MCF1210NF2-900T01

TAI-TECH TBM01-121000657 Multilayer Common Mode Choke Coils P1. MCF1210NF2-900T01 1. Scope This specification applies to Multilayer Common Mode Choke Coil, MCF Series Its Application is limited for the High speed differential transmission line like as followings. USB, LVDS, MIPI, MDDI, MHL, HDMI, DVI. Halogen Pb Halogen-free Pb-free 2. Dimensions Chip Size Size A B C P D1 1210 1.25±0.15 1.0±0.15 0.55 ±0.10 0.55±0.10 D2 0.30±0.10 0.25+0.15/-0.1 Units: mm 3. Part Numbering MCF 1210 NF2 A B C - 900 T 01 D E F Normal-mode (Differential-mode) Common-mode A: Series B: Dimension AxB C: Material Lead Free Code D: Impedance Common Mode Impedance E: Packaging T=Taping and Reel , B=Bulk(Bags) F: Rated Current 01=100mA 1 2 1 2 4 3 4 3 900=90Ω HP-4291A HP-4291A 4. Specification Tai-Tech Part Number Common Mode Test Frequency Impedance (Ω) (MHz) MCF1210NF2-900T01 90±25% Insulation Resistance (MΩ) min. DC Resistance (Ω) max. Rated Current (mA) max. 5 100 4.5 100 100 „ Impedance-Frequency Characteristics MCF1210NF2-900T01 10000 IMPEDANCE(Ohm) Rated Voltage (Vdc) max. 1000 Common Mode 100 Differential Mode 10 1 1 10 100 1000 FREQUENCY(MHz) www.tai-tech.com.tw 10000 TAI-TECH TBM01-121000657 P2. 5. Reliability and Test Condition Item Performance MCF -- -40~+85℃ (Including self-generated heat) -- Series No. Operating Temperature Test Condition Transportation Storage Temperature -40~+85℃ For long storage conditions, please see the Application Notice Measuring equipment:4291A or its equivalent Measuring jig: 16192A（or its equivalent） Impedance (Z) Measuring points: ○ 1 to○ 2 or ○ 3 to○ 4 Measuring voltage: Rated voltage Insulation Resistance Within the specified tolerance Measuring points: ○ 1 to○ 2 or ○ 3 to○ 4 DC Resistance Rated Current Test sample shall be soldered to test board and the test shall be conducted under the conditions shown in Table 2. Table 2 Per table 1. Table 1 Appearance Vibration Commom Impedance change rate Insulation resistance Solderability No remarkable Defect Within±20% 100mΩ min Vibraiton frequency range Overall amplitude 1 cycle Time 10Hz to 55Hz 1.5mm 1min.(10→55→10Hz) 2 hours X each Y Z More than 75% of terminal electrode shall be covered with fresh solder. Test sample shall be immersed into molten solder under the conditions shown in Table 3 after immersed into flux. After this, test samples shall be taken out and visually checked. The speed for immersion and taking out shall be 25 mm/s. Table 3 Solder temperature Immersion time Resistance to Soldering Heat 245℃±3℃ 4s±1s Test sample shall be immersed into molten solder after immersed into flux and preheated under the conditions shown in Table 4. After this, test samples shall be taken out and measured after kept at room temperature for 2 to 3 hours.(Note 1) The speed for immersion and taking out shall be 25mm/s. Table 4 Per table 1. Preheating Resistance to Soldering Heat 150℃, 3min. 260℃±5℃ Immersion time 10s±0.5s Steps 1 to 4 shown in Table 5 as one cycle shall be repeated 5 times. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 2 hours, them measurement shall be conducted.(Note 1) Table 5 Thermal Shock Resistance to Humidity High Temperature Load Life Test Per table 1. Step Temperature(℃) Duration (min) 1 2 -40℃+0/-3℃ Normal temp 30±3 2~3 3 4 +85℃+3/-0℃ Normal temp 30±3 2~3 Test board shall be kept in a thermo hygrostat at temperature of 40℃±2℃ and relative humidity of 90% to 95% for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted.(Note 1) Per table 1. Test board shall be kept in a thermostatic oven with temperature of 85℃±2℃ for 500+24/-0 hours while 1 to ○ 2 and ○ 3 -○ 4 with rated current. supplying ○ After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, them measurement shall be conducted.(Note 1) Per table 1. www.tai-tech.com.tw TAI-TECH TBM01-121000657 Item Performance Test Condition Test board shall be kept in an atmosphere with temperature of 85℃±2℃ for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted.(Note 1) High Temperature Life Test Per table 1. Warp : 2mm(1210),1mm(0806) Testing board : Glass epoxy-resin substrate Thickness : 0.8mm Appearance: No mechanical damage. Bending Strength P3. (Note 1) If question is found in the result of measurement, another measurement shall be conducted after test samples shall be kept for 48+/-2 hours. 6. Soldering and Mounting 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size Type A B C D1 0806 0.85±0.05 0.65±0.05 0.40 ±0.05 0.27±0.10 0.20+0.05/-0.1 0.25~0.35 0.25~0.35 0.25~0.35 D2 E F 0.5 1210 1.25±0.15 1.0±0.15 0.55 ±0.10 0.30±0.10 0.25+0.15/-0.1 0.45~0.55 0.55 0.7~0.8 G 0.25~0.35 H Units: mm PC board should be designed so that products can prevent damage from mechanical stress when warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. www.tai-tech.com.tw TBM01-121000657 P4. TAI-TECH 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. •Preheat circuit and products to 150℃ •350℃ tip temperature (max) •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING 20~40s PRE-HEATING NATURAL COOLING TEMPERATURE(° C) ( 217 60~150s 200 150 SOLDERING within 4~5s TP(260° C / 40s max.) ) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 4~5sec. 60~180s NATURAL COOLING 350 150 Over 60s 480s max. Gradual cooling 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Upper limit Recommendable Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height t 7.Packaging Information 7-1. Reel Dimension Code ψA ψB ψC ψD E W t R Dimension 178±2.0 50 min 13±0.2 21±0.8 2.0±0.5 10±1.5 2.5 max 1.0 Units: mm www.tai-tech.com.tw TAI-TECH TBM01-121000657 7-2. Tape Dimension (paper) Po:4±0.1 0 5+ 1. D: .1 t A ± :1 D1 F:3.5±0.05 P A Bo W:8.0±0.1 E:1.75±0.1 P2:2±0.05 Ko 1 0. Ao SECTION A-A Series Bo Ao Ko P t 0806 0.95±0.05 0.75±0.05 0.55±0.05 4.0±0.10 0.3 max 1210 1.40±0.05 1.15±0.05 0.65±0.05 4.0±0.10 0.3 max Units: mm 7-3. Packaging Quantity Chip size 0806 1210 Chip /Reel 10000 5000 Inner box 50000 25000 Middle box 250000 125000 Carton 500000 250000 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw P5.