多层片式陶瓷电容器规格书
MULTILAYER CHIP CERAMIC CAPACITOR CATALOG
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
一、概述
●电容器及介质种类:
※高频类: 此类介质材料的电容器为Ⅰ类电容器,包括通用型高频 COG(NPO)电容器。其中 COG(NPO)
电容器电性能最稳定,几乎不随温度、电压和时间的变化而变化,适用于低损耗,稳定性要求高的高频电路
。
※ X7R、X5R、X7S、X6S:此类介质材料的电容器为Ⅱ类电容器,具有较高的介电常数,容量比Ⅰ类电容
器高,具有较稳定的温度特性,适用于容量范围广,稳定性要求不高的电路中,如隔直、耦合、旁路、鉴频
等电路中。
※Y5V:此类介质材料的电容器为Ⅱ类电容器,是所有电容器中介电常数最大的电容器,但其容量稳定性较
差,对温度、电压等条件较敏感,适用于要求大容量,温度变化不大的电路中。
SUMMARY
●Types of Dielectric Material and Capacitor
※HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as ClassⅠcapacitor,
including
high frequency COG(NPO) capacitor. The electrical properties of COG(NPO) capacitor are the most
stable one and change invariablly
with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required.
※X7R、X5R、
X7S、
X6S:
X7R、
X5R、X7S、
X6S material is a kind of material has high dielectric constant. The
capacitor
made of this kind material is considered as Class Ⅱ capacitor whose capacitance is higher than that of class Ⅰ.
These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature
range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc.
※Y5V:The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They
are used over a moderate temperature range in application where high capacitance is required because of its unstable
temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and
dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc.
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PAGE 1
多层片式陶瓷电容器
二、尺寸及结构
Multilayer Chip Ceramic Capacitor
DIMENSIONS AND STRUCTURE
※ 尺寸 DIMENSIONS
L
L
W
T
WB
WB
型号 Type
尺寸
Dimensions
(mm)
英制表示
British expression
0201
0402
0603
公制表示
Metric expression
0603
1005
1608
L
W
T
WB
0.6±0.03
1.00±0.05
1.60±0.10
0.3±0.03
0.50±0.05
0.80±0.10
0.15±0.10
0.25±0.10
0.30±0.10
0805
2012
2.00±0.20
1.25±0.20
1206
3216
3.20±0.30
1.60±0.30
1210
1808
1812
2220
3225
4520
4532
5750
3.20±0.30
4.50±0.40
4.50±0.40
5.70±0.40
2.50±0.30
2.00±0.20
3.20±0.30
5.00±0.40
0.3±0.03
0.50±0.05
0.80±0.10
≤0.55
0.80±0.20
1.00±0.20
1.25±0.20
0.80±0.20
1.00±0.20
1.25±0.20
1.60±0.30
≤2.80
≤2.20
≤3.50
≤3.50
0.50±0.20
0.60±0.30
0.60±0.30
0.60±0.30
0.60±0.30
0.60±0.30
备注:可根据客户的特殊要求设计符合客户需求的产品。
Note:We can design according to customer special requirements
序号
NO
※ 结构 STRUCTURE
W
L
①
②
T
③
①
②
③
④
④
⑤
⑤
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名称
Name
陶瓷介质
Ceramic dielectric
内电极
Inner electrode
外电极
Substrate electrode
镍层
Nickel Layer
锡层
Tin Layer
PAGE 2
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
三、型号规格表示方法
HOW TO ORDER
C 0603 X7R 102
产品类型
TYPE
电容值
尺寸
温度系数
Size
温度特性 Capacitance Tolerance
PRODUCT
额定电压 端头类型 包装
允许偏差
Packaging
Rate
式陶瓷
电容器
MLCC
01005
0201
0402
0603
0805
1206
1210
1808
1812
2220
Terminal
Voltage
T.C.
