CMT2210/17LB
CMT2217B
CMT2210/7LB
CMT2217B
300 – 920 MHz OOK Standalone RF Receiver
Features
Applications
Embedded EEPROM
Low-Cost Consumer Electronics Applications
Frequency Range 300 to 920 MHz
Home and Building Automation
Data Rate: 0.1 to 40 kbps
Infrared Receiver Replacements
Sensitivity: -113 dBm at 1 kbps, 0.1% BER
Industrial Monitoring and Controls
Configurable Receiver Bandwidth: 50 to 330 kHz
Remote Automated Meter Reading
3-wire SPI Interface for EEPROM Programming
Remote Lighting Control System
Stand-Alone, No External MCU Control Required
Wireless Alarm and Security Systems
Configurable Duty-Cycle Operation Mode
Remote Keyless Entry (RKE)
Rx Active and System Clock Output
Supply Voltage: 1.8 to 3.6 V
Low Power Consumption: 3.8 mA
Low Sleep Current
Ordering Information
60 nA when Sleep Timer Off
440 nA when Sleep Timer On
RoHS Compliant
16-pin QFN 3x3 and SOP8 Packages
Frequency
Package
CMT2217B-EQR
300 - 920 MHz
QFN16(3x3)
5,000 pcs
CMT2210LB-ESR
300 - 480 MHz
SOP8
2,500 pcs
CMT2217LB-ESR
300 - 920 MHz
SOP8
2,500 pcs
Part Number
MOQ
Descriptions
The CMT221xB/LB device is an ultra-low power, high
performance, low-cost OOK stand-alone RF receiver for
various 300 to 920 MHz wireless applications. It is part of
the CMOSTEK NextGenRFTM family, which includes a
complete line of transmitters, receivers and transceivers. An
embedded EEPROM allows the frequency, data rate and
QFN16 (3X3)
SOP8
other features to be programmed into the device using the
CMOSTEK USB Programmer and RFPDK. Alternatively, in
GND
14
13
12 NC
SDA
2
11 NC
SCL
3
10 NC
NC
4
9
SDA
1
SCL
22
8
CSB
7
2
VDD
timer. The CMT221xB/LB receiver together with the
CMT211x transmitter enables an ultra-low cost RF link.
5
6
7
8
NC
CMT2210L-S
XIN
working in duty-cycle operation mode via the built-in sleep
15
1
GP0
receiving sensitivity. It consumes even less power when
16
CSB
DOUT
consumes only 3.8 mA current while achieving -113 dBm
RFIN
programming. When the CMT221xB/LB is always on, it
VDD
immediate demands without the need of EEPROM
GND
stock products of 433.92 / 868 MHz is available for
NC
DOUT
3
6
GND
XIN
4
5
2
RFIN
CMT2217B CMT221xLB Top View
Copyright © By CMOSTEK
Rev 0.8 | Page 1/25
www.cmostek.com
CMT2210/17LB
CMT2217B
Abbreviations
Abbreviations used in this data sheet are described below
AGC
Automatic Gain Control
PC
Personal Computer
AN
Application Notes
PCB
Printed Circuit Board
BER
Bit Error Rate
PLL
Phase Lock Loop
BOM
Bill of Materials
PN9
Pseudorandom Noise 9
BSC
Basic Spacing between Centers
POR
Power On Reset
BW
Bandwidth
PUP
Power Up
DC
Direct Current
QFN
Quad Flat No-lead
EEPROM
Electrically Erasable Programmable Read-Only
RF
Radio Frequency
Memory
RFPDK
RF Products Development Kit
ESD
Electro-Static Discharge
RoHS
Restriction of Hazardous Substances
ESR
Equivalent Series Resistance
RSSI
Received Signal Strength Indicator
Ext
Extended
Rx
Receiving, Receiver
IF
Intermediate Frequency
SAR
Successive Approximation Register
LNA
Low Noise Amplifier
SOP
Small Outline Package
LO
Local Oscillator
SPI
Serial Port Interface
LPOSC
Low Power Oscillator
TH
Threshold
Max
Maximum
Tx
Transmission, Transmitter
MCU
Microcontroller Unit
Typ
Typical
Min
Minimum
USB
Universal Serial Bus
MOQ
Minimum Order Quantity
VCO
Voltage Controlled Oscillator
NP
Not Placed
WOR
Wake On Radio
NP0
Negative-Positive-Zero
XOSC
Crystal Oscillator
NC
Not Connected
XTAL/Xtal
Crystal
OOK
On-Off Keying
Rev 0.8 | Page 2/25
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CMT2210/17LB
CMT2217B
Table of Contents
1. Electrical Characteristics ............................................................................................................................................ 4
1.1 Recommended Operation Conditions ................................................................................................................... 4
1.2 Absolute Maximum Ratings .................................................................................................................................. 4
1.3 Receiver Specifications ......................................................................................................................................... 5
1.4 Crystal Oscillator ................................................................................................................................................... 6
1.5 LPOSC .................................................................................................................................................................. 6
2. Pin Descriptions .......................................................................................................................................................... 7
2.1 CMT2217B Pin Description ................................................................................................................................... 7
2.2 CMT2210/17LB Pin Description ............................................................................................................................ 8
3. Typical Application Schematic ................................................................................................................................... 9
4. Functional Descriptions ............................................................................................................................................ 11
4.1 Overview ............................................................................................................................................................. 11
4.2 Modulation, Frequency and Data Rate ................................................................................................................ 12
4.3 Embedded EEPROM and RFPDK ...................................................................................................................... 12
4.4 All Configurable Options ..................................................................................................................................... 12
4.5 Internal Blocks Description .................................................................................................................................. 14
4.5.1
4.5.2
