U263-241N-4BQC02

6.65 [0.262] 8.34 [0.328] A1 2.20 [0.087] 2.56 [0.101] 6.00 [0.236] A12 B12 B1 11.00 [0.433] AFTER MATING 8.94 [0.352] A A 4.80 [0.189] ALL CONTACT XKB 4.30 [0.169] 4.60 [0.181] 7.50 [0.295] 1.30 [0.051] 1.00 [0.039] 5.30 [0.209] 3.16 [0.124] XKB NOTE: 1.MATERIAL SPECIFICATION: 1.HOUSING:LCP,UL94 V-0. 2.TERMINAL: COPPER ALLOY 3.MID PLATE: STAINLESS STEEL 4.FRONT SHELL: STAINLESS STEEL 5.EMI PLATE: STAINLESS STEEL 2.PLATING SPECIFICATION: 2-1.TERMINAL: Ni 50u" MIN. UNDER PLATED OVER ALL. Au PLATED ON THE FUNCTIONAL AREA OF CONTACT. (GOLD PLATING THICKNESS FOLLOW THE P/N) PLATING SPECIFICATIONS OF THE SOLDER AREA FOLLOW THE P/N 2-2.FRONT SHELL: PLATING SPECIFICATIONS FOLLOW THE P/N 2-3.MID PLATE&EMI PLATE: CLEAR ONLY 3.MECHANICAL PERFORMANCE, 3-1.INSERTION FORCE: 0.5~2.0kgf. 3-2.REMOVAL FORCE: 0.8kgf~2.0kgf. 3-3.DURABILITY: 10000 CYCLES. 4.ELECTRICAL PERFORMANCE, 4-1. VOLTAGE RATING:5 V DC/AC (RMS. max) CURRENT RATING:5 AMPS. FOR TOTAL VBUS/GND PINS; 1.25AMPS FOR CC PIN,0.25 AMPS. FOR ALL OTHER CONTACT. 4-2. LLCR: VBUS & GND PINS AND OTHER PINS: 40mΩ/PIN MAX. SHIELD: 50mΩ/MAX. LLCR MAX. CHANGE OF ALL PINS: 10mΩ. 4-3.INSULATION RESISTANCE: 100MΩ MIN 4-4.DIELECTRIC WITHSTAND VOLTAGE,AC 100V FOR 1 MINUTE. 5. ENVIRONMENTAL PERFORMANCE: OPERATING TEMPERATURE: -25°C~+85°C. 6.IR REFLOW: THE PEAK TEMPERATURE ON THE BOARD SHALL BE MAINTAINED FOR 10 SECONDS AT 260°C. 0.50 [0.020] A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 7.50 [0.295] 7.50 [0.295] 5.50 [0.217] 4.80 [0.189] 4.50 [0.177] 3.50 [0.138] 2.50 [0.098] 1.50 [0.059] 0.50 [0.020] 4XØ1.10 [Ø0.043] 4XØ0.70 [Ø0.028] 5.50 [0.217] 6.50 [0.256] 0.50 [0.020] 1.10 [0.043] 4.45 [0.175] A12 2XØ0.66 [Ø0.026] B12 0.41 [0.016] 24X0.30 [0.012] W:WHITE B:BLACK 1.26 [0.050] 1.26 [0.050] SECTION:A-A X X X DATE DESCRIPTION REVISIONS www.xk-dg.cn www.helloxkb.com REVISED APPROVED ANGLAR L≤ 4 4