C=多层
T
K 500 N
COG
(NPO)
X7R
X7S
X6S
X5R
Y5V
1R5=1.5pF
100=10pF
222=2.2nF
105=1uF
475=4.7uF
107=10uF
A=±0.05pF
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z=+80%
-20%
4R0=4V
6R3=6.3V
100=10V
160=16V
250=25V
500=50V
101=100V
251=250V
102=1KV
202=2KV
Type
N:银
T=
(或铜) 常规包装
/镍/锡 Routine
N:Ag
B=
(or Cu) 超薄包装
/Ni/Sn Ultra thin
S=
特殊包装
Special
四、温度系数/特性 Temperature Coefficient /Characteristics
介质物种
Dielectric
标称温度系数
参考温度点
Reference Temperature Point Temperature Coefficient
0+30
ppm/℃
工作温度范围
Operation Temperature Range
COG(NPO)
20℃
X7R
20℃
±15%
-55℃~125℃
20℃
±22%
-55℃~125℃
20℃
±22%
-55℃~105℃
20℃
±15%
-55℃~85℃
-55℃~125℃
X7S
X6S
X5R
Y5V
20℃
-80%~+30%
-25℃~85℃
备注:Ⅰ类电容器标称温度系数和允许偏差是采用温度在20℃和85℃之间的电容量变化来确定的,而Ⅱ类
电容器标称温度系数是按照工作范围之间的电容量相对20℃的电容量变化来确定的。
NOTE:Nominal temperature coefficient and allowed tolerance of class Ⅰare decided by th
e changing of the capacitance between 20℃ and 85℃. Nominal temperature coefficient of cl
ass Ⅱare decided by the temperature of 20℃
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多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
五、容量范围及其电压
Capacitance Range and Operating Voltage
尺寸规格
额定电压
Size Code
Rated Voltage
容量范围 Capacitance
COG(NPO)
Y5V
4V
——
——
6.3V
——
10,000~100,000
10V
——
——
16V
——
10,000
25V
——
——
50V
0.5~100
——
4V
——
——
6.3V
——
1,000~1,000,000
10V
——
1,000~1,000,000
16V
——
1,000~220,000
25V
——
1,000~220,000
50V
0.1~1,000
1,000~100,000
4V
——
——
6.3V
——
1,000~10,000,000
10V
——
1,000~10,000,000
16V
——
1,000~2,200,000
25V
——
1,000~2,200,000
50V
0.1~6,800
1,000~1,000,000
4V
——
——
6.3V
——
1,000~22,000,000
10V
——
1,000~22,000,000
16V
——
1,000~22,000,000
25V
——
1,000~10,000,000
50V
0.3~22,000
1,000~4,700,000
0201
0402
0603
0805
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多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
尺寸规格
额定电压
Size Code
Rated Voltage
容量范围 Capacitance
COG(NPO)
Y5V
4V
——
——
6.3V
——
1,000~47,000,000
10V
——
1,000~47,000,000
16V
——
1,000~47,000,000
25V
——
1,000~10,000,000
50V
0.3~100,000
1,000~10,000,000
6.3V
——
4,700~100,000,000
10V
——
4,700~47,000,000
16V
——
4,700~22,000,000
25V
——
4,700~10,000,000
50V
10~100,000
4,700~10,000,000
6.3V
——
——
10V
——
——
16V
——
——
25V
——
——
50V
10~100,000
——
6.3V
——
10,000~100,000,000
10V
——
10,000~100,000,000
16V
——
10,000~22,000,000
25V
——
10,000~10,000,000
50V
10~100,000
10,000~10,000,000
1206
1210
1808
1812
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多层片式陶瓷电容器
尺寸规格
Size Code
Multilayer Chip Ceramic Capacitor
额定电压
容量范围 Capacitance
Rated Voltage
X7R
X7S
4V
——
6.3V
X5R
X6S
——
0.015 uF~1uF
——
——
——
0.015 uF~1uF
——
10V
100~10,000
——
0.015 uF~0.1 uF
——
16V
100~10,000
——
——
——
25V
100~10,000
——
——
——
50V
——
——
——
——
4V
——
——
0.1uF~10uF
0.1~2.2 uF
6.3V
100~470,000
100,000~470,000
0.1uF~4.7uF
0.1~2.2 uF
10V
100~470,000
100,000~470,000
0.1uF~4.7uF
0.1~1 uF
16V
100~220,000
47,000~220,000
0.1uF~2.2 uF
——
25V
100~100,000
22,000~100,000
0.1uF~2.2 uF
——
50V
100~100,000
4,700~100,000
0.047uF~0.1 uF
——
4V
——
——
0.47uF~22uF
0.1~10 uF
6.3V
150~2,200,000
470,000~2,200,000
0.47uF~22uF
0.1~10 uF
10V
150~2,200,000
470,000~2,200,000
0.47uF~10uF
0.1~10 uF
16V
150~1,000,000
470,000~1,000,000
0.47uF~10uF
0.1~4.7 uF
25V
150~1,000,000
470,000~1,000,000
0.47uF~10uF
0.1~4.7 uF
50V
150~470,000
——
0.47uF~1uF
——
4V
——
——
1uF~47uF
0.1~47 uF
6.3V
150~10,000,000
1,000,000~10,000,000
1uF~47uF
0.1~22 uF
10V
150~10,000,000
1,000,000~10,000,000
1uF~22uF
0.1~10 uF
16V
150~4,700,000
1,000,000~4,700,000
1uF~22uF
0.1~10 uF
25V
150~4,700,000
1,000,000~4,700,000
1uF~10uF
0.1~10 uF
50V
150~1,000,000
——
——
——
0201
0402
0603
0805
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PAGE 6
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
尺寸规格
额定电压
Size Code
Rated Voltage
容量范围 Capacitance
X7R
X7S
X5R
X6S
4V
——
——
2.2uF ~100uF
——
6.3V
200~22,000,000
2,200,000~22,000,000
2.2uF~100uF
0.1~100 uF
10V
200~22,000,000
2,200,000~22,000,000
2.2uF~47uF
0.1~22 uF
16V
200~10,000,000
2,200,000~10,000,000
2.2uF~22uF
0.1~22 uF
25V
200~10,000,000
1,500,000~10,000,000
2.2uF~22uF
0.1~10 uF
50V
200~4,700,000
1,000,000~4,700,000
2.2uF~10uF
——
6.3V
220~47,000,000
——
47uF~100uF
0.1~100 uF
10V
220~47,000,000
——
4.7uF~100uF
0.1~47 uF
16V
220~22,000,000
3,300,000~22,000,000
4.7uF~47uF
0.1~22 uF
25V
220~22,000,000
2,200,000~22,000,000
4.7uF~22uF
0.1~22 uF
50V
220~10,000,000
1,000,000~10,000,000
——
——
6.3V
220~4,700,000
——
4.7uF~100uF
——
10V
220~4,700,000
——
4.7uF~47uF
——
16V
220~4,700,000
——
4.7uF~22uF
——
25V
220~4,700,000
——
4.7uF~10uF
——
50V
220~4,700,000
——
——
——
6.3V
——
——
10uF~100uF
——
10V
——
——
10uF~47uF
——
16V
470~6,800,000
——
4.7uF~22uF
——
25V
470~6,800,000
——
4.7uF~10uF
——
50V
470~4,700,000
——
——
——
1206
1210
1808
1812
备注:可根据客户的特殊要求设计符合客户需求的产品。
Note:We can design according to customer special requirements.
