SSI008000F3CH

SPECIFICATIONS FOR APPROVAL GP Customer Part No.: HELE. Part No: Application For: Products: Accepted Model: Type & Freq.: HSO531S / 8.0000MHz Sample Order No: EOS-E70083-1 SSI008000F3CH OSCILLATOR Date: 2014/07/08 Approved By : HARMONY ELECTRONICS CORP. HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. HARMONY ELECTRONICS (SUZHOU) CO.,LTD TAIPEI OFFICE: 公司:(114) 台北市內湖區堤頂大道 2 段 409 號2樓 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN TEL:886-2-26588883 FAX:886-2-26588683 TAIWAN FACTORY: 工廠:(831) 高雄市大寮區大發工業區華東路 39 號 No.39, HWA DONG RD., DALLIAO DIST.,DAFA INDUSTRIAL PARK., KAOHSIUNG CITY 831, TAIWAN TEL: (07)787-1555-6 FAX: (07)787-1557 THAILAND FACTORY: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 70110, THAILAND TEL: (032)221994-6, 200740-1 FAX: (032)200742 Tittle SHENZHEN FACTORY: 深圳市福永鎮塘尾村塘橋路聚源 工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: 0755-27309272 / 27309262 FAX: 0755-27309755 Country of origin HSO531S SPECIFICATION Date SUZHOU FACTORY: 蘇州市相城區黃埭鎮安民路 5 號 NO.5 ANMING ROAD, HUANGDAI TOWN, XIANGCHENG DISTRCT, SUZHOU CITY, JIANGSU PROVINCE TEL:86-512-67592373 FAX:86-512-67592363 Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 1 HSO531S SPECIFICATION INDEX ITEM PAGE 1. Type．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 3 2. Output Frequency．．．．．．．．．．．．．．．．．．．．．．．．． 3 3. Absolute Maximum Ratings．．．．．．．．．．．．．．．．．．．． 3 4. Electric Specifications．．．．．．．．．．．．．．．．．．．．．．． 3-4 5. Dimensions．．．．．．．．．．．．．．．．．．．．．．．．．．．． 5 6. Inside Structure．．．．．．．．．．．．．．．．．．．．．．．．．． 6 7. Mechanical Performance．．．．．．．．．．．．．．．．．．．．． 6 8. Environment Performance．．．．．．．．．．．．．．．．．．．．． 7 9. Supplement．．．．．．．．．．．．．．．．．．．．．．．．．．．． 8-9 10. Taping and Packing．．．．．．．．．．．．．．．．．．．．．．．． 10-12 11. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．．． 13 12. Environmental Workload Chemical Substance Components List． 14 Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 2 1. Type Name： HSO531S 2. Output Frequency： 8.000000 MHz 3. Absolute Maximum Ratings： Item Symbol Vdd terminal voltage Vdd Input terminal voltage Vcont Output terminal voltage Vout Output terminal current Iout Storage temp. range Tstr 4. Value -0.5 ~ 7.0 -0.5 ~ Vdd+0.5 -0.5 ~ Vdd+0.5 15 -55~125 Unit V V V mA deg.C Electric Specifications： Item Symbol Min -30 -10 3.0 Value Typ 25 3.3 Max +30 70 3.6 Unit Etc Condition Vdd Temp Frequency Stability Δf/F ppm 3.3+/Operating temp. range Topr ℃ 0.3V Supply voltage Vdd V Current consumption 1 Idd1 25 mA (#1 pin: open or "H") Current consumption 2 Idd2 0.05 mA (#1 pin: "L" level) Fig1,2 3.3V Symmetry Duty 40 50 60 % Low level output voltage Vol 0.1xVdd V High level output voltage Voh 0.9xVdd V Rise & Fall time Tr & Tf 10 ns Pin #1 options YES Output load C-MOS CL =30pF (Idd1, Idd2 test at No Load) Low level input current Iil -100 μA High Level input current Iih 100 μA Low level input voltage Vil 0.3xVdd V High level input voltage Vih 0.7xVdd V Fig3 3.3V 100 ns Output disable time Tplz 5 ms Output enable time Tpzl Aging -5 5 ppm/year F : Output Frequency Drive level Δf =Oscillation Frequency - F Frequency Stability is inclusive of 25℃ Tolerance, operating temperature range, input voltage change, Load change, first of aging, shock and vibration. Moisture Sensitivity Level: Level 1 Tittle 25+/3℃ 25+/3℃ Country of origin HSO531S SPECIFICATION Date -10~70 ℃ Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 3 Fig. 1) Measurement Circuit ： CL = Include jig & probe capacitance (Refer to 4) Switch H Open L Out term. Oscillation out Oscillation out High Z Fig. 2) Output Wave Form： Fig. 3) Input Output Condition： Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 4 5. Dimensions： 5.0±0.2 Frequency 3 4 Pin Connections 3.2±0.2 1 H.ELE. YM 1 OE(Output Enable) 2 3 GND Output 4 Vdd 2 1.3 max. 1.4 3 2.2 4 1.2 1.34 0.8 1.0 1.2 2 1 1 2 1.2 2.54 4 3 Lot No.： Year : Last digit of the year Year Code 2000 2010 0 2001 2011 1 2002 2012 2 2003 2013 3 2004 2014 4 2005 2015 5 2006 2016 6 2007 2017 7 2008 2018 8 2009 2019 9 Month : Alphabet assign below Month Code 1 A 2 B 3 C 4 D 5 E 6 F 7 G 8 H 9 J 10 K 11 L 12 M Marking : Laser marking Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 5 6. Reference drawing (1) Base: Alumina Ceramic (Al2O3) Metallized Pad: W Ni Plating Au Plating (2)IC: IC (Si. Al.) (3) Au Bonding Wire: Au (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) LID: Fe+Ni+Co (6) Adhesive Silver Conductive Silicon Resin (7) Electrode Inside Structure： 7 5 6 6 5 3 2 4,7 4 2 1 3 1 The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included in this item. 7. Mechanical Performance: Item 1 Natural Drop 2 Vibration 3 Sealing Tightness 4 Solder ability Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. (1) Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak detector. – Fine Leakage. (2) Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes, no gas bubble observed from the inside of the can. After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. Tittle A A --- B Country of origin HSO531S SPECIFICATION Date Specifications Code Test Methods Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 6 8. 1 2 3 4 5 Environment Performance： Test Methods Humidity Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. -30deg.C +/-2deg.C (30min)  +80deg.C +/-2deg.C (30min) 25 cycles. Temp. increasing or reducing time need to be within 3 minutes. Back to the room temperature first, then in 1~2 hours, the component shall be checked. +85deg.C +/-2deg.C, +3.3V Vdd Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. Storage in Low Temperature Storage in High Temperature Temperature cycles High Temperature Operation Specifications code A B A A A A A Specifications Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after the test More than 90% of lead shall be covered by new solder. Tittle Country of origin HSO531S SPECIFICATION Date Specifications Code Item Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 7 9. Supplement： 9.1.Please stay with our proposed reflow condition and do then soldering 2 times max. Available for Lead Free Soldering Temperature 260 deg.C 220 deg.C (3) 160~180deg.C (2) (1) Time (1) Preheat 160~180 deg.C 120sec. (2) Primary heat 220 deg.C 60sec. (3) Peak 260 deg.C 10sec. Max. 9.2.Land Pattern Layout： (Example) 9.3.Solder Iron： (Example) Bit temp.:350deg.C Max. , Time: 3sec Max. , Each terminal solder a 1 time Max. Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 8 9.4.Mounting： This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be sure Of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering process. Avoid mounting and processing by Ultrasonic welding because this method has a Possibility of an excessive vibration spreading inside the crystal products and Becoming the cause of characteristic deterioration and not oscillating. 9.5.Cleaning： Cleaning liquid which corrodes Nickel shall not be used. It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 9.6.Handling： HSO531S series is designed to withstand Drop and Vibration, however, the crystal blank might be broken. So, if excess force is given, please check the characteristics before use. HSO531S series has C-MOS circuit inside. Please pay attention to static-electricity as Same handling as other C-MOS. devices. 9.7.By-pass Capacitor： It has no by-pass capacitor integrated. We recommend you to use capacitor (like ceramic chip capacitor) 0.01μF in-between Vdd and GND. 9.8.Storage： Please keep away from high temperature and high humidity, which may cause put solderbility. No direct Sunlight, No dew as well. Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 9 10. Taping and Packing： 10.1.Emboss Tape Specifications： 10.2.Reel Specifications： Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 10 (Table-2) (UNIT: mm) MARK DIMENSIONS‧ANGLE Diameter A ψ180+0/-3 Inner Width W1 12.8+/-0.3 Outer Width W2 15.5+/-1.0 Out Line diameter B ψ60.5+/-0.5 F1 3.0+0.5/-0 F2 4.0+0.5/-0 F3 5.0+0.5/-0 Q 120deg C ψ13.2+/-0.5 E 3.0+/-0.2 ITEM FLANCE HUB Width Center Core slit Position Spindle diameter Key Ditch Width 10.3.Storage： Temperature+40deg.C Max. Humidity 80% Max. 10.4.Quantity on Reel： 1,000 PCS/REEL 10.5.Label： Label is following information： Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 11 10.6. PACKAGE： TYPE: SPEC. No.: Parts No.: Lot No.: Label Up side(Produce) Q.C PASS H10 FREQ.: Q'TY: MHz PCS HSF HARMONY ELECTRONICS CORP. Under side(Fixing Hole) One reel quantity: [1000pcs]&[3000pcs] 1 Top and bottom with 2.3cm thickness foam-rubber cushion for protection 2 Carton's Q'TY:1~15 pcs. 3 Carton Type=A,B ,C use 4 trigon pillar to fasten the Reel. 4 Need to add 3 pages dry agent in each outer box. use 4 trigon pilla OR Green Product ROHS Compliant A Carton Type B C 630/531/ 321/221 Produce Type 840/751 421 211/111 Reel Gree n Pr oduc ROHS t Co mp lia D OTHER 15 15 15 1~7 200 200 200 195 200 200 200 195 230/260 230 230 150 nt 1.Every Carton with 3 desiccant. 2.Top and bottom with 2.3cm thickness foam-rubber cushion for protection Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 12 11. Flow Chart： LID(外 殼 蓋 ) BLANK(晶 片 ) LID進 料 檢 查 1 2 Incoming Inspection of LID LID洗 淨 BLANK進 料 檢 查 7 8 Cleaning of LID BASE(基 座 ) 9 10 4 Incoming Inspection of BLANK IC BASE進 料 檢 查 3 Incoming Inspection of BASE IC進 料 檢 查 Incoming Inspection of IC 化學蝕刻 Etching 頻率選別 5 Sorting of Freq. IC 搭 載 IC Mounting 晶片排盤 Blank Array 6 打 金 線 ($) Wire Bonding 蒸著前洗淨 11 12 13 14 15 16 17 18 Cleaning before Base Plating 微蝕刻 Flash Etching 基礎蒸著 Base Plating 押入接著 Blank Ass'y 接著硬化 Adhesive Curing 接著檢查 Bonding Check 調整蒸著 Partial Adjustment 中 間 檢 查 ($) Middle Check 19 20 25 高真空烘烤 High Vacuum Annealing 26 氣 密 檢 查 II(氦 氣 加 壓 ) Leak Check II (Helium Pressurization) 氣 密 檢 查 II(HE) Leak Check II 熔 接 Seam Seal 溫 度 特 性 檢 查 (C) 21 REFLOW 1 22 老 化 Aging 23 印 字 +外 觀 檢 查 Check of Temp. Characteristics 27 最 終 檢 查 ($) Final Check Marking& Check DLD檢 查 (C) 28 外觀檢查 29 出貨檢查 30 Tapping/Packing Appearance Check Check of DLD REFLOW 2 (C) 24 氣 密 檢 查 I (AIR) Leak Check I ($)： 特 殊 特 性 (For Special Characteristics) (C)： 指 定 製 程 (Arranged for customer requirement) 出 貨 Shipment Tittle Country of origin HSO531S SPECIFICATION Date Outgoing Inspection Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 13 12. Environmental Workload Chemical Substance Components List Environmental Workload Chemical Substance Components List TYPE PERCENTAGE HSO531S 56(mg) ppm WOLFRAM AND ITS COMPOUND(W) 6.739 4312.960 COBALT AND ITS COMPOUND(Co) 3.082 1972.480 CHROMIUM AND ITS COMPOUND(Cr) 0.000 0.000 SILVER(Ag) 0.986 631.040 COPPER(Cu) 0.179 114.560 NICKEL AND ITS COMPOUND(Ni) 6.849 4383.360 MANGANESE AND ITS COMPOUND(Mn) 0.025 16.000 MOLYBDENUM AND ITS COMPOUND(Mo) 0.111 71.040 SILICON AND ITS COMPOUND(Si) 1.518 971.520 28.820 18444.800 0.691 442.240 Chemical Substance Components ALUMINIUM AND ITS COMPOUND(Al) GOLD(Au) Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 14 REV. DATE REASON No. 0 2014/07/08 New CONTENTS Tittle Country of origin HSO531S SPECIFICATION Date Confirm 2014/07/08 F. S. TSAI Check Prepare C. L. WANG U. F. CHEN HARMONY TAIWAN Spec. No. FACTORY Rev. Page SSI008000F3CH ELECTRONICS CORP. 0 15