RF Front-end and AGC ............................................................................................................................ 14
IF Filter..................................................................................................................................................... 14
4.5.3
4.5.4
4.5.5
4.5.6
4.5.7
RSSI ........................................................................................................................................................ 15
SAR ADC ................................................................................................................................................. 15
Crystal Oscillator ...................................................................................................................................... 15
Frequency Synthesizer ............................................................................................................................ 15
LPOSC..................................................................................................................................................... 15
4.6 Operation Mode .................................................................................................................................................. 15
4.7 Always Rx Mode ................................................................................................................................................. 16
4.8 Duty-Cycle Receive Mode ................................................................................................................................... 17
5. Ordering Information ................................................................................................................................................. 18
6. Package Outline......................................................................................................................................................... 19
6.1 QFN16 Package.................................................................................................................................................. 19
6.2 SOP8 Package.................................................................................................................................................... 20
7. Top Marking ............................................................................................................................................................... 21
7.1 CMT2217B Top Marking ..................................................................................................................................... 21
7.2 CMT2210/17LB Top Marking .............................................................................................................................. 22
8. Other Documentations .............................................................................................................................................. 23
9. Document Change List ............................................................................................................................................. 24
10. Contact Information................................................................................................................................................... 25
Rev 0.8 | Page 3/25
www.cmostek.com
CMT2210/17LB
CMT2217B
1. Electrical Characteristics
VDD = 3.3 V, TOP = 25 ℃, FRF = 433.92 MHz, sensitivities are measured in receiving a PN9 sequence and matching to 50 Ω
impedance, with the BER of 0.1%. All measurements are performed using the board CMT221xB/LB-EM, unless otherwise noted.
1.1 Recommended Operation Conditions
Table 1. Recommended Operation Conditions
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Operation Voltage Supply
VDD
1.8
3.6
V
Operation Temperature
TOP
-40
85
℃
Supply Voltage Slew Rate
1
mV/us
1.2 Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings[1]
Parameter
Symbol
Conditions
Min
Max
Unit
Supply Voltage
VDD
-0.3
3.6
V
Interface Voltage
VIN
-0.3
VDD + 0.3
V
Junction Temperature
TJ
-40
125
℃
Storage Temperature
TSTG
-50
150
℃
Soldering Temperature
TSDR
255
℃
-2
2
kV
-100
100
mA
ESD Rating
[2]
Lasts at least 30 seconds
Human Body Model (HBM)
Latch-up Current
Notes:
[1]. Stresses above those listed as ―absolute maximum ratings‖ may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
[2]. The CMT221xB/LB is a high-performance RF integrated circuit with the ESD rating over 2 kV HBM. However, handling
and assembly of this device should only be done at ESD-protected workstations.
Caution! ESD sensitive device. Precaution should be used when handling the device in order
to prevent permanent damage.
Rev 0.8 | Page 4/25
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CMT2210/17LB
CMT2217B
1.3 Receiver Specifications
Table 3. Receiver Specifications
Parameter
Symbol
Frequency Range
FRF
Data Rate
DR
S315
Sensitivity
Saturation Input Signal
Level
Working Current
Shut Down Current
Sleep Current
Frequency Synthesizer
Settle Time
Blocking Immunity@
100kHz BW, 433.92 MHz
Image Rejection Ratio
Input 3rd Order Intercept
Point
Receiver Bandwidth
Receiver Start-up Time
Conditions
Min
Typ
Max
Unit
CMT2217B/LB
300
920
MHz
CMT2210LB
300
480
MHz
0.1
40
kbps
FRF = 315 MHz, DR = 1 kbps, BER = 0.1%
-112
dBm
FRF = 433.92 MHz, DR = 1 kbps, BER = 0.1%
-113
dBm
S869[2]
FRF = 868 MHz, DR = 1 kbps, BER = 0.1%
-103
dBm
S915[2]
FRF = 915 MHz, DR = 1 kbps, BER = 0.1%
-103
dBm
10
dBm
FRF = 315 MHz
3.7
mA
FRF = 433.92 MHz
3.8
mA
FRF = 868 MHz
5.0
mA
FRF = 915 MHz
5.2
mA
60
nA
ISLEEP
When sleep timer is on
440
nA
TLOCK
From XOSC settled
150
us
DR = 1 kbps, ±1 MHz offset, CW interference
35
dB
DR = 1 kbps, ±2 MHz offset, CW interference
45
dB
DR = 1 kbps, ±10 MHz offset, CW interference
65
dB
30
dB
-23
dBm
S433.92[1]
PLVL
IDD
ISHUTDOWN
BI
IMR
IIP3
Two tone test at 10 MHz and 20 MHz offset
frequency. Maximum system gain settings
BW
TSTART-UP
50
From power up to receive, in Always Receive
Mode
330
3
kHz
Ms
Note:
[1]. The factory out default configuration of the CMT22xB/LB is optimized for wider data rate (1~5 kbps) range, with the
tradeoff of 433.92 MHz sensitivity degraded to -109 dBm. The -113 dBm sensitivity is tested with the configuration
generated by the RFPDK.