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PAGE 7
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
七、中高压电容器
HIGH VOLTAGE MLCC
中高压多层片状陶瓷电容器是在多层片状陶瓷电容器的工艺技术、设备基础上,通过采用特殊工艺制
作的一种具有良好高压可靠性的产品,该产品适合于表面贴装,适合于多种直流高压线路,可以有效的改
善电子线路的性能。
●应用范围
※模拟或数字调制解调器 。
※局域网/广域网接口界面。
※日光灯启动辉器照明电路。
※倍压电器。
※直流变送器。
※背光源驱动电路。
Middle & high voltage MLCC is a kind of special design 、special technology MLCC that bases on the
technology of general MLCC. This kind of MLCC has stable high voltage reliability and suitable to SMT.
Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the
performance of the circuit.
●APPLICATIONS
※Analog & Digital Modems
※LAN/WAN Interface
※Lighting Ballast Circuits
※Voltage Multipliers
※DC-DC Converters
※Back-lighting Inverters
容量范围及其电压
单位/unit: pF
尺寸规格
工作电压
Size Code
Rated Voltage
NPO
X7R
Y5V
100V
0.5~1,000
150~100,000
200V
0.5~470
150~10,000
2,200~100,000
——
250V
0.5~470
150~10,000
——
100V
0.5~3,300
150~100,000
10,000~100,000
200V
0.1~1,500
150~22,000
10,000~47,000
250V
0.1~1,500
150~22,000
10,000~47,000
500V
0.1~470
150~10,000
——
630V
0.1~470
150~10,000
——
1000V
0.1~100
——
——
100V
0.5~3,300
150~1,000,000
15,000~470,000
200V
0.1~2,700
150~220,000
10,000~220,000
250V
0.1~2,700
150~220,000
10,000~220,000
500V
0.1~1,500
150~33,000
——
630V
0.1~1,500
150~33,000
——
1000V
0.1~1,000
150~10,000
——
2000V
0.1~270
150~2,700
——
0603
0805
1206
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容量范围 Capacitance
PAGE 8
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
容量范围及其电压
尺寸规格
Size Code
1210
1808
1812
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单位/unit: pF
工作电压
Rated Voltage
容量范围 Capacitance
NPO
X7R
Y5V
100V
1.0~6,800
150~2,200,000
15,000~1,000,000
200V
250V
500V
630V
1000V
1.0~3,300
1.0~3,300
1.0~2,200
1.0~2,200
1.0~1,000
150~220,000
150~220,000
150~68,000
150~68,000
150~22,000
15,000~470,000
15,000~470,000
——
——
——
2000V
3000V
1.0~470
——
150~10,000
150~680
——
——
4000V
100V
200V
250V
500V
630V
1000V
2000V
3000V
4000V
——
2.0~4,700
2.0~3,900
2.0~3,900
2.0~2,700
2.0~2,700
2.0~1,000
2.0~470
2.0~330
2.0~33
150~680
220~2,200,000
220~220,000
220~220,000
220~68,000
220~68,000
150~22,000
150~10,000
150~4,700
150~2,200
——
150,000~1,000,000
10,000~390,000
10,000~390,000
——
——
——
——
——
——
5000V
100V
200V
250V
500V
630V
1000V
2000V
3000V
4000V
5000V
2.0~33
3.0~10,000
3.0~6,800
3.0~6,800
3.0~4,700
3.0~4,700
3.0~1,200
3.0~1,000
3.0~560
3.0~220
3.0~68
——
270~1,000,000
270~560,000
270~560,000
270~150,000
270~150,000
270~56,000
270~12,000
270~4,700
270~3,300
——
——
150,000~2,200,000
100,000~470,000
100,000~470,000
——
——
——
——
——
——
——
PAGE 9
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
中高压电容器介质耐电强度的测试方法:
Measurement method of dielectric withstanding voltage for high voltage MLCC
额定电压范围
Rated voltage range
100V≤Vr<500V
500V≤Vr≤1000V
1000V<Vr≤2000V
2000V<Vr≤5000V
八、可靠性测试
项目
Item
容量
Capacitance
耐电性能的测试方法
Measuring Method
施加额定电压的 200%, 5 秒, 最大电流不超过 50mA
Force 200%Rated voltage for 5 second. Max..current should not exceed 50 mA.
