —— 150,000~2,200,000 100,000~470,000 100,000~470,000 —— —— —— —— —— —— —— PAGE 9 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 中高压电容器介质耐电强度的测试方法: Measurement method of dielectric withstanding voltage for high voltage MLCC 额定电压范围 Rated voltage range 100V≤Vr<500V 500V≤Vr≤1000V 1000V<Vr≤2000V 2000V<Vr≤5000V 八、可靠性测试 项目 Item 容量 Capacitance 耐电性能的测试方法 Measuring Method 施加额定电压的 200%, 5 秒, 最大电流不超过 50mA Force 200%Rated voltage for 5 second. Max..current should not exceed 50 mA. 施加额定电压的 150%, 5 秒, 最大电流不超过 50mA Force 150%Rated voltage for 5 second. Max..current should not exceed 50 mA. 施加额定电压的 120%, 5 秒, 最大电流不超过 50mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 50 mA. 施加额定电压的 120%, 5 秒, 最大电流不超过 10mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 10 mA. Reliability Test 技术规格 Technical Specification 测 试 方 法 Test Method and Remarks 测试频率 测试电压 标称容量 Measuring Measuring 应符合指定的误差级别 Capacitance Ⅰ类 Should be within the Frequency Voltage ClassⅠ specified tolerance. ≤1000pF 1MHZ±10% 1.0±0.2Vrms >1000 pF 1KHZ±10% 测试温度: 25℃±3℃ Test Temprature: 25℃±3℃ C≤10µF:测试频率: 1KHZ±10% 测试电压: 1.0±0.2Vrms Test Frequency: 1KHZ±10% Test Voltage: 1.0±0.2Vrms C>10µF 应符合指定的误差级别 Ⅱ类 X7R、X5R、X7S、X6S、Y5V: Should be within the 测试频率: 120±24 HZ Class Ⅱ specified tolerance. 测试电压:0.5±0.1Vrms Test Frequency: 120±24 HZ Test Voltage: 0.5±0.1Vrms 标称容量 Capacitance 测试频率 Measuring Frequency Cr<5 pF 1MHZ±10% 5pF≤Cr<50 pF 1MHZ±10% ≤0.15% 50pF≤Cr≤1000 pF 1MHZ±10% ≤0.15% >1000 pF 1KHZ±10% DF 损耗角正切 (DF, tanδ) Ⅰ类 Dissipation ClassⅠ Factor www.sanyear.cn ≤0.56% 1.5[(150/Cr)+7]×10 -4 测试电压 Measuring Voltage 1.0±0.2Vrms PAGE 10 多层片式陶瓷电容器 项目 Item 损耗角正 切(DF, tan δ) Dissipation Factor Ⅱ类 Class Ⅱ Multilayer Chip Ceramic Capacitor 技术规格 Technical Specification ≥ 25V 16V X7R/ 50V X5R ≤3.5% ≤3.5% X7S/ (C < (C < X6S ≤ 0.47µF) 0.47µF) (≥ 2.5% ≤10.0% ≤10.0% 0402) (C ≥ (C ≥ 0.47µF) 0.47µF) ≥ 25V 16V X7R/ 50V X5R ≤5.0% X7S/ (C < X6S ≤ 0.047µF) ≤5.0% (< 3.5% ≤10% 0402) (C > 0.047µF) ≥25V 16V ≤7.0% Y5V (C<1.0µF) ≤15% ≤9.0% (C≥1.0µF) Ⅰ类 C≤10 nF, Ri≥50000MΩ ClassⅠ C>10 nF, Ri• CR≥500S 绝缘电阻 (IR) Insulation Resistance 介质耐电强 度(DWV) Dielectric Withstanding Voltage Ⅱ类 Class Ⅱ X7R/ X5R/ X7S/ X6S Y5V C≤25 nF, Ri≥10000MΩ C>25 nF, Ri• CR>100S C≤25 nF, Ri≥4000MΩ C>25 nF, Ri• CR>100S 不应有介质被击穿或损伤 No breakdown or damage. www.sanyear.cn 测 试 方 法 Test Method and Remarks 10V 6.3V ≤5.0% (C < 0.15µF) ≤10.0% (C ≥ 0.15µF) ≤5.0% (C < 0.15µF) ≤10.0% (C ≥ 0.15µF) 10V 6.3V ≤7.5% (C < 0.047µF) ≤10% (C > 0.047µF) 10V ≤15% C≤10µF 测试频率: 1KHZ±10% 测试电压: 