HC2-1R0-R

Technical Data 4109 Effective October 2015 Supersedes August 2006 HC2 High current power inductors Applications • Distributed power systems DC-DC converters • General-purpose low voltage supplies • Computer systems • Servers • Point of Load (POL) converters • Industrial Equipment • Networking/Telecom power supplies Environmental data Product description • Storage temperature range (component): 40°C to +125°C • Compact footprint • • Designed for high density, high current/low voltage applications Operating temperature range: -40°C to +125°C (ambient + self-temperature rise). • • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs Solder reflow temperature: J-STD-020D compliant • Frequency Range up to 1MHz Pb HC2 High current power inductors  Technical Data 4109 Effective October 2015 Product specifications Part number Part number (Tape and reel) OCL1 (μH) ±20% lrms2 amps lsat3 amps DCR (Ω)4 maximum @ 20°C Volt-μsec5 (V-μs) HC2-R47-R HC2-R47TR-R .52 52.9 63.75 .0006 6.87 HC2-R68-R HC2-R68TR-R .63 52.9 50.00 .0006 6.87 HC2-1R0-R HC2-1R0TR-R 1.15 33.0 42.50 .0013 10.31 HC2-2R2-R HC2-2R2TR-R 2.00 24.3 31.90 .0023 13.75 HC2-4R7-R HC2-4R7TR-R 4.55 17.0 21.25 .0046 20.62 HC2-6R0-R HC2-6R0TR-R 6.00 17.0 16.50 .0046 20.62 1. Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc 2. DC current for an approximate temperature change of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Peak current for approximately 30% rolloff. 4. Values @ 20°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300KHz neccessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. Dimensions–mm RECOMMENDED PCB PAD LAYOUT TOP VIEW 10.00 1 HC2 - XXX wwllyy R 2 19.0 max 19.00 9.5 typ 5.50 5.50 19.2 max FRONT VIEW SCHEMATIC 1 12.7 max 2 3.5 typ 2.3 typ Packaging information (mm) Bulk packaging: 45 parts per tray Tape and reel packaging: 110 parts per 13” diameter reel 1.5Dia +0.10 -0.00 4.0 2.0Dia min 2.0 A 1.75 R0.5 ref 20.2 Ao= 19.3mm Bo= 19.3mm Ko= 12.9mm B Bo Ko SECTION A-A 2 www.eaton.com/elx HC2-xxx wwllyy R Ao 40.4 +/-0.1 0 A 32 User direction of feed 44.0 +/-0.3 0 HC2 High current power inductors Technical Data 4109 Effective October 2015  Rolloff INDUCTANCE VERSUS SATURATION CURRENT 100 90 80 % of OCL 70 60 50 40 30 20 10 0 0 20 Core loss 60 80 100 % of ISAT 120 140 160 180 200 IRMS DERATING WITH CORE LOSS 0 20 40 50 60 Hz 0K 10 Hz Hz 0K 0K 20 0K 50 30 Hz 80 Hz 70 1M % of Losses from Irms (maximum) 40 90 92 94 95 96 97 98 99 10 20 30 40 50 60 80 100 200 300 % of Applied Volt-μ-Seconds 400 500 600 800 1000 www.eaton.com/elx 3 HC2 High current power inductors  Technical Data 4109 Effective October 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3