施加额定电压的 150%, 5 秒, 最大电流不超过 50mA
Force 150%Rated voltage for 5 second. Max..current should not exceed 50 mA.
施加额定电压的 120%, 5 秒, 最大电流不超过 50mA
Force 120%Rated voltage for 5 seconds. Max..current should not exceed 50 mA.
施加额定电压的 120%, 5 秒, 最大电流不超过 10mA
Force 120%Rated voltage for 5 seconds. Max..current should not exceed 10 mA.
Reliability Test
技术规格
Technical Specification
测 试 方 法
Test Method and Remarks
测试频率
测试电压
标称容量
Measuring
Measuring
应符合指定的误差级别
Capacitance
Ⅰ类
Should be within the
Frequency
Voltage
ClassⅠ
specified tolerance.
≤1000pF
1MHZ±10%
1.0±0.2Vrms
>1000 pF
1KHZ±10%
测试温度: 25℃±3℃
Test Temprature: 25℃±3℃
C≤10µF:测试频率: 1KHZ±10%
测试电压: 1.0±0.2Vrms
Test Frequency: 1KHZ±10%
Test Voltage: 1.0±0.2Vrms
C>10µF
应符合指定的误差级别
Ⅱ类
X7R、X5R、X7S、X6S、Y5V:
Should be within the
测试频率: 120±24 HZ
Class Ⅱ
specified tolerance.
测试电压:0.5±0.1Vrms
Test Frequency: 120±24 HZ
Test Voltage: 0.5±0.1Vrms
标称容量
Capacitance
测试频率
Measuring
Frequency
Cr<5 pF
1MHZ±10%
5pF≤Cr<50 pF
1MHZ±10%
≤0.15%
50pF≤Cr≤1000 pF
1MHZ±10%
≤0.15%
>1000 pF
1KHZ±10%
DF
损耗角正切
(DF, tanδ)
Ⅰ类
Dissipation
ClassⅠ
Factor
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≤0.56%
1.5[(150/Cr)+7]×10
-4
测试电压
Measuring
Voltage
1.0±0.2Vrms
PAGE 10
多层片式陶瓷电容器
项目
Item
损耗角正
切(DF, tan
δ)
Dissipation
Factor
Ⅱ类
Class
Ⅱ
Multilayer Chip Ceramic Capacitor
技术规格
Technical Specification
≥
25V
16V
X7R/ 50V
X5R
≤3.5% ≤3.5%
X7S/
(C < (C <
X6S ≤
0.47µF) 0.47µF)
(≥ 2.5% ≤10.0% ≤10.0%
0402)
(C ≥ (C ≥
0.47µF) 0.47µF)
≥
25V
16V
X7R/ 50V
X5R
≤5.0%
X7S/
(C <
X6S ≤
0.047µF)
≤5.0%
(< 3.5%
≤10%
0402)
(C >
0.047µF)
≥25V
16V
≤7.0%
Y5V
(C<1.0µF)
≤15%
≤9.0%
(C≥1.0µF)
Ⅰ类 C≤10 nF, Ri≥50000MΩ
ClassⅠ C>10 nF, Ri• CR≥500S
绝缘电阻
(IR)
Insulation
Resistance
介质耐电强
度(DWV)
Dielectric
Withstanding
Voltage
Ⅱ类
Class
Ⅱ
X7R/
X5R/
X7S/
X6S
Y5V
C≤25 nF, Ri≥10000MΩ
C>25 nF, Ri• CR>100S
C≤25 nF, Ri≥4000MΩ
C>25 nF, Ri• CR>100S
不应有介质被击穿或损伤
No breakdown or damage.