1.0±0.2Vrms Test Frequency: 1KHZ±10% Test Voltage: 1.0±0.2Vrms C>10µF X7R、X5R、X7S、X6S、Y5V 测试频率: 120±24 HZ ≤7.5% ( C < 测试电压:0.5±0.1Vrms 0.047µF) Test Frequency: 120±24 HZ Test Voltage: 0.5±0.1Vrms ≤10% (C > 0.047µF) 6.3V ≤15% 测试电压:额定电压(最高 500V) 测试时间: 60±5 秒 测试湿度:≤75% 测试温度: 25℃±3℃ 测试充放电电流:≤50mA Measuring Voltage: Rated Voltage(Max 500V) Duration: 60±5s Test Humidity: ≤75% Test Temprature: 25℃±5℃ Test Current: ≤50mA 测量电压: Ⅰ类:300%额定电压 Ⅱ类:250%额定 电压 时间:1~5 秒 充/放电电流:不应超过 50mA (这部分说明不包括中高压 MLCC) Measuring Voltage: ClassⅠ:300% Rated voltage ClassⅡ:250% Rated voltage Duration: 1~5s Charge/ Discharge Current: 50mA max. (This method excludes high-voltage MLCC) PAGE 11 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 项目 Item 可焊性 Solderability 技术规格 Technical Specification Test Method and Remarks 上锡率应大于 95% 外观:无可见损伤. At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. 项目 Item ΔC/C 耐焊接热 Resistance to Soldering Heat 测 试 方 法 DF IR NPO至 SL NPO to SL X7R/X5R/ X7S/X6S ≤ ± 0.5% 或 ± 0.5PF,取较大值 -5~+10% ≤±0.5% or ±0.5PF, whichever is larger Y5V -10~+2 0% 同初始标准 Same to initial value. 同初始标准 Same to initial value. 外观:无可见损伤 上锡率:≥95% Appearance:No visible damage.At least 95% of the terminal electrode is covered by new solder. 抗弯曲强度 外观:无可见损伤. Resistance Appearance: No visible damage. 将电容在 80~120℃的温度下预热 10~30 秒. Preheating conditions:80 to 120℃; 10~30s. 有铅焊料: (Sn/Pb:63/37) 无铅焊料: 浸锡温度: 235±5℃ 浸锡温度: 245±5℃ 浸锡时间: 2±0.5s 浸锡时间: 2±0.5s Solder Temperature: 235±5℃ Solder Temperature: 245±5℃ Duration: 2±0.5s Duration: 2±0.5s 将电容在 100~200℃的温度下预热 10±2 分钟. 浸锡温度: 265±5℃ 浸锡时间: 10±1s 然后取出溶剂清洗干净,在 10 倍以上的显微镜底 下观察. 放置时间:24±2 小时 放置条件:室温 Preheating conditions: 100 to 200℃; 10±2min. Solder Temperature: 265±5℃ Duration: 10±1s Clean the capacitor with solvent and examine it with a 10X(min.) microscope. Recovery Time: 24±2h Recovery condition: Room temperature 试验基板:Al2O3 或 PCB 弯曲深度:1mm 施压速度:0.5mm/sec. 单位:mm 应在弯曲状态下进行测量。 ※ T=10 to Flexure of Substrate 45±2 (Bending 45±2 Test Board: Al2O3 or PCB Strength) Warp: 1mm Speed: 0.5mm/sec. Unit: mm ΔC/C ≤±10% The measurement should be made with the board in the bending position. www.sanyear.cn PAGE 12 多层片式陶瓷电容器 项目 Item 端头结合强度 Termination Adhesion Multilayer Chip Ceramic Capacitor 技术规格 Technical Specification 外观无可见损伤 No visible damage. 