UCD32C12L01

UCD32CXXL01 SERIES Electrostatic Discharged Protection Devices (ESD) Data Sheet Description The UCD32CXXL01 is an ultra low capacitance TVS array designed to Protect high speed data interfaces. This series has been specifically Designed to protect sensitive components which are connected to data an transmission lines from overvoltage caused by electrostatic discharge (ESD),cable discharge events (CDE) and lightning. The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient current to ground. The internal TVS diode clamps the transient voltage to a safe level. The ultra low capacitance array configuration allows the user to protect up to the high speed data lines. These devices are in a signal package, RoHS/WEEE compliant, SOD-323 package. It measures 2.5×1.25×1.0mm. The series devices may be used to meet the immunity requirements of IEC61000-4-2 (ESD), IEC61000-4-4 (EFT) and IEC61000-4-5 (Surge). Features ● ● ● ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 30KV Air, 30KV contact compliance SOD-323 surface mount package Protects one I/O line Peak power dissipation of 220W under 8/20μs waveform Working voltage: 8V,12V,15V,24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Pin Configuration Applications ● ● ● ● ● USB 2.0 and USB 3.0 interface 10/100/1000 Ethernet Personal digital assistants (PDA) Serial ATA protection Digital visual interface (DVI) Revision:ESD-UCD32CXXL01 SERIES-001(A1) ● ● ● ● Wireless system devices Handhelds and notebooks Digital cameras RF interface 1/5 http://brightking.pulseelectronics.com UCD32CXXL01 SERIES Maximum Ratings Rating Symbol Value ESD voltage (Contact discharge) Unit ±30 VESD kV ESD voltage (Air discharge) ±30 Storage & operating temperature range TSTG ,TJ ℃ -55~+150 Electrical Characteristics (TA=25℃) UCD32C08L01 (Marking: BC) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 8 V VBR IBR=1mA 8.5 V Reverse leakage current IR VR=8V 1 μA Clamping voltage (tp=8/20μs) VC IPP=15A 25 V Peak Pulse Current (tp=8/20μs) IPP 15 A Off state junction capacitance CJ 0Vdc,f=1MHz 1 2 pF Symbol Condition Typ. Max. Unit 12 V UCD32C12L01 (Marking: DC) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. VRWM VBR IBR=1mA Reverse leakage current IR VR=12V 1 μA Clamping voltage (tp=8/20μs) VC IPP=5A 28 V Peak Pulse Current (tp=8/20μs) IPP 7 A Off state junction capacitance CJ 2 pF Revision:ESD-UCD32CXXL01 SERIES-001(A1) 0Vdc,f=1MHz 2/5 13.3 V 1 http://brightking.pulseelectronics.com UCD32CXXL01 SERIES Electrical Characteristics (TJ=25℃) UCD32C15L01 (Marking: EC) Parameter Symbol Reverse stand-off voltage Condition Min. Typ. VRWM Reverse breakdown voltage Max. Unit 15 V VBR IBR=1mA 16.7 V Reverse leakage current IR VR=15V 1 μA Clamping voltage (tp=8/20μs) VC IPP=5A 35 V Peak Pulse Current (tp=8/20μs) IPP 5 A Off state junction capacitance CJ 0Vdc,f=1MHz 1 2 pF Symbol Condition Typ. Max. Unit 24 V UCD32C24L01 (Marking: HC) Parameter Reverse stand-off voltage Min. VRWM Reverse breakdown voltage VBR IBR=1mA 26.7 V Reverse leakage current IR VR=24V 1 μA Clamping voltage (tp=8/20μs) VC IPP=3A 56 V Peak Pulse Current (tp=8/20μs) IPP 3 A Off state junction capacitance CJ 2 pF 0Vdc,f=1MHz 1 Typical Characteristics Curves Figure 1. Power Derating Curve Figure 2. Pulse Waveform 110 100 90 % of Peak Power Current Peak Power Dissipation (%) 100 80 70 60 50 40 30 20 10 0 tr Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 70 60 50 40 td=t|PP/2 30 20 10 0 25 50 75 100 125 150 175 0 200 Revision:ESD-UCD32CXXL01 SERIES-001(A1) 0 5 10 15 20 25 30 t-Time (μs) TA-Ambient Temperature (℃) 3/5 http://brightking.pulseelectronics.com UCD32CXXL01 SERIES Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Condition Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) 20-40 seconds Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision:ESD-UCD32CXXL01 SERIES-001(A1) 8 minutes max. 4/5 http://brightking.pulseelectronics.com UCD32CXXL01 SERIES Dimensions (SOD-323) G E Dimension Symbol Millimeters X H 1 2 A F D B C detail X 0.50 (2X) 0.60 (2X) 2.3 Recommended Soldering Pad Layout Inches Min. Max. Min. Max. A 0.80 1.10 0.031 0.043 B - 0.10 - 0.004 C 0.20 - 0.008 - D 0.11 0.20 0.004 0.008 E 1.15 1.35 0.045 0.053 F - 0.35 - 0.014 G 1.60 1.80 0.063 0.071 H 2.40 2.60 0.094 0.102 Packaging Tape P0 P1 P2 K F B0 B W E øD0 A0 øD1 t A Reel D2 D Revision:ESD-UCD32CXXL01 SERIES-001(A1) Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ1.00±0.05 E 1.75±0.10 F 3.50±0.10 A 1.48±0.10 A0 0.80±0.10 B 3.00±0.10 B0 1.80±0.10 K 1.05±0.10 t 0.25±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS W1 5/5 http://brightking.pulseelectronics.com