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测 试 方 法
Test Method and Remarks
10V
6.3V
≤5.0%
(C <
0.15µF)
≤10.0%
(C ≥
0.15µF)
≤5.0%
(C <
0.15µF)
≤10.0%
(C ≥
0.15µF)
10V
6.3V
≤7.5%
(C <
0.047µF)
≤10%
(C >
0.047µF)
10V
≤15%
C≤10µF
测试频率: 1KHZ±10%
测试电压: 1.0±0.2Vrms
Test Frequency: 1KHZ±10%
Test Voltage: 1.0±0.2Vrms
C>10µF X7R、X5R、X7S、X6S、Y5V
测试频率: 120±24 HZ
≤7.5%
( C < 测试电压:0.5±0.1Vrms
0.047µF) Test Frequency: 120±24 HZ
Test Voltage: 0.5±0.1Vrms
≤10%
(C >
0.047µF)
6.3V
≤15%
测试电压:额定电压(最高 500V)
测试时间: 60±5 秒
测试湿度:≤75%
测试温度: 25℃±3℃
测试充放电电流:≤50mA
Measuring Voltage: Rated Voltage(Max
500V)
Duration: 60±5s
Test Humidity: ≤75%
Test Temprature: 25℃±5℃
Test Current: ≤50mA
测量电压:
Ⅰ类:300%额定电压
Ⅱ类:250%额定
电压
时间:1~5 秒 充/放电电流:不应超过
50mA
(这部分说明不包括中高压 MLCC)
Measuring Voltage:
ClassⅠ:300% Rated voltage
ClassⅡ:250% Rated voltage
Duration: 1~5s
Charge/ Discharge Current: 50mA max.
(This method excludes high-voltage
MLCC)
PAGE 11
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
项目
Item
可焊性
Solderability
技术规格
Technical Specification
Test Method and Remarks
上锡率应大于 95%
外观:无可见损伤.
At least 95% of the terminal electrode is
covered by new solder.
Visual Appearance: No visible damage.
项目
Item
ΔC/C
耐焊接热
Resistance to
Soldering Heat
测 试 方 法
DF
IR
NPO至 SL
NPO to SL
X7R/X5R/
X7S/X6S
≤ ± 0.5% 或 ±
0.5PF,取较大值
-5~+10%
≤±0.5% or ±0.5PF,
whichever is larger
Y5V
-10~+2
0%
同初始标准
Same to initial value.
同初始标准
Same to initial value.
外观:无可见损伤 上锡率:≥95%
Appearance:No visible damage.At least 95% of
the terminal electrode is covered by new solder.
抗弯曲强度
外观:无可见损伤.
Resistance
Appearance: No visible damage.
将电容在 80~120℃的温度下预热 10~30 秒.
Preheating conditions:80 to 120℃; 10~30s.
有铅焊料:
(Sn/Pb:63/37) 无铅焊料:
浸锡温度: 235±5℃
浸锡温度: 245±5℃
浸锡时间: 2±0.5s
浸锡时间: 2±0.5s
Solder Temperature: 235±5℃ Solder Temperature: 245±5℃
Duration: 2±0.5s
Duration: 2±0.5s
将电容在 100~200℃的温度下预热 10±2 分钟.
浸锡温度: 265±5℃
浸锡时间: 10±1s
然后取出溶剂清洗干净,在 10 倍以上的显微镜底
下观察.
放置时间:24±2 小时 放置条件:室温
Preheating conditions: 100 to 200℃; 10±2min.
Solder Temperature: 265±5℃
Duration: 10±1s
Clean the capacitor with solvent and examine it with
a 10X(min.) microscope.
Recovery Time: 24±2h
Recovery condition: Room temperature
试验基板:Al2O3 或 PCB
弯曲深度:1mm
施压速度:0.5mm/sec.
单位:mm
应在弯曲状态下进行测量。
※
T=10
to Flexure
of Substrate
45±2
(Bending
45±2
Test Board: Al2O3 or PCB
Strength)
Warp: 1mm
Speed: 0.5mm/sec.
Unit: mm
ΔC/C
≤±10%
The measurement should be made with the board in
the bending position.
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PAGE 12
多层片式陶瓷电容器
项目
Item
端头结合强度
Termination
Adhesion
Multilayer Chip Ceramic Capacitor
技术规格
Technical Specification
外观无可见损伤
No visible damage.
测 试 方 法
Test Method and Remarks
施加的力:5N
Applied Force: 5N
时间:10±1S
Duration: 10±1S
※
温度循环
Temperature
Cycle
潮湿试验
Moisture
Resistance
ΔC/C:
Ⅰ类:≤±1%或±1pF ,
取两者中最大者
Ⅱ类:
B,X,BS,DS: ≤±10%
E,F: ≤±20%
ClassⅠ: ≤±1% or ±1pF,
whichever is larger.
ClassⅡ:
B,X,BS,DS: ≤±10%
E,F: ≤±20%
Ⅰ类: ≤±2%或±1pF,
取两者之中较大者
Ⅱ类: B,X,BS,DS:≤±10%
Δ
E,F: ≤±30%
C/C ClassⅠ: ≤±2% or ±1pF,
whichever is larger.
ClassⅡ: B,X,BS,DS:≤±10%
E,F: ≤±30%
≤2 倍初始标准
DF
Not more than twice of initial value.
Ⅰ类:Ri≥2500MΩ或 Ri• CR≥25S
取两者之中较小者.
ClassⅠ: Ri≥2500MΩ或 Ri• CR≥
25S whichever is smaller.
IR
Ⅱ类:Ri≥1000MΩ或 Ri• CR≥25S
取两者之中较小者.
ClassⅡ: Ri≥1000MΩ或 Ri• CR≥
25S whichever is smaller.
外观:无损伤
Appearance: No visible damage.