测 试 方 法 Test Method and Remarks 施加的力:5N Applied Force: 5N 时间:10±1S Duration: 10±1S ※ 温度循环 Temperature Cycle 潮湿试验 Moisture Resistance ΔC/C: Ⅰ类:≤±1%或±1pF , 取两者中最大者 Ⅱ类: B,X,BS,DS: ≤±10% E,F: ≤±20% ClassⅠ: ≤±1% or ±1pF, whichever is larger. ClassⅡ: B,X,BS,DS: ≤±10% E,F: ≤±20% Ⅰ类: ≤±2%或±1pF, 取两者之中较大者 Ⅱ类: B,X,BS,DS:≤±10% Δ E,F: ≤±30% C/C ClassⅠ: ≤±2% or ±1pF, whichever is larger. ClassⅡ: B,X,BS,DS:≤±10% E,F: ≤±30% ≤2 倍初始标准 DF Not more than twice of initial value. Ⅰ类:Ri≥2500MΩ或 Ri• CR≥25S 取两者之中较小者. ClassⅠ: Ri≥2500MΩ或 Ri• CR≥ 25S whichever is smaller. IR Ⅱ类:Ri≥1000MΩ或 Ri• CR≥25S 取两者之中较小者. ClassⅡ: Ri≥1000MΩ或 Ri• CR≥ 25S whichever is smaller. 外观:无损伤 Appearance: No visible damage. www.sanyear.cn 预处理 (2类) :上限类别温度,1小时 恢复:24±1h 初始测量 循环次数:5 次,一个循环分以下 4 步: 阶段 温度(℃) 时间(分钟) NPO/X7R/X7S/X6S/X5R:-55 第 1 步 下限温度( Y5V:-25 30 Z5U:+10) 第2步 第3步 常温 (+20) 上限温度(NPO/X7R/X7S: Y5V/Z5U/X5R:+85 2~3 +125 X6S:+105 ) 30 第4步 常温 (+20) 2~3 试验后放置(恢复)时间:24±2h Preheating conditions: up-category temperature, 1h Recovery time: 24±1h Initial Measurement Cycling Times: 5 times, 1 cycle, 4 steps: Time Step Temperature(℃) (min.) NPO/X7R/X7S/X6S/X5R:-55 1 Low- category temp. ( Y5V:-25 30 Z5U:+10) 2 Normal temp. (+20) 2~3 +125 3 Up- category temp. (NPO/X7R/X7S: 30 Y5V/Z5U/X5R:+85 X6S:+105) 4 Normal temp. (+20) 2~3 Recovery time after test: 24±2h 温度:40±2℃ 湿度:90~95%RH 时间:500 小时 放置条件:室温 放置时间:24 小时(Ⅰ类);48 小时(Ⅱ类) Temperature:40±2℃ Humidity:90~95%RH Duration:500h Recovery conditions:Room temperature Recovery Time:24h (Class1) or 48h (Class2) PAGE 13 多层片式陶瓷电容器 项目 Item 寿命试验 Life Test 中高压产品 寿命试验 Middle &high voltage Life Test Multilayer Chip Ceramic Capacitor 技术规格 Technical Specification Ⅰ类:≤±2%或±1pF 取两者之中较大者 Ⅱ类:B,X,BS,DS: ≤±20% Δ E,F: ≤±30% C/C ClassⅠ:≤±2% or ±1pF, whichever is larger. ClassⅡ: B,X,BS,DS: ≤±20% E,F: ≤±30% ≤2 倍初始标准 DF Not more than twice of initial value. Ⅰ类:Ri≥4000MΩ或 Ri• CR≥40S 取两者之中较小者. ClassⅠ: Ri≥4000MΩ或 Ri• CR ≥ 40S whichever is smaller. IR Ⅱ类:Ri≥2000MΩ或 Ri• CR≥50S 取两者之中较小者. ClassⅡ: Ri≥2000MΩ或 Ri• CR ≥ 50S whichever is smaller. 外观:无损伤 Visual Appearance: No visible damage. Ⅰ类:≤±2%或±1pF 取两者之中较大者 Ⅱ类:B,X,BS,DS: ≤±20% Δ E,F: ≤±30% C/C ClassⅠ:≤±2% or ±1pF, whichever is larger. ClassⅡ: B,X,BS,DS: ≤±20% E,F: ≤±30% ≤2 倍初始标准 DF Not more than twice of initial value. Ⅰ类:Ri≥4000MΩ或 Ri• CR≥40S 取两者之中较小者. ClassⅠ: Ri≥4000MΩ或 Ri• CR≥ 40S whichever is smaller. IR Ⅱ类:Ri≥2000MΩ或 Ri• CR≥50S 取两者之中较小者. ClassⅡ: Ri≥2000MΩ或 Ri• CR≥ 50S whichever is smaller. 外观:无损伤 Visual Appearance: No visible damage. 测 试 方 法 Test Method and Remarks 低压产品(≤100V) 电压:1.5 倍额定工作电压 时间:1000 小时 温度:125℃(NPO、X7R、X7S) 85℃(X5R、Y5V) 105℃(X6S) 充电电流:不应超过 50mA 放置条件:室温 放置时间:24 小时(Ⅰ类) ,或 48 小时(Ⅱ类) , Low-Voltage(≤100V) Applied Voltage: 1.5 × Rated Voltage Duration: 1000h Temperature:125℃(NPO、X7R、X7S) 85℃(X5R、 Y5V)105℃(X6S) Charge/ Discharge Current: 50mA max. Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 中高压产品: 100V≤额定电压<500V:2 倍工作电压 500V≤额定电压≤1000V:1.5 倍工作电压 额定电压>1000V:1.2 倍工作电压 时间:1000 小时 充电电流:不应超过 50mA 温度:125℃(NPO X7R、X7S);85℃(X5R、Y5V) 105℃(X6S) 放置条件:室温 放置时间:24 小时(Ⅰ类),或 48小时(Ⅱ类) , Applied Voltage: 100V≤Rated Voltage<500V:2 Multiple 500V≤Rated Voltage≤1000V:1.5 Multiple >1000V Rated Voltage:1.2 Multiple Duration: 1000h Charge/ Discharge Current: 50mA max. Temperature:125℃(NPO X7R、X7S) ;85℃(X5R、 Y5V)105℃(X6S) Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 注解: ※ : 专门预处理 (仅对 2 类电容器) 将电容器放在上限类别温度或按详细规范中可能规定的更高温度下经 1h 后,接着在试验的标准大气条件下恢复 24 ±1h。 Note:Pretreatment (only for class2 capacitor) Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement. First, place the capacitor in the up-category temperature or other specified higher temperature environment for 1hour. Then recovery the capacitor at standard pressure conditions for 24±1hours。 www.sanyear.cn PAGE 14 多层片式陶瓷电容器 九、包装 Multilayer Chip Ceramic Capacitor PACKAGE ※ 纸带卷盘结构 PAPER TAPING Top cover tape 面胶 Carrier tape(paper)传送带 Chip hole(Pocket) 芯片孔 Polystyrene reel 胶盘 Bottom tape 底胶 ※ 0201、0402 纸带编带尺寸大小 Dimensions of paper taping for 0402 type 代号 W1 L1 D C B P1 P2 P0 d t 0.37± 0.67± 8.00± 3.50± 1.75± 2.00± 2.00± 4.00± 1.50 0.80 0.10 0.10 0.10 0.05 0.10 0.05 0.05 0.10 -0/+0.10 Below 0.65± 1.15± 8.00± 3.50± 1.75± 2.00± 2.00± 4.00± 1.50 0.80 0.10 0.10 0.10 0.05 0.10 0.05 ※适合‘0603,0805,1206’常规尺寸产品的纸带尺寸 Dimensions of paper taping for 0603,0805,1206 types. 0.05 0.10 -0/+0.10 Below Code 0201 0402 www.sanyear.cn PAGE 15 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 送带孔 Feeding hole 芯片方穴 Chip pocket J E A D B T H Chip cap G F C Tape running direction 纸带运行方向 Unit:mm 代号Code 纸带规格 paper size 0603 0805 1206 A B C D* E F G* H J T 1.10 ± 0.10 1.45 ± 0.15 1.80 ± 0.20 1.90 ± 0.10 2.30 ± 0.15 3.40 ± 0.20 8.00 ± 0.10 8.0 ± 0.15 8.00 ± 0.20 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 2.00 ± 0.10 2.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 1.50 -0/+0.10 1.50 -0/+0.10 1.50 -0/+0.10 1.10 Max 1.10 Max 1.10 Max 注意:*表示此处对尺寸的要求非常精确。 Note: The place with “*” means where needs exactly dimensions. ●塑胶卷盘结构 EMBOSSED TAPING Top cover tape 面胶 Carrier tape(paper)传送带 Chip hole(Pocket)芯片孔 Polystyrene reel 胶盘 ※ 塑胶带尺寸结构(适合‘0805~1812’型产品) Dimensions of embossed taping for 0805~1812 type www.sanyear.cn PAGE 16 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor ●外包装 Outer packing 小包装 The first package 大包装 The second package Quantity: 10 reels Quantity: 6 cases 数量: 10 卷 数量:6 盒 115mm 200mm 180mm 400mm label 标签 180mm 385mm Label 标签 PART No 型号规格 Production name 产品名称 Quantity 数量 Weight 重量 QUANTITY :数量 DATE 日期 十、储存方法 Storage Methods 确保芯片可焊性良好的贮存期限为 6 个月(在包装好已交付的情况下)。 The guaranteed period for solderability is 6 months (Under deliver package condition). 储存条件/Storage conditions: 储存温度/Temperature 5~40℃ 十一、使用前的注意事项 储存相对湿度/Relative Humidity 20~70% Precautions For Use 多层片式瓷介电容器(MLCC)在短路或开路的电路中都有可能失效,在超出本承认书或相关说明书中所述使 用频率的恶劣工作环境,或外界机械力超压作用下,电容芯片都有可能着火、燃烧甚至爆炸,所以在使用的时候,首先 应考虑按本承认书的有关说明来进行,如有不明之处,请联系我们技术部、品管部或生产部. The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified “rating” and specified “conditions” in the specification, which will result in burn out, flaming or glowing in the worst case. Following “precautions for “safety” and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory. 1. 焊接的条件与相关图表 Soldering Profile 为避免因温度的突然变化而引起的芯片开裂或局部爆炸的现象发生,请按有关温度曲线图表来进行.(请参考 附页中的图表) To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). www.sanyear.cn PAGE 17 多层片式陶瓷电容器 2. 手工焊接 Multilayer Chip Ceramic Capacitor Manual Soldering 手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部爆炸的现象,在焊接时,如果操作者不小 心,会使烙铁头直接同电容芯片的瓷体部分接触,这样很容易使电容芯片因热冲击而受损或出现其他意外.因 此,使用电烙铁手工焊接时应仔细操作,并对电烙铁的尖端的选择和尖端温度控制应多加小心. Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator’s careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. 3. 适量的焊料 Optimum Solder Amount for Reflow Soldering 焊料过多 Too much solder 焊料太少 Not enough solder 这样会因端头压力过大而 可能引起芯片受损 Cracks tend to occur due to large stress. 固定力量不足,可能会引起 电容芯片与线路接触不良 Weak holding force may cause bad connection between the capacitor and PCB. 4. 推荐焊料用量 Recommended Soldering amounts 4.1 回流焊接的最佳焊料用量 The optimal solder fillet amounts for re-flow soldering 4.2 波峰焊接的最佳焊料用量 The optimal solder fillet amounts for wave soldering 4.3使用烙铁返修时的最佳焊料量 The optimal solder fillet amounts for reworking by using soldering iron www.sanyear.cn PAGE 18 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 十二、推荐焊接方式 Recommended Soldering Method 规格尺寸 温度特性 额定电压 容量范围 焊接方式 Size Temperature Characteristics RatedVoltage Capacitance Soldering Method COG(NPO) 0201 / X7R/X5R/X7S/X6S / R Y5V / R COG(NPO) 0402 / R X7R/X5R/X7S/X6S / R Y5V / R COG(NPO) X7R/X5R/X7S/X6S / Y5V R/W C≥1uf R C<1uf R/W / R/W C≥4.7uf R C<4.7uf R/W C≥1uf R C<1uf R/W / / / R/W C≥10uf R C<10uf R/W C≥10uf R C<10uf R/W / 1206 Y5V C<1uf / COG(NPO) X7R/X5R/X7S/X6S R / 0805 Y5V C≥1uf / COG(NPO) X7R/X5R/X7S/X6S R/W / 0603 / COG(NPO) ≥1210 R / / R X7R/X5R/X7S/X6S / / R Y5V / / R 焊接方式 Soldering method:R—回流焊 Reflow Solering W—波峰焊 Wave Soldering www.sanyear.cn PAGE 19 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 十三、推荐焊接温度曲线图 The temperature profile for soldering 回流焊接(Re-flow soldering ) Temperature 焊接 Peak Temperature 预 热 (℃) 温度 300 250 200 150 100 50 超过一分钟 尖峰温度 Peak temperature 超过一分钟 30~60S 自然冷却 Pb-Sn 焊接 无铅焊接 Pb-Sn soldering Lead-free soldering 230℃~250℃ 240℃~260℃ 在预热时,请将焊接温度与芯片表面温度之间的温差维持在 T≤15 0℃。 While in preheating,please keep the temperature difference between soldering temperature and surface temperature of chips as: T ≤1 5 0 ℃. 波峰焊接(Wave soldering) Temperature (℃) 预 热 300 Preheating 温度 250 200 150 100 50 Over 1 minute Peak Temperature 3s max. 超过一分钟 Pb-Sn 焊接 Pb-Sn soldering Gradual cooling 自然冷却 无铅焊接 Lead-free soldering 尖峰温度 230℃~260℃ 240℃~270℃ Peak temperature 在预热时,请将焊接温度与芯片表面温度之间的温差维持在 T≤150℃。 While in preheating,please keep the temperature difference between soldering temperature and surface temperature of chips as: T ≤1 5 0 ℃. www.sanyear.cn PAGE 20 多层片式陶瓷电容器 Multilayer Chip Ceramic Capacitor 手工焊接(Hand soldering) Temperature (℃) 预 热 300 Preheating 250 200 温度 150 100 50 Peak Temperature Over 1 minute 3s max. 超过一分钟 Gradual cooling 自然冷却 条件 Conditions: 预热 Preheating 烙铁头温度 Temperature of Power of soldering iron head soldering iron 最高300℃ △≤130℃ 烙铁功率 Highest temperature:300℃ 最大20W 20W at the highest 烙铁头直径 Diameter of soldering iron head 焊接时间 锡膏量 Soldering Solder paste time amount 限制条件 Restricted conditions 请勿使用烙铁头直接接触陶 建议1mm 最长3s 1mm 3s at the ≤1/2 chip Please avoid the derect contact recommended longest thickness between soldering iron head ≤1/2芯片厚度 瓷元件 and ceramic components ※以最新版本的内容为准 www.sanyear.cn PAGE 21
C1206X5R106K500NT
1. 物料型号:文档中列出了多种型号的多层片式陶瓷电容器,包括不同尺寸和介质材料的电容器,如COG(NPO)、X7R、X5R、X7S、X6S和Y5V等。

2. 器件简介:文档提供了关于多层片式陶瓷电容器的概述,包括电容器及介质种类,例如高频类电容器和Ⅱ类电容器,它们具有不同的电性能和适用场景。

3. 引脚分配:文档中通过表格形式展示了不同型号电容器的尺寸和结构,包括英制和公制表示,以及电容器的各部分名称,如陶瓷介质、内电极、外电极、镍层和锡层。

4. 参数特性:文档详细列出了不同介质材料的电容器的温度系数和特性,以及它们的工作温度范围,如COG(NPO)的0+30 ppm/°C至Y5V的-80%+30%。

5. 功能详解:文档中解释了不同电容器的适用场景,例如高频类电容器适用于低损耗和稳定性要求高的高频电路,而Y5V电容器适用于要求大容量且温度变化不大的电路。

6. 应用信息:文档提供了中高压电容器的应用范围,包括模拟或数字调制解调器、局域网/广域网接口、日光灯启动辉器照明电路等。

7. 封装信息:文档中包含了不同尺寸电容器的封装信息,如0201、0402、0603等,并提供了尺寸公差和结构细节。
C1206X5R106K500NT 价格&库存

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C1206X5R106K500NT
  •  国内价格
  • 20+0.14586
  • 200+0.13566
  • 600+0.12546
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