DFP252012TF-R24M

P1 TAI-TECH Power Inductor DFP252012TF-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 16/07/26 新 發 行 楊祥忠 詹偉特 孔妍暄 備 註 www.tai-tech.com.tw P2 TAI-TECH Power Inductor DFP252012TF-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free B A D E D C Series A(mm) B(mm) C(mm) D(mm) E(mm) DFP252012TF 2.5 -0.1/+0.2 2.0 -0.05/+0.35 1.2Max 0.85 ref. 0.80 ref. Units: mm 3. Part Numbering DFP 252012 TF A B - R47 M D E C A: Series B: Dimension C: Lead Free Material D: Inductance E: Inductance Tolerance R47=0.47uH M=±20% 4. Specification TAI-TECH Part Number Inductance Tolerance (uH) (%) Test Frequency (Hz) DCR (Ω) typ. DCR (Ω) Max. I sat (A) typ. I sat (A) Max. I rms (A) typ I rms (A) max 0.1V/1M 0.024 0.028 8.00 6.50 4.70 4.20 DFP252012TF-R24M 0.24 ±20% DFP252012TF-R33M 0.33 ±20% 0.1V/1M 0.027 0.032 5.70 4.60 4.50 4.00 DFP252012TF-R47M 0.47 ±20% 0.1V/1M 0.027 0.032 5.50 4.50 4.40 3.90 DFP252012TF-R68M 0.68 ±20% 0.1V/1M 0.036 0.043 4.50 3.80 3.60 3.20 DFP252012TF-1R0M 1.0 ±20% 0.1V/1M 0.045 0.057 3.90 3.40 3.50 3.15 DFP252012TF-1R5M 1.5 ±20% 0.1V/1M 0.080 0.096 3.00 2.60 2.50 2.25 DFP252012TF-2R2M 2.2 ±20% 0.1V/1M 0.085 0.102 2.70 2.30 2.30 2.00 Note: Isat：Based on inductance change （△L/L0：≦30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃.）Max www.tai-tech.com.tw P3 TAI-TECH DFP252012TF-R24 DFP252012TF-R33 0.4 0.5 0.4 Inductance(uH) Inductance(uH) 0.3 0.2 0.3 0.2 0.1 0.1 0 0 2 4 6 0 8 0 DCcurrent(A) 2 4 6 8 DCcurrent(A) DFP252012TF-R68 DFP252012TF-R47 1 0.8 0.8 Inductance(uH) Inductance(uH) 0.6 0.4 0.2 0.6 0.4 0.2 0 0 0 2 4 6 0 8 1 2 3 4 5 2.4 3 DCcurrent(A) DCcurrent(A) DFP252012TF-1R5 DFP252012TF-1R0 2.5 2 2 Inductance(uH) Inductance(uH) 1.5 1 1.5 1 0.5 0.5 0 0 1 2 3 0 4 0 DCcurrent(A) DFP252012TF-2R2 Inductance(uH) 3 2 1 0 0.5 1 1.2 1.8 DCcurrent(A) 4 0 0.6 1.5 2 2.5 DCcurrent(A) www.tai-tech.com.tw P4 TAI-TECH 5. Material List No. Description Specification a. Core Ferrite Core b. Glue Epoxy with magnetic powder c Termination Tin (Pb Free) d Wire Enameled Copper Wire Appearance of exposed wire tolerance limit: 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. www.tai-tech.com.tw P5 TAI-TECH 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test HP4284A,CH11025,CH3302,CH1320,CH1320S Inductance Refer to standard electrical characteristics list. DCR LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation DC Current (Isat) will cause L0 Saturation Current (Isat) △L≦30% typical. to drop △L(%)(keep quickly). Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. Heat Rated Current (Irms) Approximately △T≦40℃ 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃ Life Test Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Load Humidity Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Moisture Resistance Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Thermal shock Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 www.tai-tech.com.tw P6 TAI-TECH Item Performance Shock Appearance：No damage. Test Condition Type Peak value (g＇s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 Inductance：within±10% of initial value Q：Shall not exceed the specification value. Bending Soderability RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,