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预处理 (2类)
:上限类别温度,1小时 恢复:24±1h
初始测量
循环次数:5 次,一个循环分以下 4 步:
阶段
温度(℃)
时间(分钟)
NPO/X7R/X7S/X6S/X5R:-55
第 1 步 下限温度( Y5V:-25
30
Z5U:+10)
第2步
第3步
常温
(+20)
上限温度(NPO/X7R/X7S:
Y5V/Z5U/X5R:+85
2~3
+125
X6S:+105
)
30
第4步
常温
(+20)
2~3
试验后放置(恢复)时间:24±2h
Preheating conditions: up-category temperature, 1h
Recovery time: 24±1h
Initial Measurement
Cycling Times: 5 times, 1 cycle, 4 steps:
Time
Step
Temperature(℃)
(min.)
NPO/X7R/X7S/X6S/X5R:-55
1
Low- category temp. ( Y5V:-25
30
Z5U:+10)
2
Normal temp. (+20)
2~3
+125
3
Up- category temp. (NPO/X7R/X7S:
30
Y5V/Z5U/X5R:+85 X6S:+105)
4
Normal temp. (+20)
2~3
Recovery time after test: 24±2h
温度:40±2℃
湿度:90~95%RH
时间:500 小时
放置条件:室温
放置时间:24 小时(Ⅰ类);48 小时(Ⅱ类)
Temperature:40±2℃
Humidity:90~95%RH
Duration:500h
Recovery conditions:Room temperature
Recovery Time:24h (Class1) or 48h (Class2)
PAGE 13
多层片式陶瓷电容器
项目
Item
寿命试验
Life Test
中高压产品
寿命试验
Middle
&high
voltage
Life Test
Multilayer Chip Ceramic Capacitor
技术规格
Technical Specification
Ⅰ类:≤±2%或±1pF
取两者之中较大者
Ⅱ类:B,X,BS,DS: ≤±20%
Δ
E,F: ≤±30%
C/C ClassⅠ:≤±2% or ±1pF,
whichever is larger.
ClassⅡ: B,X,BS,DS: ≤±20%
E,F: ≤±30%
≤2 倍初始标准
DF
Not more than twice of initial value.
Ⅰ类:Ri≥4000MΩ或 Ri• CR≥40S
取两者之中较小者.
ClassⅠ: Ri≥4000MΩ或 Ri• CR ≥
40S whichever is smaller.
IR
Ⅱ类:Ri≥2000MΩ或 Ri• CR≥50S
取两者之中较小者.
ClassⅡ: Ri≥2000MΩ或 Ri• CR ≥
50S whichever is smaller.
外观:无损伤
Visual Appearance: No visible damage.
Ⅰ类:≤±2%或±1pF
取两者之中较大者
Ⅱ类:B,X,BS,DS: ≤±20%
Δ
E,F: ≤±30%
C/C ClassⅠ:≤±2% or ±1pF,
whichever is larger.
ClassⅡ: B,X,BS,DS: ≤±20%
E,F: ≤±30%
≤2 倍初始标准
DF
Not more than twice of initial value.
Ⅰ类:Ri≥4000MΩ或 Ri• CR≥40S
取两者之中较小者.
ClassⅠ: Ri≥4000MΩ或 Ri• CR≥
40S whichever is smaller.
IR
Ⅱ类:Ri≥2000MΩ或 Ri• CR≥50S
取两者之中较小者.
ClassⅡ: Ri≥2000MΩ或 Ri• CR≥
50S whichever is smaller.
外观:无损伤
Visual Appearance: No visible damage.
测 试 方 法
Test Method and Remarks
低压产品(≤100V)
电压:1.5 倍额定工作电压
时间:1000 小时
温度:125℃(NPO、X7R、X7S) 85℃(X5R、Y5V)
105℃(X6S)
充电电流:不应超过 50mA
放置条件:室温
放置时间:24 小时(Ⅰ类)
,或 48 小时(Ⅱ类)
,
Low-Voltage(≤100V)
Applied Voltage: 1.5 × Rated Voltage
Duration: 1000h
Temperature:125℃(NPO、X7R、X7S) 85℃(X5R、
Y5V)105℃(X6S)
Charge/ Discharge Current: 50mA max.
Recovery Conditions: Room Temperature
Recovery Time: 24h (Class 1), or 48h (Class2)
中高压产品:
100V≤额定电压<500V:2 倍工作电压
500V≤额定电压≤1000V:1.5 倍工作电压
额定电压>1000V:1.2 倍工作电压
时间:1000 小时
充电电流:不应超过 50mA
温度:125℃(NPO X7R、X7S);85℃(X5R、Y5V)
105℃(X6S)
放置条件:室温
放置时间:24 小时(Ⅰ类),或 48小时(Ⅱ类)
,
Applied Voltage:
100V≤Rated Voltage<500V:2 Multiple
500V≤Rated Voltage≤1000V:1.5 Multiple
>1000V Rated Voltage:1.2 Multiple
Duration: 1000h
Charge/ Discharge Current: 50mA max.