[2]. The sensitivities for the 868/915 MHz are optimized for better blocking immunity performance, as the frequencies are
close to the GSM interference.
Rev 0.8 | Page 5/25
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CMT2210/17LB
CMT2217B
1.4 Crystal Oscillator
Table 4. Crystal Oscillator Specifications
Parameter
Symbol
Crystal Frequency[1]
Crystal Tolerance
FXTAL
Conditions
Min
MHz
27.1383
MHz
FRF = 868 MHz
27.1341
MHz
FRF = 915 MHz
28.6034
MHz
±20
ppm
15
pF
XTAL Startup Time
Rm
[3]
Unit
26.2736
CLOAD
Crystal ESR
Max
FRF = 433.92 MHz
[2]
Load Capacitance
Typ
FRF = 315 MHz
60
tXTAL
400
Ω
us
Notes:
[1]. The CMT221xB/LB can directly work with external reference clock input to XIN pin (a coupling capacitor is required) with
peak-to-peak amplitude of 0.3 to 0.7 V.
[2]. This is the total tolerance including (1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature dependence.
The acceptable crystal tolerance depends on RF frequency and channel spacing/bandwidth.
[3]. This parameter is to a large degree crystal dependent.
1.5 LPOSC
Table 5. LPOSC Specifications
Parameter
Symbol
Calibrated Frequency[1]
Conditions
FLPOSC
[2]
Frequency Accuracy
After calibration
[3]
Temperature Coefficient
[4]
Supply Voltage Coefficient
Initial Calibration Time
tLPOSC-CAL
Min
Typ
Max
Unit
1
kHz
1
%
-0.02
%/°C
+0.5
%/V
4
ms
Notes:
[1]. The LPOSC is automatically calibrated to the crystal oscillator during the PUP state, and is periodically calibrated since
then.
[2]. The 1% accuracy is based on the use of 26 MHz XTAL. If the frequency of the selected XTAL is far away from 26 MHz,
the accuracy of the LPOSC after calibration might be impacted, and the parameters related to this could be impacted
correspondingly.
[3]. Frequency drifts when temperature changes after calibration.
[4]. Frequency drifts when supply voltage changes after calibration.
Rev 0.8 | Page 6/25
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CMT2210/17LB
CMT2217B
2. Pin Descriptions
VDD
GND
RFIN
GND
2.1 CMT2217B Pin Description
16
15
14
13
2
11 NC
SCL
3
10 NC
NC
4
9
5
6
7
8
XIN
SDA
NC
12 NC
GP0
1
DOUT
CSB
NC
Figure 1. CMT2217B Pin Assignments in QFN16 (3x3) Package
Table 6. CMT2217B Pin Descriptions in QFN16 (3x3) Package
Pin Number
Name
I/O
Descriptions
1
CSB
I
2
SDA
IO
3
SCL
I
4, 7, 9, 10, 11, 12
NC
NA
5
DOUT
O
Received data output
6
GP0
O
General purpose output
8
XIN
I
Crystal oscillator input or external reference clock input
13, 15
GND
I
Ground
14
RFIN
I
RF signal input to the LNA
16
VDD
I
Power supply input
3-wire SPI chip select input for EEPROM programming, internally pulled high
3-wire SPI data input and output for EEPROM programming
3-wire SPI clock input for EEPROM programming, internally pulled low
Not connected, leave floating
Rev 0.8 | Page 7/25
www.cmostek.com
CMT2210/17LB
CMT2217B
2.2 CMT2210/17LB Pin Description
SDA
1
8
CSB
SCL
22
7
2
VDD
CMT2210L-S
DOUT
3
6
GND
XIN
4
5
2
RFIN
Figure 2. CMT2210/7LB Pin Assignments
Table 7. CMT2210/7LB Pin Descriptions
Pin Number
Name
I/O
Descriptions
1
SDA
IO
2
SCL
I
3-wire SPI clock input for EEPROM programming, internally pulled low
3
DOUT
O
Received data output
4
XIN
I
Crystal oscillator input or external reference clock input
5
RFIN
I
RF signal input to the LNA
6
GND
I
Ground
7
VDD
I
Power supply input
8
CSB
I
3-wire SPI chip select input for EEPROM programming, internally pulled high
3-wire SPI data input and output for EEPROM programming
Rev 0.8 | Page 8/25
www.cmostek.com
CMT2210/17LB
CMT2217B
16
NC
9
10
11
NC
GP0
CMT2217B
VDD
DOUT
C3
1
C4
GND
VDD
7
6
5
DOUT
NC
VDD
15
NC
U1
8
4
C1
RFIN
SCL
L2
C2
14
XIN
3
L1
X1
GND
2 SDA
13
CSB
ANT
NC
NC
12
3. Typical Application Schematic
SCL
SDA
CSB
R1
Figure 3. CMT2217B Typical Application Schematic
CSB
VDD R1
1
SDA
2
SCL
3
DOUT
4
8
SDA
CSB
SCL
VDD
DOUT
GND 6
XIN
RFIN
VDD
7
C4
L1
5
X1
ANT
C3
C1
C2
L2
Figure 4. CMT2210/17LB Typical Application Schematic
Notes:
1.
Pins CSB, SDA (pull up resistor R1 is required), SCL, VDD and GND should be connected to a connector if the user requires
accessing the CMT221xB/LB EEPROM during development or manufacture.
2.
The general layout guidelines are listed below. For more design details, please refer to ―AN107 CMT221x Schematic and
PCB Layout Design Guideline‖.
Use as much continuous ground plane metallization as possible.
Use as many grounding vias (especially near to the GND pins) as possible to minimize series parasitic inductance
between the ground pour and the GND pins.
3.
Avoid using long and/or thin transmission lines to connect the components.
Place C3 and C4 as close to the CMT221xB/LB as possible for better filtering.
Place the crystal as close to the CMT221xB/LB as possible, the metal case of crystal needs grounding.
The table below shows the BOM of typical application.
Rev 0.8 | Page 9/25
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CMT2210/17LB
CMT2217B
Table 8. BOM of CMT221xB/LB Typical Application
Value (Matched to λ/4 ANT)
Designator
Descriptions
315 MHz
433.92 MHz
868 MHz
Unit
Manufacturer
-
CMOSTEK
915 MHz
CMT221xB/LB, 300 – 920
U1
MHz OOK stand-alone RF
-
receiver
X1
L1
L2
±20 ppm, SMD32*25 mm,
26.2736
27.1383
27.1341
28.6034
MHz
EPSON
68
36
12
10
nH
Murata LQG18
62
36
8.2
8.2
nH
Murata LQG18
3
NP
NP
pF
Murata GRM15
10
7.5
7.5
crystal, 15 pF Loadcap
±5%, 0603 multi-layer chip
inductor
±5%, 0603 multi-layer chip
inductor
C1
±0.25 pF, 0402 NP0, 50 V
3
C2
±0.25 pF, 0402 NP0, 50 V
12
pF
Murata GRM15
C3
±20%, 0402 X7R, 25 V
0.1
0.1
uF
Murata GRM15
C4
±20%, 0603 NP0, 50 V
1
1
nF
Murata GRM18
R1
Pull up resistor
10
10
kΩ
Rev 0.8 | Page 10/25
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CMT2210/17LB
CMT2217B
4. Functional Descriptions
AGC
I-LMT
I-MXR
GND
Image
Rejection
Band-pass
Filter
LNA
RFIN
Q-MXR
VCO
GND
RSSI
LDOs
CSB
Radio
Controller
SAR
3-wire SPI
AGC
SCL
SDA
Q-LMT
Loop
Filter
LO GEN
VDD
OOK
DEMOD
PFD/CP
FXTAL
DOUT
DIVIDER
EEPROM
GP0
Bandgap
XOSC
POR
XIN
Figure 5. Functional Block Diagram
4.1 Overview
The CMT221xB/LB devices are ultra-low power, high performance, and low cost OOK stand-alone RF receiver for various 300 to
920 MHz wireless applications. It is part of the CMOSTEK NextGenRFTM family, which includes a complete line of transmitters,
receivers and transceivers. The chip is based on fully integrated, low-IF receiver architecture. The low-IF architecture facilitates a
very low external component count and does not suffer from powerline - induced interference problems. The VCO operates at 2x
the Local Oscillator (LO) frequency to reduce spurious emissions. Every analog block is calibrated on each Power-on Reset
(POR) to the internal reference voltage. The calibration helps the device to finely work under different temperatures and supply
voltages. The baseband filtering and demodulation is done by the digital demodulator. The demodulated signal is output to the
external MCU via the DOUT pin. No external MCU control is needed in the applications.
The 3-wire SPI interface is only used for configuring the device. The configuration can be done with the RFPDK and the USB
Programmer. The data rate and other product features are all configurable. This saves the cost and simplifies the design,
development and manufacture. Alternatively, in stock products of 433.92 MHz are available for immediate demands with no need
of EEPROM programming. The CMT221xB/LB operates from 1.8 to 3.6 V so that it can finely work with most batteries to their
useful power limits. The receive current is only 3.8 mA at 433.92 MHz. The CMT221xB/LB receiver together with the CMT211x
transmitter enables an ultra-low cost RF link.
Rev 0.8 | Page 11/25
www.cmostek.com
CMT2210/17LB
CMT2217B
4.2 Modulation, Frequency and Data Rate
The CMT221xB/LB supports OOK demodulation with the data rate from 0.1 to 40 kbps. The CMT2217B/LB covers the frequency
range from 300 to 920 MHz, including the license free ISM frequency band around 315 MHz, 433.92 MHz 868 MHz and 915 MHz,
while the CMT2210LB covers the frequency range from 300 to 480 MHz. See the table below for the demodulation, frequency
and data rate information.
