BZA962AVL,115

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Thank you for your cooperation and understanding, Kind regards, Team Nexperia DISCRETE SEMICONDUCTORS DATA SHEET M3D743 BZA900AVL series Quadruple low capacitance ESD suppressor Product data sheet Supersedes data of 2003 Apr 15 2003 Oct 20 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series FEATURES PINNING • Low diode capacitance PIN DESCRIPTION • Low leakage current 1 cathode 1 • SOT665 surface mount package 2 common anode • Common anode configuration. 3 cathode 2 4 cathode 3 5 cathode 4 APPLICATIONS • Communication systems • Computers and peripherals • Audio and video equipment. handbook, halfpage 5 DESCRIPTION 4 1 Monolithic transient voltage suppressor diode in a five lead SOT665 package for 4-bit wide ESD transient suppression. 3 2 4 5 1 MARKING TYPE NUMBER 2 3 MGW315 MARKING CODE BZA956AVL V3 BZA962AVL V2 BZA968AVL V1 Fig.1 Simplified outline (SOT665) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION BZA956AVL − plastic surface mounted package; 5 leads SOT665 BZA962AVL − plastic surface mounted package; 5 leads SOT665 BZA968AVL − plastic surface mounted package; 5 leads SOT665 2003 Oct 20 2 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode IZ working current Tamb = 25 °C − note 1 mA IF continuous forward current Tamb = 25 °C − 200 mA IFSM non-repetitive peak forward current tp = 1 ms; square pulse − 3.5 A Ptot total power dissipation Tamb = 25 °C; note 2; see Fig.5 − 335 mW PZSM non repetitive peak reverse power dissipation square pulse; tp = 1 ms − 6 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C ESD electrostatic discharge IEC 61000-4-2 (contact discharge) 15 − kV HBM MIL-Std 883 − kV 10 Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD CONDITIONS IEC 61000-4-2, level 4 (ESD) >15 kV (air); >8 kV (contact discharge) HBM MIL-Std 883, class 3 >4 kV THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient all diodes loaded 370 K/W Rth j-s thermal resistance from junction to solder point; note 1 one diode loaded 135 K/W all diodes loaded 125 K/W Note 1. Solder point of common anode (pin 2). 2003 Oct 20 3 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER V BZA956AVL VR = 3 V − − 200 nA BZA962AVL VR = 4 V − − 100 nA BZA968AVL VR = 4.3 V − − 20 nA working voltage IZ = 1 mA BZA956AVL 5.32 5.6 5.88 V BZA962AVL 5.89 6.2 6.51 V BZA968AVL 6.46 6.8 7.14 V BZA956AVL − − 200 Ω BZA962AVL − − 150 Ω BZA968AVL − − 100 Ω BZA956AVL − 1.3 − mV/K BZA962AVL − 2.4 − mV/K − 2.9 − mV/K BZA956AVL − 22 28 pF BZA962AVL − 18 22 pF BZA968AVL − 16 19 pF BZA956AVL − 12 17 pF BZA962AVL − 9 12 pF BZA968AVL − 8 11 pF BZA956AVL − − 0.90 A BZA962AVL − − 0.85 A BZA968AVL − − 0.80 A differential resistance temperature coefficient diode capacitance diode capacitance IZSM 2003 Oct 20 UNIT 1.2 IZ = 1 mA IZ = 1 mA BZA968AVL Cd MAX. − reverse current SZ TYP. − forward voltage IR rdif MIN. IF = 200 mA VF VZ CONDITIONS non-repetitive peak reverse current f = 1 MHz; VR = 0 f = 1 MHz; VR = 5 V tp = 1 ms; Tamb = 25 °C 4 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series MLE001 10 MLE003 102 handbook, halfpage handbook, halfpage IZSM (A) PZSM (W) BZA956AVL BZA956AVL 1 BZA962AVL 10 BZA968AVL BZA962AVL/BZA968AVL 10−1 10−2 10−1 1 tp (ms) 1 10−2 10 Fig.3 Fig.2 10−1 1 tp (ms) Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Maximum non-repetitive peak reverse current as a function of pulse time. MGT586 MLE002 26 Cd 10 400 handbook, halfpage handbook, halfpage Ptot (mW) (pF) 22 300 18 200 BZA956AVL 14 BZA962AVL 100 10 BZA968AVL 6 1 0 2 3 4 VR (V) 0 5 0 50 100 Tamb (°C) Tj = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Oct 20 Fig.5 Power derating curve. 5 150 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor handbook, full pagewidth ESD TESTER RZ 450 Ω BZA900AVL series RG 223/U 50 Ω coax CZ 10× ATTENUATOR DIGITIZING OSCILLOSCOPE 50 Ω note 1 1/4 BZA900AVL IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω Note 1: attenuator is only used for open socket high voltage measurements vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div BZA968AVL GND3 BZA962AVL GND2 GND BZA956AVL GND1 unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) GND GND vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) Fig.6 ESD clamping test set-up and waveforms. 2003 Oct 20 6 MLE005 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series APPLICATION INFORMATION Typical common anode application A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8. handbook, full pagewidth keyboard, terminal, printer, etc. A B C D I/O FUNCTIONAL DECODER BZA900AVL GND MLE008 Fig.7 Computer interface protection. VDD handbook, full pagewidth VGG address bus RAM I/O ROM data bus CPU CLOCK control bus BZA900AVL GND MLE009 Fig.8 Microprocessor protection. 2003 Oct 20 7 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. 2003 Oct 20 8 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT665 D E A X Y S S HE 5 4 A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 01-01-04 01-08-27 SOT665 2003 Oct 20 EUROPEAN PROJECTION 9 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA900AVL series DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 20 Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/03/pp11 Date of release: 2003 Oct 20 Document order number: 9397 750 11935