TSH193
Taiwan Semiconductor
Pull-up Resistor Integrated Hall Effect Latch
DESCRIPTION
FEATURES
TSH193 Hall-effect sensor is a temperature stable,
stress-resistant sensor. Superior high-temperature
performance is made possible through a dynamic
offset cancellation that utilizes chopper-stabilization.
This method reduces the offset voltage normally
caused by device over molding, temperature
dependencies, and thermal stress.
TSH193 includes the following on a single silicon chip:
voltage regulator, Hall voltage generator, small-signal
amplifier, chopper stabilization, Schmitt trigger, Pull-up
resistor output. Advanced DMOS wafer fabrication
processing is used to take advantage of low-voltage
requirements, component matching, very low inputoffset errors, and small component geometries.
This device requires the presence of both south and
north polarity magnetic fields for operation. In the
presence of a south polarity field of sufficient strength,
the device output sensor on, and only switches off
when a north polarity field of sufficient strength is
present.
●
Chopper stabilized amplifier stage.
●
Optimized for BLDC motor applications.
●
Reliable and low shifting on high Temp condition.
●
Pull-up resistor integrated
●
ESD Protection >4kV HBM
●
Compliant to RoHS Directive 2011/65/EU and in
●
Halogen-free according to IEC 61249-2-21
TO-92S
accordance to WEEE 2002/96/EC
definition
APPLICATION
●
High temperature fan motor
●
3 phase BLDC motor application
●
Speed sensing, position sensing
●
Revolution counting
●
Solid-state switch
●
Angular position detection
●
Proximity detection
SOT-23
Pin Definition:
1. VCC
2. Ground
3. Output
Pin Definition:
1. VCC
2. Output
3. Ground
Notes: Moisture sensitivity level: level 3. Per J-STD-020
TYPICAL APPLICATION CIRCUIT
1
Version: B1608
TSH193
Taiwan Semiconductor
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Supply voltage
VCC
18
V
Output current
IOUT
13
mA
Unlimited
Gauss
Magnetic flux density
Operating Temperature Range
TOPR
Storage temperature range
TSTG
Maximum Junction Temperature
-40 to +125
o
-55 to +150
o
150
o
TJ
TO-92S
Package Power Dissipation
SOT-23
C
C
C
606
PD
mW
230
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TO-92S
Thermal Resistance - Junction to Case
SOT-23
TO-92S
Thermal Resistance - Junction to Ambient
SOT-23
LIMIT
UNIT
206
RӨJC
o
C/W
543
148
RӨJA
o
C/W
410
2
Note: Considering 6 cm of copper board heat-sink
ELECTRICAL SPECIFICATIONS
(DC Operating Parameters:TA=+25oC, VCC=12V)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
2.5
--
16
V
Supply Voltage
Operating
Supply Current
BBOP
--
--
400
mV
Output Leakage Current
IOFF BBOP
Hi
Low
South pole
B
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