Table 9. Modulation, Frequency and Data Rate
Parameter
Value
Unit
OOK
-
Frequency (CMT2217B/LB)
300 to 920
MHz
Frequency (CMT2210LB
300 to 480
MHz
0.1 to 40
kbps
Demodulation
Data Rate
4.3 Embedded EEPROM and RFPDK
The RFPDK is a PC application developed to help the user to configure the CMOSTEK NextGenRFTM products in the most
intuitional way. The user only needs to connect the USB Programmer between the PC and the device, fill in/select the proper
value of each parameter on the RFPDK, and click the ―Burn‖ button to program the configurations into the device. The
configurations of the device will then remain unchanged until the next programming. No external MCU control is required in the
application program.
The RFPDK also allows the user to save the active configuration into a list by clicking on the ―List‖ button, so that the saved
configuration can be directly reloaded from the list in the future. Furthermore, it supports exporting the configuration into a
hexadecimal file by clicking on the ―Export‖ button. This file can be used to burn the same configuration into a large amount of
devices during the mass production. See the figure below for the accessing of the EEPROM.
CMT221xB/LB
RFPDK
EEPROM
CSB
Interface
SCL
SDA
CMOSTEK USB
Programmer
Figure 6. Accessing Embedded EEPROM
For more details of the CMOSTEK USB Programmer and the RFPDK, please refer to ―AN103 CMT211xA-221xA One-Way RF
Link Development Kits Users Guide‖.
4.4 All Configurable Options
Beside the demodulation, frequency and data rate, more options can be used to customize the device. The following is a table of
all the configurable options. On the RFPDK, the Basic Mode only contains a few options allowing the user to perform easy and
fast configurations. The Advanced Mode shows all the options that allow the user to customize the device in a deeper level.
Rev 0.8 | Page 12/25
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CMT2210/17LB
CMT2217B
Table 10. Configurable Parameters in RFPDK
Category
Parameters
Frequency (CMT2210LB)
Descriptions
The receive radio frequency, the range is from 300 to
Default
433.920 MHz
920 MHz, with resolution of 0.001 MHz. The Xtal Freq.
Frequency (CMT2217B/LB)
RF
will be calculated based on this parameter.
868 MHz
Xtal Freq. (CMT2210LB)
The crystal frequency required for the receive radio
27.1383 MHz
Xtal Freq. (CMT2217B/LB)
frequency.
27.1341 MHz
Demodulation
Settings
Data Rate
Tx Freq. Offset
Rx Xtal Tol.
AGC
Chip Default State
Sleep Timer
Sleep Time
Rx Timer
Rx Time
The demodulation type, only OOK demodulation is
supported in this product.
The receiver data rate, the range is from 0.1 to 40 kbps,
with resolution of 0.1 kbps.
The frequency offset on the Tx side, this is used to
calculate the required Rx Bandwidth
Crystal frequency tolerance, this is used to calculate
the required Rx Bandwidth
Automatic Gain Control, the options are: on or off.
The default state of the chip after power-up, the options
are Duty-Cycle and Always Rx.
Turning on and off the sleep timer, when it is turned on,
the sleep current is 440 nA in sleep state
The sleep time in duty-cycle receive mode, the range is
from 3 to 134,152,192 ms.
Turning on and off the Rx timer
The receive time in duty-cycle receive mode, the range
is from 0.04 to 2,683,043.00 ms.
OOK
2.4 kbps
± 75 kHz
± 20 ppm
On
Always Rx
off
3 ms
off
2,000 ms
The extended receive time in duty-cycle receive mode,
Rx Time Ext
the range is from 0.04 to 2,683,043.00 ms. It is only
200.00 ms
available when WOR is on.
This defines the state to which the device will switch
State after Rx Exit
after the Rx Early Exit. The options are: STBY or
STBY
TUNE.
Operation
Settings
Wake-On Radio
Turn on/off the wake-on radio function, the options are:
on or off.
Off
The condition to wake on the radio, the options are:
1. Extended by RSSI,
2. Extended by Preamble,
3. Extended by Ext-Code
Wake-On Condition
4. Switched to Rx Ext by RSSI,
5. Switched to Rx Ext by Preamble,
Extended by
Preamble
6. Switched to Rx Ext by Ext-Code,
It is only available when Wake-On Radio is turned on.
When the Rx Duty-Cycle is turned on, only type 4, 5
and 6 can be used.
Extended Code for the WOR, it only available when
Ext-Code
Wake-On Condition is set to type 3 or 6. The range is
0
from 0 to 255.
Rev 0.8 | Page 13/25
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CMT2210/17LB
CMT2217B
Category
Parameters
Descriptions
Default
The size of the valid preamble, the range is from1 to 4
Preamble
byte(s). When setting to 0 means detected by the
1
receiver.
System Clock Output
Turn on/off the system clock output on CLKO, the
(CMT2217B only)
options are: on or off.
System Clock Frequency
(CMT2217B only)
The system clock output frequency, the options are: the
FXTAL divided by 2 to by 64. It is only available when
To select the function of the GPO pin, the options are:
only)
Rx Active, System Clock, Data Clock or LBD
only)
6.785 MHz
System Clock Output is on.