Temperature:125℃(NPO X7R、X7S)
;85℃(X5R、
Y5V)105℃(X6S)
Recovery Conditions: Room Temperature
Recovery Time: 24h (Class 1), or 48h (Class2)
注解:
※
:
专门预处理 (仅对 2 类电容器)
将电容器放在上限类别温度或按详细规范中可能规定的更高温度下经 1h 后,接着在试验的标准大气条件下恢复 24
±1h。
Note:Pretreatment (only for class2 capacitor)
Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement. First, place the capacitor in
the up-category temperature or other specified higher temperature environment for 1hour. Then recovery the capacitor at
standard pressure conditions for 24±1hours。
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PAGE 14
多层片式陶瓷电容器
九、包装
Multilayer Chip Ceramic Capacitor
PACKAGE
※ 纸带卷盘结构
PAPER TAPING
Top cover tape 面胶
Carrier tape(paper)传送带
Chip hole(Pocket) 芯片孔
Polystyrene reel 胶盘
Bottom tape 底胶
※ 0201、0402 纸带编带尺寸大小
Dimensions of paper taping for 0402 type
代号
W1
L1
D
C
B
P1
P2
P0
d
t
0.37±
0.67±
8.00±
3.50±
1.75±
2.00±
2.00±
4.00±
1.50
0.80
0.10
0.10
0.10
0.05
0.10
0.05
0.05
0.10
-0/+0.10
Below
0.65±
1.15±
8.00±
3.50±
1.75±
2.00±
2.00±
4.00±
1.50
0.80
0.10
0.10
0.10
0.05
0.10
0.05
※适合‘0603,0805,1206’常规尺寸产品的纸带尺寸
Dimensions of paper taping for 0603,0805,1206 types.
0.05
0.10
-0/+0.10
Below
Code
0201
0402
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PAGE 15
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
送带孔 Feeding hole
芯片方穴 Chip pocket
J
E
A
D
B
T
H
Chip cap
G
F
C
Tape running direction
纸带运行方向
Unit:mm
代号Code
纸带规格
paper size
0603
0805
1206
A
B
C
D*
E
F
G*
H
J
T
1.10
± 0.10
1.45
± 0.15
1.80
± 0.20
1.90
± 0.10
2.30
± 0.15
3.40
± 0.20
8.00
± 0.10
8.0
± 0.15
8.00
± 0.20
3.50
± 0.05
3.50
± 0.05
3.50
± 0.05
1.75
± 0.10
1.75
± 0.10
1.75
± 0.10
4.00
± 0.10
4.00
± 0.10
4.00
± 0.10
2.00
± 0.10
2.00
± 0.10
2.00
± 0.10
4.00
± 0.10
4.00
± 0.10
4.00
± 0.10
1.50
-0/+0.10
1.50
-0/+0.10
1.50
-0/+0.10
1.10
Max
1.10
Max
1.10
Max
注意:*表示此处对尺寸的要求非常精确。
Note: The place with “*” means where needs exactly dimensions.
●塑胶卷盘结构
EMBOSSED TAPING
Top cover tape 面胶
Carrier tape(paper)传送带
Chip hole(Pocket)芯片孔
Polystyrene reel 胶盘
※ 塑胶带尺寸结构(适合‘0805~1812’型产品)
Dimensions of embossed taping for 0805~1812 type
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PAGE 16
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
●外包装 Outer packing
小包装 The first package
大包装 The second package
Quantity: 10 reels
Quantity: 6 cases
数量: 10 卷
数量:6 盒
115mm
200mm
180mm
400mm
label 标签
180mm
385mm
Label 标签
PART No 型号规格
Production name 产品名称
Quantity 数量
Weight 重量
QUANTITY :数量
DATE 日期
十、储存方法
Storage Methods
确保芯片可焊性良好的贮存期限为 6 个月(在包装好已交付的情况下)。
The guaranteed period for solderability is 6 months (Under deliver package condition).
储存条件/Storage conditions:
储存温度/Temperature 5~40℃
十一、使用前的注意事项
储存相对湿度/Relative Humidity 20~70%
Precautions For Use
多层片式瓷介电容器(MLCC)在短路或开路的电路中都有可能失效,在超出本承认书或相关说明书中所述使
用频率的恶劣工作环境,或外界机械力超压作用下,电容芯片都有可能着火、燃烧甚至爆炸,所以在使用的时候,首先
应考虑按本承认书的有关说明来进行,如有不明之处,请联系我们技术部、品管部或生产部.
The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when
subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified “rating” and
specified “conditions” in the specification, which will result in burn out, flaming or glowing in the worst case. Following
“precautions for “safety” and Application Notes shall be taken in your major consideration. If you have a question about
the precautions for handling, please contact our engineering section or factory.
1. 焊接的条件与相关图表
Soldering Profile
为避免因温度的突然变化而引起的芯片开裂或局部爆炸的现象发生,请按有关温度曲线图表来进行.(请参考
附页中的图表)
To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph
(refer to the graph in the enclosure page).
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PAGE 17
多层片式陶瓷电容器
2. 手工焊接
Multilayer Chip Ceramic Capacitor
Manual Soldering
手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部爆炸的现象,在焊接时,如果操作者不小
心,会使烙铁头直接同电容芯片的瓷体部分接触,这样很容易使电容芯片因热冲击而受损或出现其他意外.因
此,使用电烙铁手工焊接时应仔细操作,并对电烙铁的尖端的选择和尖端温度控制应多加小心.
Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip
comes into direct contact with the end terminations, and operator’s careless may cause the tip of the soldering iron
to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled
carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
3. 适量的焊料 Optimum Solder Amount for Reflow Soldering
焊料过多
Too much solder
焊料太少
Not enough solder
这样会因端头压力过大而
可能引起芯片受损
Cracks tend to occur due to large stress.
固定力量不足,可能会引起
电容芯片与线路接触不良
Weak holding force may cause bad
connection between the capacitor and PCB.
4. 推荐焊料用量 Recommended Soldering amounts
4.1 回流焊接的最佳焊料用量
The optimal solder fillet amounts for re-flow soldering
4.2 波峰焊接的最佳焊料用量
The optimal solder fillet amounts for wave soldering
4.3使用烙铁返修时的最佳焊料量
The optimal solder fillet amounts for reworking by using soldering iron
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PAGE 18
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
十二、推荐焊接方式
Recommended Soldering Method
规格尺寸
温度特性
额定电压
容量范围
焊接方式
Size
Temperature Characteristics
RatedVoltage
Capacitance
Soldering Method
COG(NPO)
0201
/
X7R/X5R/X7S/X6S
/
R
Y5V
/
R
COG(NPO)
0402
/
R
X7R/X5R/X7S/X6S
/
R
Y5V
/
R
COG(NPO)
X7R/X5R/X7S/X6S
/
Y5V
R/W
C≥1uf
R
C<1uf
R/W
/
R/W
C≥4.7uf
R
C<4.7uf
R/W
C≥1uf
R
C<1uf
R/W
/
/
/
R/W
C≥10uf
R
C<10uf
R/W
C≥10uf
R
C<10uf
R/W
/
1206
Y5V
C<1uf
/
COG(NPO)
X7R/X5R/X7S/X6S
R
/
0805
Y5V
C≥1uf
/
COG(NPO)
X7R/X5R/X7S/X6S
R/W
/
0603
/
COG(NPO)
≥1210
R
/
/
R
X7R/X5R/X7S/X6S
/
/
R
Y5V
/
/
R
焊接方式 Soldering method:R—回流焊 Reflow Solering
W—波峰焊 Wave Soldering
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PAGE 19
多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
十三、推荐焊接温度曲线图
The temperature profile for soldering
回流焊接(Re-flow soldering )
Temperature
焊接 Peak Temperature
预 热
(℃)
温度
300
250
200
150
100
50
超过一分钟
尖峰温度
Peak temperature
超过一分钟
30~60S
自然冷却
Pb-Sn 焊接
无铅焊接
Pb-Sn soldering
Lead-free soldering
230℃~250℃
240℃~260℃
在预热时,请将焊接温度与芯片表面温度之间的温差维持在 T≤15
0℃。
While in preheating,please keep the temperature difference between soldering temperature and surface
temperature of chips as: T
≤1
5
0
℃.
波峰焊接(Wave soldering)
Temperature
(℃)
预 热
300
Preheating
温度 250
200
150
100
50
Over 1 minute
Peak Temperature
3s max.
超过一分钟
Pb-Sn 焊接
Pb-Sn soldering
Gradual
cooling 自然冷却
无铅焊接
Lead-free soldering
尖峰温度
230℃~260℃
240℃~270℃
Peak temperature
在预热时,请将焊接温度与芯片表面温度之间的温差维持在 T≤150℃。
While in preheating,please keep the temperature difference between soldering temperature and surface
temperature of chips as: T
≤1
5
0
℃.
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多层片式陶瓷电容器
Multilayer Chip Ceramic Capacitor
手工焊接(Hand soldering)
Temperature
(℃)
预 热
300
Preheating
250
200
温度
150
100
50
Peak Temperature
Over 1 minute
3s max.
超过一分钟
Gradual
cooling
自然冷却
条件 Conditions:
预热
Preheating
烙铁头温度
Temperature of
Power of
soldering iron head soldering iron
最高300℃
△≤130℃
烙铁功率
Highest
temperature:300℃
最大20W
20W at the
highest
烙铁头直径
Diameter of
soldering iron
head
焊接时间
锡膏量
Soldering
Solder paste
time
amount
限制条件
Restricted conditions
请勿使用烙铁头直接接触陶
建议1mm
最长3s
1mm
3s at the
≤1/2 chip
Please avoid the derect contact
recommended
longest
thickness
between soldering iron head
≤1/2芯片厚度 瓷元件
and ceramic components
※以最新版本的内容为准
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PAGE 21