UHP252010NF-R68M

P1 TAI-TECH Power Inductor UHP252010NF-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 12/12/19 新 發 行 楊祥忠 詹偉特 林宜蕰 1.1 13/03/09 加入 R68 感值 楊祥忠 詹偉特 林宜蕰 備 註 www.tai-tech.com.tw P2 TAI-TECH Power Inductor UHP252010NF-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free B A D E D C Series A(mm) B(mm) C(mm) D(mm) E(mm) UHP252010NF 2.5 -0.1/+0.3 2.0 -0.05/+0.35 1.02max. 0.85 ref. 0.80 ref. Units: mm 3. Part Numbering UHP 252010 NF A B - 4R7 M D E C A: Series B: Dimension C: Lead Free Material D: Inductance E: Inductance Tolerance 4R7=4.7uH M=±20% 4. Specification TAI-TECH Part Number Inductance (uH) Tolerance (%) Test Frequency (Hz) UHP252010NF-R47M 0.47 ±20% 0.1V/1M 0.030 2.85 UHP252010NF-R68M 0.68 ±20% 0.1V/1M 0.039 UHP252010NF-1R0M 1.0 ±20% 0.1V/1M 0.055 UHP252010NF-1R5M 1.5 ±20% 0.1V/1M UHP252010NF-2R2M 2.2 ±20% UHP252010NF-3R3M 3.3 UHP252010NF-4R7M DCR I sat I sat (Ω) ±20% (A) typ. (A) Max. I rms (A) typ I rms (A) Max. 2.57 2.80 2.50 2.70 2.45 2.40 2.20 2.20 1.89 2.20 1.80 0.075 1.90 1.58 1.80 1.50 0.1V/1M 0.100 1.62 1.39 1.68 1.30 ±20% 0.1V/1M 0.145 1.30 1.17 1.34 1.10 4.7 ±20% 0.1V/1M 0.215 1.20 1.08 1.10 1.00 UHP252010NF-6R8M 6.8 ±20% 0.1V/1M 0.315 0.90 0.77 0.90 0.80 UHP252010NF-100M 10 ±20% 0.1V/1M 0.420 0.73 0.65 0.82 0.65 UHP252010NF-150M 15 ±20% 0.1V/1M 0.600 0.55 0.50 0.55 0.50 UHP252010NF-220M 22 ±20% 0.1V/1M 0.830 0.50 0.40 0.40 0.35 Note: Isat：Based on inductance change （△L/L0：≦-30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃.） www.tai-tech.com.tw P3 TAI-TECH UHP252010NF-R47 1 UHP252010NF-R68 1.2 0.8 Inductance(uH) Inductance(uH) 0.9 0.6 0.4 0.6 0.3 0.2 0 0 1 2 3 DCcurrent(A) 0 4 0 UHP252010NF-1R0 2 1.8 DCcurrent(A) 2.4 3 2 Inductance(uH) Inductance(uH) 1.2 UHP252010NF-1R5 2.5 1.5 1 1.5 1 0.5 0.5 0 0 0 0.5 1 1.5 2 DCcurrent(A) 2.5 0 0.4 UHP252010NF-2R2 4 0.8 1.2 DCcurrent(A) 1.6 2 UHP252010NF-3R3 6 5 Inductance(uH) 3 Inductance(uH) 0.6 2 1 4 3 2 1 0 0 0.3 0.6 0.9 DCcurrent(A) 1.2 1.5 0 1.8 0 UHP252010NF-4R7 8 0.6 0.9 DCcurrent(A) 1.2 1.5 UHP252010NF-6R8 10 8 Inductance(uH) 6 Inductance(uH) 0.3 4 2 6 4 2 0 0 0 0.3 0.6 0.9 DCcurrent(A) 1.2 1.5 0 www.tai-tech.com.tw 0.2 0.4 0.6 DCcurrent(A) 0.8 1 P4 TAI-TECH UHP252010NF-100 15 12 20 Inductance(uH) Inductance(uH) UHP252010NF-150 25 9 6 3 15 10 5 0 0 0.2 0.4 0.6 0.8 DCcurrent(A) 1 0 0 0.2 0.4 DCcurrent(A) 0.6 0.8 UHP252010NF-220 35 Inductance(uH) 28 21 14 7 0 0 0.1 0.2 0.3 DCcurrent(A) 0.4 0.5 0.6 5. Material No. Description Specification a. Core Ferrite N4 Core b. Coating Epoxy c Termination Tin Pb Free d Wire Enameled Copper Wire 6. Reliability and Test Condition Item Operating Temperature Performance Test Condition -40~+85℃(For products in unopened tape package, less than 40℃) Electrical Performance Test Inductance L Agilent-4291, Agilent-4287 Agilent-4192, Agilent-4285 Q Refer to standard electrical characteristic list SRF Agilent-4291 DC Resistance Agilent-4338 Rated Current Temperature Rise Test Base on temp. rise & △L/L0A≦30%. Saturation DC Current (Isat) will cause L0 to drop