HPC8040NF-4R7MTH

TAI-TECH P1 SMD Power Inductor HPC8040NF-Series ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 14/08/07 新發行 楊祥忠 詹偉特 徐允珮 備 註 TAI-TECH P2 SMD Power Inductor HPC8040NF-Series 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free Recommendend Land pattern 2R2 B(mm) B’(mm) C(mm) D(mm) E(mm) F(mm) L(mm) G(mm) H(mm) HPC8040NF 8.0±0.3 8.0±0.3 Series A(mm) 6.3±0.2 3.7±0.3 2.0±0.3 6.0±0.3 5.5±0.3 8.5 5.3 6.3 3. Part Numbering HPC 8040 N A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance . - 2R2 Y D E A/B*C 2R2=2.20uh 100=10uh,101=100uh,102=1000uh K=±10%,M=±20%,Y=±30%. marking direction cannot decide polarity. Color: Black, unidirectional magnetic shielding TAI-TECH P3 4. Specification Part Number Inductance L0 (uH) @0A Rated current Tolerance Tempetature current I rms (A) Saturation current I sat (A) Typ Max Typ Max DCR (mΩ) @25℃ ±20%. HPC8040NF-1R0YTH 1.00 ±30% 8.50 8.00 13.80 13.00 8.2 HPC8040NF-1R4YTH 1.40 ±30% 8.20 7.80 11.80 11.20 10.0 HPC8040NF-1R5YTH 1.50 ±30% 8.00 7.70 11.50 11.00 10.0 HPC8040NF-2R2YTH 2.20 ±30% 7.40 6.90 9.80 9.20 11.5 HPC8040NF-3R3YTH 3.30 ±30% 6.60 6.20 8.00 7.50 15.0 HPC8040NF-4R7MTH 4.70 ±20% 5.80 5.30 6.70 6.00 19.5 HPC8040NF-5R6MTH 5.60 ±20% 5.40 5.20 6.20 5.80 22.0 HPC8040NF-6R8MTH 6.80 ±20% 5.10 5.00 5.60 5.10 25.0 HPC8040NF-100MTH 10.0 ±20% 4.60 4.20 5.00 4.30 33.0 HPC8040NF-150MTH 15.0 ±20% 3.60 3.20 4.00 3.60 50.0 HPC8040NF-220MTH 22.0 ±20% 2.90 2.45 3.10 2.80 73.0 HPC8040NF-330MTH 33.0 ±20% 2.30 2.10 2.60 2.10 100 HPC8040NF-470MTH 47.0 ±20% 2.00 1.70 2.20 1.90 135 HPC8040NF-560MTH 56.0 ±20% 1.75 1.60 1.90 1.60 160 HPC8040NF-680MTH 68.0 ±20% 1.65 1.50 1.75 1.50 205 HPC8040NF-820MTH 82.0 ±20% 1.40 1.30 1.60 1.40 230 HPC8040NF-101MTH 100 ±20% 1.20 1.10 1.45 1.20 300 HPC8040NF-121MTH 120 ±20% 1.10 1.00 1.30 1.10 350 HPC8040NF-151MTH 150 ±20% 0.98 0.90 1.20 1.03 410 HPC8040NF-181MTH 180 ±20% 0.91 0.83 1.04 0.94 490 HPC8040NF-221MTH 220 ±20% 0.85 0.76 0.99 0.90 610 Note: 1. All test data referenced to 25℃ ambient , Ls:1MHz/1V. 2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. 3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.). 4. Saturation Current (Isat) will cause L0 to drop 30% typical. (keep quickly). 5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P4 5. Material List b a c d NO Items Materials a Core Ferrite Core b Wire Copper Wire c Coating Epoxy with magnetic d Solder Lead free 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH502BC,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L30% typical. Saturation DC Current (Isat) will cause L0 to drop △L(%)(keep quickly). Heat Rated Current (Irms) Approximately △T≦40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Life Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature：125±2℃(Bead) Temperature： 85±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Load Humidity Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：105±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Vibration Shock Bending Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,