GPO Config (CMT2217B
GPO Invert (CMT2217B
Off
The option to invert the state of the GPO pin
Rx Active
Off
The Rx Bandwidth setting, ranging from 50 kHz to 330
Bandwidth Options | Real
kHz, the user can also select Auto-Select to allow the
BW
device select the bandwidth based on the RF settings.
Auto-Select
The real bandwidth will be displayed as Read BW.
To enable the auto squelch function. When it is
OOK
Settings
enabled, the device will calculate the noise floor level
Auto Squelch Enable
automatically and configure the squelch threshold
Off
according to the noise floor level and the Auto Squelch
value being set.
Auto Squelch
This set the squelch level above the calculated noise
floor level, when the Auto Squelch function is enabled.
40
4.5 Internal Blocks Description
4.5.1 RF Front-end and AGC
The CMT221xB/LB features a low-IF receiver. The RF front-end of the receiver consists of a Low Noise Amplifier (LNA), I/Q mixer
and a wide-band power detector. Only a low-cost inductor and a capacitor are required for matching the LNA to any common
used antennas. The input RF signal induced on the antenna is amplified and down-converted to the IF frequency for further
processing.
By means of the wide-band power detector and the attenuation networks built around the LNA, the Automatic Gain Control (AGC)
loop regulates the RF front-end’s gain to get the best system linearity, selectivity and sensitivity performance, even though the
receiver suffers from strong out-of-band interference.
4.5.2 IF Filter
The signals coming from the RF front-end are filtered by the fully integrated 3rd-order band-pass image rejection IF filter which
achieves over 30 dB image rejection ratio typically. The IF center frequency is dynamically adjusted to enable the IF filter to
locate to the right frequency band, thus the receiver sensitivity and out-of-band interference attenuation performance are kept
optimal despite the manufacturing process tolerances. The IF bandwidth is automatically computed according to the basic
system parameters input from the RFPDK: Tx Freq. Offset, Rx Xtal Tol., and Data Rate.
Rev 0.8 | Page 14/25
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CMT2210/17LB
CMT2217B
4.5.3 RSSI
The subsequent multistage I/Q Log amplifiers enhance the output signal from IF filter before it is fed for demodulation. Receive
Signal Strength Indicator (RSSI) generators are included in both Log amplifiers which produce DC voltages that are directly
proportional to the input signal level in both of I and Q path. The resulting RSSI is a sum of both these two paths. Extending from
the nominal sensitivity level, the RSSI achieves over 66 dB dynamic range.
The CMT221xB/LB integrates a patented DC-offset cancellation engine. The receiver sensitivity performance benefits a lot from
the novel, fast and accurate DC-offset removal implementation.
4.5.4 SAR ADC
The on-chip 8-bit SAR ADC digitalizes the RSSI for OOK demodulation.
4.5.5 Crystal Oscillator
The CMT221xB/LB uses a 1-pin crystal oscillator circuit with the required crystal load capacitance fully integrated. The
recommended specification for the crystal is ± 20 ppm, ESR (Rm) < 60 Ω, with 15 pF load capacitance, the XTAL frequency can
be obtained when the desired FRF is input on the RFPDK.
For FRF = 315 MHz,
FXTAL = 26.27358 MHz
For FRF = 433.92 MHz,
FXTAL = 27.13827 MHz
For FRF = 868 MHz,
FXTAL = 27.13413 MHz
For FRF = 920 MHz,
FXTAL = 28.60338 MHz
If the RCLK (reference clock) is available in the system, the user can directly use it to drive the CMT221xB/LB by feeding the
clock into the chip via the XIN pin. This further saves the system cost due to the removal of the crystal. A coupling capacitor is
required if the RCLK is used. The recommended peak-to-peak amplitude of the RCLK is 0.3 to 0.7 V on the XIN pin.
4.5.6 Frequency Synthesizer
An integer-N frequency synthesizer is used to generate the LO frequency for the down conversion I/Q mixer. The frequency
synthesizer is fully integrated. Using the reference clock provided by the crystal oscillator or the external clock source, it can
generate any receive frequency between 300 to 920 MHz.
Multiple subsystem calibrations are performed dynamically to ensure the frequency synthesizer operates reliably in any working
conditions.
4.5.7 LPOSC
An internal 1 kHz low power oscillator is integrated in the CMT221xB/LB. It generates a clock to drive the sleep timer to
periodically wake the device from sleep state. The Sleep Time can be configured from 3 to 134,152,192 ms (more than 37 hours)
when the device works in duty-cycle receive mode. Since the frequency of the LPOSC drifts when the temperature and supply
voltage change, it is automatically calibrated during the PUP state, and is periodically calibrated since then. The calibration
scheme allows the LPOSC to maintain its frequency tolerance to less than ±1%.
4.6 Operation Mode
An option ―Chip Default State‖ on the RFPDK allows the user to determine how the device behaves. The device is able to work in
two operation modes, as shown in the figure below.
Rev 0.8 | Page 15/25
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CMT2210/17LB
CMT2217B
PUP
PUP
TUNE
TUNE
RX
RX
Always Rx
SLEEP
Duty-Cycle
Figure 7. Two different operation modes
Power Up (PUP) State
Once the device is powered up, the device will go through the Power Up (PUP) sequence which includes the task of releasing the
Power-On Reset (POR), turning on the crystal and calibrating the internal blocks. The PUP takes about 2.7 ms to finish in the
always receive mode, and about 8.2 ms to finish in the duty-cycle receive mode. This is because that the LPOSC and sleep timer
is turned off in the always receive mode, while it must be turned on and calibrated during the PUP in the duty-cycle receive mode.