approximately △L(%). ΔT 40℃Max Heat Rated Current (Irms) will cause the coil temperature rise approximately △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer www.tai-tech.com.tw P5 TAI-TECH Item Performance Test Condition Mechanical Performance Test Resistance to Soldering Heat 1. Inductors shall be no evidence of electrical and mechanical damage. MIL-STD-202 2. Inductance : within ±10% of initial value METHOD 210 Temp.: 260±5℃ Time: 10±1.0 Sec Preheating Dipping Natural cooling 235° C Solderability Test More than 95% of terminal electrode should be covered with solder. 150° C 4±1 second 60 second ANSI/J-STD-002 After fluxing,component shall be dipped in a melted solder bath at 235±5℃ for 4±1seconds. Reliability Test Humidity Test 1.Temperature：40±2℃ MIL-STD-202 2.Humidity：90 ~ 95% METHOD 103 3.Time：504 ±8hrs 4.Measured at room temperature after placing for 2 to 3 hrs Conditions for 1 cycle Step Temperature(℃) MIL-STD-202 1 -55±2 30±3 METHOD 107 2 Room Temperature Within5 2 85±5 30±3 Thermal Shock Test Times(min.) 1.Visual examination：No mechanical damage Total:100 cycles 2.Inductance：within±10% of initial value Measured at room temperature after placing for 2 to 3 hrs 1.Temperature：85±2℃ High Temperature Life Test 2.Time：500±8hrs MIL-STD-202 3.Measured at room temperature after placing METHOD 108 for 2to3 hrs 1.Temperature:40±2℃ 2.Humidity:90~ 95% 3.Time:500±8hr. 4.Recovery:2 to 3hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance Test MIL-STD-202 METHOD 103 1.Temperature：-40±2℃ Low temperature 2.Time：500±8hrs Storage Test 3.Measured at room temperature after placing JESD22-A119 for 2to3 hrs Frequency: 10-55-10Hz for 15 min. Amplitude: 1.52mm Random Vibration Test Appearance: Cracking, shipping and any other defects harmful to the Directions and times: MIL-STD-202 characteristics should not be allowed. X, Y, Z directions for 15 min. Method 204 Impedance: within±30% This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). www.tai-tech.com.tw P6 TAI-TECH 7. Soldering and Mounting 7-1. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-1.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 7-1.2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING 20~40s PRE-HEATING NATURAL COOLING TEMPERATURE(°C) ( 217 60~150s 200 150 SOLDERING within 4~5s TP(260° C / 40s max.) ) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5 sec. 60~180s NATURAL COOLING 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max. Iron Soldering times: 1 times max. Fig.1 Fig.2 7-2. Recommended PC Board Pattern H L L(mm) G(mm) H(mm) 2.9 0.8 2.4 G www.tai-tech.com.tw P7 TAI-TECH 8. Packaging Information 8-1. Reel Dimension C B D A Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 8.4±1.0 50 min. 13±0.8 178±2 8-2. Tape Dimension / 8mm 7"x8mm t P Ao Bo Po:4±0.1 W:8.0±0.1 P2:2±0.05 Series Size UHP 252010 Bo(mm) Ao(mm) Ko(mm) P(mm) 3.10±0.1 2.45±0.1 1.40±0.1 4.0±0.1 t(mm) 0.23±0.05 Ko 8-3. Packaging Quantity Chip size 252010 Chip / Reel 2000 8-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw