SD3112-820-R

Technical Data 4127 Effective October 2017 Supersedes March 2007 SD3112 Low profile metalized shielded drum core power inductors Applications • • Mobile phones Digital cameras Media players Small LCD displays LED driver and LED flash circuits Hard disk drives LCD Backlighting l i t n u r 14 o 6 31 nt. 1 0 SD me 2 , 1 3 view lace p y l e e r u e r J e e eas at v i t Pl ern c t fe d. l f a E te n , a e d l e ep as u ) n sd i 8 t 2 n yi 1 o sc tor t (4 i D en ee inv ta sh da • • • • • SMD Device Environmental data • Product features • • • • • 3.1 mm x 3.1 mm x 1.2 mm shielded drum core Ferrite core material Inductance range from 1.0 uH to 220 uH Current range from 1.65 A to 0.113 A Frequency range up to 4 MHz • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant SD3112 Low profile metalized shielded drum core power inductors Technical Data 4127 Effective October 2017 Product specifications Part Number SD3112-1R0-R SD3112-1R5-R SD3112-2R2-R SD3112-3R3-R SD3112-4R7-R SD3112-6R8-R SD3112-8R2-R SD3112-100-R SD3112-150-R SD3112-220-R SD3112-330-R SD3112-470-R SD3112-680-R SD3112-820-R SD3112-101-R SD3112-151-R SD3112-221-R Rated Inductance (µH) 1.0 1.5 2.2 3.3 4.7 6.8 8.2 10.0 15.0 22.0 33.0 47.0 68.0 82.0 100.0 150.0 220.0 OCL (1) (µH) 1.11+/-30% 1.70+/-30% 2.41+/-30% 3.24+/-30% 4.72+/-30% 6.47+/-30% 8.50+/-30% 10.01+/-30% 15.28+/-20% 21.66+/-20% 33.30+/-20% 47.44+/-20% 68.10+/-20% 83.19+/-20% 99.8+/-20% 149.4+/-20% 219.9+/-20% Part Marking Designator A B C D E F G H I J K L M N O P Q Irms (2) (A) Isat (3) (A) 1.39 1.16 0.97 0.90 0.74 0.68 0.57 0.55 0.45 0.37 0.30 0.270 0.228 0.213 0.184 0.149 0.121 1.65 1.33 1.12 0.97 0.80 0.68 0.60 0.55 0.44 0.37 0.30 0.25 0.211 0.190 0.174 0.142 0.117 DCR (Ω) typ. @ +20 °C 0.069 0.099 0.140 0.165 0.246 0.291 0.408 0.446 0.654 0.953 1.48 1.85 2.56 2.93 3.95 6.01 9.12 K-factor (4) 135 110 92 79 66 56 49 45 37 31 25 21 17 16 14 12 10 l i t n u r 14 o 6 31 nt. 1 0 SD me 2 , 1 3 view lace p y l e e r u e r J e e eas at v i t Pl ern c t fe d. l f a E te n , a e d l e ep as u ) n sd i 8 t 2 n yi 1 o sc tor t (4 i D en ee inv ta sh da (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 V, 0.0 Adc. (2) Irms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. (3) Isat Amperes peak for approximately 30% rolloff (@+20 °C) (4) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), ∆(Peak to peak ripple current in Amps). Dimensions- mm Dimensions are in millimeters. Part Marking: 3 Digit Marking: (1st digit: Indicates inductance value per letter in Part Marking Designator); (2nd digit: Bi-weekly production date code); (3rd digit: Last digit of the year produced). Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13" Diameter reel, 4,100 parts per reel. 2 www.eaton.com/electronics SD3110 Low profile metalized shielded drum core power inductors Technical Data 4137 Effective October 2017 Temperature rise vs total loss loss TemperautreRise (°C) 90 80 70 60 50 40 30 20 10 0 l i t n u r 14 o 6 31 nt. 1 0 SD me 2 , 1 3 view lace p y l e e r u e r J e e eas at v i t Pl ern c t fe d. l f a E te n , a e d l e ep as u ) n sd i 8 t 2 n yi 1 o sc tor t (4 i D en ee inv ta sh da 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 Total Loss (W) Core loss vs Bp-p 10 1MHz 1 500kHz 300kHz 200kHz 0.1 100kHz Core Loss (W) 0.01 50kHz 0.001 0.0001 0.00001 0.000001 1 10 100 1000 Bp-p (mT) Inductance characteristics 12 120% 0% 11 110% 0% 10 100% 0% 90% 90 % %% ooff OOCCLL 80% 80 % 70% 70 % -40°C 60% 60 % 50% 50 % 25°C 40% 40 % 30% 30 % 85°C 20% 20 % 10% 10 % 0% 0% 1 0% 20 % 30% 40% 50 % 6 0% 70% 80% 90 % 100% 1 10 % 120% 130% 140% %% of o f I Is s a a tt www.eaton.com/electronics 3 SD3112 Low profile metalized shielded drum core power inductors Technical Data 4127 Effective October 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TL Preheat A t TC -5°C Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 220°C 220°C Temperature l i t n u r 14 o 6 31 nt. 1 0 SD me 2 , 1 3 view lace p y l e e r u e r J e e eas at v i t Pl ern c t fe d. l f a E te n , a e d l e ep as u ) n sd i 8 t 2 n yi 1 o sc tor t (4 i D en ee inv ta sh da 25°C T smax Table 2 - Lead (Pb) Free Solder (T c) Tsmin Volume Package mm3 Thickness 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4127 October 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.