The average current of the PUP sequence is about 0.9 mA.
TUNE State
The device is tuned to the desired frequency and ready to receive. It usually takes approximately 300 us to complete the tuning
sequence. The current consumption in this state is about 2 mA.
SLEEP State
In this state, all the internal blocks are powered down except the sleep timer. In Always Rx Mode, the device won’t go to the
SLEEP state. In Duty-Cycle Mode, the sleep time is defined by the option ―Sleep Time‖ on the RFPDK. The sleep current is about
440 nA (with LPOSC and sleep timer turned on) in the Duty-Cycle mode.
RX State
The device receives the incoming signals and outputs the demodulated data from the DOUT pin. In Duty-Cycle mode, the device
only stays in the RX State for a certain amount of time, which is defined by the option ―Rx Time‖ on the RFPDK. The current in this
state is about 3.8 mA.
4.7 Always Rx Mode
If the Always Rx mode is selected, the device will go through the Power Up (PUP) sequence, tune the receive frequency, and
finally stay in the RX state until the device is powered down. The power up sequence, which takes about 2.7 ms to finish, includes
the task of turning on the crystal and calibrating the internal blocks. The device will continuously receive the incoming RF signals
during the RX state and send out the demodulated data on the DOUT pin. The figure below shows the timing characteristics and
current consumption of the device from the PUP to RX.
Rev 0.8 | Page 16/25
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CMT2210/17LB
CMT2217B
Data
(DOUT pin)
3.8 mA
Current
2.0 mA
900 uA
PUP
TUNE
About 2.7 ms
State
RX
about
300 us
Figure 8. Timing and Current Consumption for Always Rx Mode
4.8 Duty-Cycle Receive Mode
If the duty-cycle mode is selected, after the PUP the device will automatically repeat the sequence of TUNE, RX and SLEEP until
the device is powered down. This allows the device to re-tune the synthesizer regularly to adept to the changeable environment
and therefore remain its highest performance. The device will continuously receive any incoming signals during the RX state and
send out the demodulated data on the DOUT pin. The configurable system clock output is output from the CLKO pin during the
TUNE and RX state. The PUP sequence consumes about 8.2 ms which is longer than the 3 ms in the Always Rx Mode. This is
because the LPOSC, which drives the sleep timer, must be calibrated during the PUP.
Data
(DOUT pin)
3.8 mA
Current
3.8 mA
2.0 mA
2.0 mA
900 uA
440 nA
PUP
About 8.2 ms
TUNE
about
300 us
RX
Rx Time
SLEEP
TUNE
Sleep Time
about
300 us
RX
State
Rx Time
Figure 9. Timing and Current Consumption for Duty-Cycle Receive Mode
It is strongly recommended for the user to turn on the duty-cycle receive mode option. The advantages are:
Maintaining the highest performance of the device by regular frequency re-tune.
Increasing the system stability by regular sleep (resetting most of the blocks).
Saving power consumptions of both of the Tx and Rx device.
As long as the Sleep Time and Rx Time are properly configured, the transmitted data can always be captured by the device.
Rev 0.8 | Page 17/25
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CMT2210/17LB
CMT2217B
5. Ordering Information
Table 11. CMT221xB/LB Ordering Information
Part Number
CMT2217B-EQR[1]
CMT2210LB-ESR[1]
CMT2217LB-ESR[1]
Descriptions
300 – 920 MHz OOK
Stand-Alone RF Receiver
300 – 480 MHz OOK
Stand-Alone RF Receiver
300 – 920 MHz OOK
Stand-Alone RF Receiver
Package
Package
Type
Option
QFN16 (3x3)
Tape & Reel
SOP8
Tape & Reel
SOP8
Tape & Reel
Operating
MOQ /
Condition
Multiple
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
5,000
2,500
2,500
Note:
[1]. ―E‖ stands for extended industrial product grade, which supports the temperature range from -40 to +85 ℃.
―Q‖ stands for the package type of QFN16 (3x3), ―S‖ stands for the package type of SOP8.
―R‖ stands for the tape and reel package option, the minimum order quantity (MOQ) is 5,000 pieces for QFN package
type, and 2,500 pieces for SOP8 package type
The default frequency for CMT221xB/LB is 433.920/868 MHz, covering data rate from 1-5 kbps.
Visit www.cmostek.com/products to know more about the product and product line.
Contact sales@cmostek.com or your local sales representatives for more information.
Rev 0.8 | Page 18/25
www.cmostek.com
CMT2210/17LB
CMT2217B
6. Package Outline
6.1 QFN16 Package
The 16-pin QFN 3x3 illustrates the package details for the CMT2217B. The table below lists the values for the dimensions shown
in the illustration.
D
e
L
b
E2
E
D2
16
16
1
1
Bottom View
c
A1
A
Top View
Side View
Figure 10. 16-Pin QFN 3x3 Package
Table 12. 16-Pin QFN 3x3 Package Dimensions
Symbol
Size (millimeters)
Min
Max
A
0.7
0.8
A1
—
0.05
b
0.18
0.30
c
0.18
0.25
D
2.90
3.10
D2
1.55
1.75
e
0.50 BSC
E
2.90
3.10
E2
1.55
1.75
L
0.35
0.45
Rev 0.8 | Page 19/25
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CMT2210/17LB
CMT2217B
6.2 SOP8 Package
The SOP8 illustrates the package details for the CMT2210/17LB. The table below lists the values for the dimensions shown in the
illustration.
D
A3
h
A2 A
0.25
c
A1
θ
L
L1
E1
b
E
e
Figure 11. SOP8 Package
Table 13. SOP8 Package Dimensions
Size (millimeters)
Symbol
Min
Typ
Max
A
-
-
1.75
A1
0.10
-
0.225
A2
1.30
1.40
1.50
A3
0.60
0.65
0.70
b
0.39
-
0.48
c
0.21
-
0.26
D
4.70
4.90
5.10
E
5.80
6.00
6.20
E1
3.70
3.90
4.10
e
1.27 BSC
h
0.25
-
0.50
L
0.50
-
0.80
L1
θ
1.05 BSC
0
-
Rev 0.8 | Page 20/25
8°
www.cmostek.com
CMT2210/17LB
CMT2217B
7. Top Marking
7.1 CMT2217B Top Marking
2 1 7 B
①②③④
Y WW
Figure 12. CMT2217B Top Marking in QFN16 Package
Table 14. CMT2217B QFN16 Top Marking Explanation
Mark Method
Laser
Pin 1 Mark
Circle’s diameter = 0.2 mm
Font Size
0.5 mm, right-justified
Line 1 Marking
217B, represents part number CMT2217B
Line 2 Marking
①②③④ Internal tracking number
Line 3 Marking
Date code assigned by the assembly house. Y represents the last digit of the mold year and
WW represents the workweek
Rev 0.8 | Page 21/25
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CMT2210/17LB
CMT2217B
7.2 CMT2210/17LB Top Marking
CMT2210LB
YYWW ①②③④⑤⑥
CMT2217LB
YYWW ①②③④⑤⑥
Figure 13. CMT2210/17LB Top Marking in SOP8 Package
Table 15. CMT2210/17LB SOP8 Top Marking Explanation
Mark Method
Laser
Pin 1 Mark
Circle’s diameter = 1 mm
Font Height
0.6 mm, right-justified
Font Width
0.4 mm
Line 1 Marking
CMT2210LB, represents part number CMT2210LB
CMT2217LB, represents part number CMT2217LB
YYWW is the Date code assigned by the assembly house. YY represents the last two digits of the
Line 2 Marking
mold year and WW represents the workweek.
①②③④⑤⑥ is the internal tracking number
Rev 0.8 | Page 22/25
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CMT2210/17LB
CMT2217B
8. Other Documentations
Table 16. Other Documentations for CMT221xB/LB
Brief
AN103
AN107
AN110
AN151
Name
Descriptions
CMT211xA-221xA One-Way RF Link
Development Kits Users Guide
User’s Guides for CMT211xA and CMT221xA Development Kits,
including Evaluation Board and Evaluation Module, CMOSTEK
USB Programmer and RFPDK.
CMT221x Schematic and PCB Layout
Design Guideline
Details of CMT2210/13/17/19A and CMT2210L PCB schematic
and layout design rules, RF matching network and other
application layout design related issues.
CMT221x-5x 原理图及 PCB 版图设计指
南
Details of CMT221x and CMT2210Lx PCB schematic and layout
design rules, RF matching network and other application layout
design related issues, Chinese Version.
CMT2210B-LA Configuration Guideline
Details of the CMT221xB/LB configurations
Rev 0.8 | Page 23/25
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CMT2210/17LB
CMT2217B
9. Document Change List
Table 17. Document Change List
Rev. No.
Chapter
0.8
All
Description of Changes
Initial released version
Rev 0.8 | Page 24/25
Date
2017-4-21
www.cmostek.com
CMT2210/17LB
CMT2217B
10. Contact Information
CMOSTEK Microelectronics Co., Ltd.
Room 203, Honghai Building, Qianhai Road. Nanshan District
Shenzhen, Guangdong, China PRC
Zip Code:
518000
Tel:
0755 - 83235017
Fax:
0755 - 82761326
Sales:
sales@cmostek.com
Technical support: support@cmostek.com
Website:
www.cmostek.com
Copyright. CMOSTEK Microelectronics Co., Ltd. All rights are reserved.
The information furnished by CMOSTEK is believed to be accurate and reliable. However, no responsibility is assumed for
inaccuracies and specifications within this document are subject to change without notice. The material contained herein is
the exclusive property of CMOSTEK and shall not be distributed, reproduced, or disclosed in whole or in part without prior
written permission of CMOSTEK. CMOSTEK products are not authorized for use as critical components in life support
devices or systems without express written approval of CMOSTEK. The CMOSTEK logo is a registered trademark of
CMOSTEK Microelectronics Co., Ltd. All other names are the property of their respective owners.
Rev 0.8 | Page 25/25
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